公开(公告)号：US20080060181A1

公开(公告)日：2008-03-13

申请号：US11938078

申请日：2007-11-09

申请人： Ronald Fazzio ,  Richard Ruby

发明人： Ronald Fazzio ,  Richard Ruby

IPC分类号： H01L41/22 ,  B05D1/32 ,  H04R17/00

CPC分类号： H03H9/132 ,  H03H9/02149 ,  H03H9/13 ,  H03H9/173 ,  H03H9/175 ,  Y10T29/42 ,  Y10T29/49005 ,  Y10T29/49155

摘要： An acoustic resonator that includes a substrate, a first electrode, a layer of piezoelectric material, a second electrode, and a fill region. The first electrode is adjacent the substrate, and the first electrode has an outer perimeter. The piezoelectric layer is adjacent the first electrode. The second electrode is adjacent the piezoelectric layer and the second electrode has an outer perimeter. The fill region is in one of the first and second electrodes.

摘要翻译： 声谐振器，其包括基板，第一电极，压电材料层，第二电极和填充区域。 第一电极与衬底相邻，并且第一电极具有外周边。 压电层与第一电极相邻。 第二电极邻近压电层，第二电极具有外周。 填充区域位于第一和第二电极之一中。

公开(公告)号：US20060226932A1

公开(公告)日：2006-10-12

申请号：US11100311

申请日：2005-04-06

申请人： Ronald Fazzio ,  Richard Ruby

发明人： Ronald Fazzio ,  Richard Ruby

IPC分类号： H03H9/54

CPC分类号： H03H9/132 ,  H03H9/02149 ,  H03H9/13 ,  H03H9/173 ,  H03H9/175 ,  Y10T29/42 ,  Y10T29/49005 ,  Y10T29/49155

摘要： An acoustic resonator that includes a substrate, a first electrode, a layer of piezoelectric material, a second electrode, and a fill region. The first electrode is adjacent the substrate, and the first electrode has an outer perimeter. The piezoelectric layer is adjacent the first electrode. The second electrode is adjacent the piezoelectric layer and the second electrode has an outer perimeter. The fill region is in one of the first and second electrodes.

摘要翻译： 声谐振器，其包括基板，第一电极，压电材料层，第二电极和填充区域。 第一电极与衬底相邻，并且第一电极具有外周边。 压电层与第一电极相邻。 第二电极邻近压电层，第二电极具有外周。 填充区域位于第一和第二电极之一中。

公开(公告)号：US20060125084A1

公开(公告)日：2006-06-15

申请号：US11012574

申请日：2004-12-15

申请人： Ronald Fazzio ,  Thomas Dungan

发明人： Ronald Fazzio ,  Thomas Dungan

IPC分类号： H01L21/50 ,  H01L23/12

CPC分类号： B81C1/00238 ,  H01L2924/0002 ,  H01L2924/00

摘要： A single integrated wafer package includes a micro-electro mechanical system (MEMS) wafer, an active device wafer, and a seal ring. The MEMS wafer has a first surface and includes at least one MEMS component on its first surface. The active device wafer has a first surface and includes an active device circuit on its first surface. The seal ring is adjacent the first surface of the MEMS wafer such that a seal is formed about the MEMS component. An external contact is provided on the wafer package. The external contact is accessible externally to the wafer package and is electrically coupled to the MEMS device or active device circuit of the active device wafer.

摘要翻译： 单个集成晶片封装包括微机电系统（MEMS）晶片，有源器件晶片和密封环。 MEMS晶片具有第一表面并且在其第一表面上包括至少一个MEMS部件。 有源器件晶片具有第一表面并且在其第一表面上包括有源器件电路。 密封环与MEMS晶片的第一表面相邻，使得围绕MEMS部件形成密封。 在晶片封装上提供外部触点。 外部接触件可从晶片封装的外部访问并且电耦合到有源器件晶片的MEMS器件或有源器件电路。

公开(公告)号：US20050142692A1

公开(公告)日：2005-06-30

申请号：US11071550

申请日：2005-03-02

申请人： Kendra Gallup ,  Frank Geefay ,  Ronald Fazzio ,  Martha Johnson ,  Carrie Guthrie ,  Tanya Snyder ,  Richard Ruby

发明人： Kendra Gallup ,  Frank Geefay ,  Ronald Fazzio ,  Martha Johnson ,  Carrie Guthrie ,  Tanya Snyder ,  Richard Ruby

IPC分类号： H01L23/02 ,  B81B7/00 ,  B81C3/00 ,  G02B6/42 ,  H01L21/00 ,  H01L21/46 ,  H01L21/60 ,  H01L23/495 ,  H01L31/0203 ,  H01L31/0232 ,  H01L33/00 ,  H01S5/00 ,  H01S5/02 ,  H01S5/022 ,  H01S5/026

CPC分类号： H01S5/02288 ,  G02B6/4206 ,  H01L2924/0002 ,  H01S5/02248 ,  H01S5/02292 ,  H01L2924/00

摘要： A wafer-level package includes a first wafer comprising a bonding pad, an optoelectronic device on the first wafer, and a second wafer comprising a gasket. The second wafer is attached to the first wafer by a bond between the gasket and the bonding pad.

公开(公告)号：US20050062122A1

公开(公告)日：2005-03-24

申请号：US10666363

申请日：2003-09-19

申请人： Kendra Gallup ,  Frank Geefay ,  Ronald Fazzio ,  Martha Johnson ,  Carrie Guthrie ,  Tanya Snyder ,  Richard Ruby

发明人： Kendra Gallup ,  Frank Geefay ,  Ronald Fazzio ,  Martha Johnson ,  Carrie Guthrie ,  Tanya Snyder ,  Richard Ruby

IPC分类号： H01L23/02 ,  B81B7/00 ,  B81C3/00 ,  G02B6/42 ,  H01L21/00 ,  H01L21/46 ,  H01L21/60 ,  H01L23/495 ,  H01L31/0203 ,  H01L31/0232 ,  H01L33/00 ,  H01S5/00 ,  H01S5/02 ,  H01S5/022 ,  H01S5/026

CPC分类号： H01S5/02288 ,  G02B6/4206 ,  H01L2924/0002 ,  H01S5/02248 ,  H01S5/02292 ,  H01L2924/00

摘要： A wafer-level package includes a first wafer comprising a bonding pad, an optoelectronic device on the first wafer, and a second wafer comprising a gasket. The second wafer is attached to the first wafer by a bond between the gasket and the bonding pad.