公开(公告)号：US08940621B2

公开(公告)日：2015-01-27

申请号：US13531983

申请日：2012-06-25

Applicant: Sang-Uk Han ,  Jeong-Kyu Ha ,  Youngshin Kwon ,  Seung Hwan Kim ,  KwanJai Lee

Inventor： Sang-Uk Han ,  Jeong-Kyu Ha ,  Youngshin Kwon ,  Seung Hwan Kim ,  KwanJai Lee

IPC: H01L21/00 ,  H01L21/56 ,  H01L23/00 ,  H01L21/683

CPC classification number: H01L21/56 ,  H01L21/561 ,  H01L21/6835 ,  H01L24/13 ,  H01L24/81 ,  H01L2221/68327 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/81001 ,  H01L2924/15788 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Provided are methods of forming semiconductor modules. The method includes forming a high polymer material layer having an adhesive property on a support substrate, adhering a semiconductor chip to the support substrate using the high polymer material layer, bonding the semiconductor chip adhered to the support substrate to a flexible panel, and removing the support substrate.

Abstract translation: 提供了形成半导体模块的方法。 该方法包括在支撑基板上形成具有粘合性的高分子材料层，使用高分子材料层将半导体芯片粘合到支撑基板上，将附着在支撑基板上的半导体芯片接合到柔性面板上， 支撑基板。

公开(公告)号：US08222089B2

公开(公告)日：2012-07-17

申请号：US13033307

申请日：2011-02-23

Applicant: Kyoung-sei Choi ,  Byung-seo Kim ,  Young-jae Joo ,  Ye-chung Chung ,  Kyong-soon Cho ,  Sang-heui Lee ,  Si-hoon Lee ,  Sa-yoon Kang ,  Dae-woo Son ,  Sang-gui Jo ,  Jeong-kyu Ha ,  Young-sang Cho

Inventor： Kyoung-sei Choi ,  Byung-seo Kim ,  Young-jae Joo ,  Ye-chung Chung ,  Kyong-soon Cho ,  Sang-heui Lee ,  Si-hoon Lee ,  Sa-yoon Kang ,  Dae-woo Son ,  Sang-gui Jo ,  Jeong-kyu Ha ,  Young-sang Cho

IPC: H01J9/00

CPC classification number: H01L23/49838 ,  H01L23/4985 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/01079 ,  H05K1/0203 ,  H05K1/189 ,  H05K2201/09109 ,  H05K2201/1028 ,  H05K2201/10674 ,  H05K2203/1581 ,  H01L2924/00

Abstract: Disclosed is a chip-on-film (COF) type semiconductor package and a device using the same. The COF type semiconductor package may include an insulation substrate including a top surface and bottom surface, a semiconductor device on the top surface of the insulation substrate, a heat dissipating component on the bottom surface of the insulation substrate, and at least one space between the bottom surface of the insulation substrate and a top surface of the heat dissipating component.

Abstract translation: 公开了一种片上胶片（COF）型半导体封装以及使用其的器件。 COF型半导体封装可以包括包括顶表面和底表面的绝缘衬底，绝缘衬底的顶表面上的半导体器件，绝缘衬底的底表面上的散热部件，以及绝缘衬底的至少一个空间 绝缘基板的底表面和散热部件的顶表面。

公开(公告)号：US20160218065A1

公开(公告)日：2016-07-28

申请号：US15004176

申请日：2016-01-22

Applicant: JEONG-KYU HA

Inventor： JEONG-KYU HA

IPC: H01L23/544 ,  H01L23/13 ,  H01L23/498

CPC classification number: H01L23/4985 ,  H01L23/49866 ,  H01L2224/16225 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor package includes a flexible film substrate including a chip mounting region and a cut-line interposed between an inner region and an outer region of the flexible film substrate, the cut-line partially surrounding the inner region. The semiconductor package further includes first interconnection lines extending in the inner region from a first side of the chip mounting region towards an edge of the inner region of the flexible film substrate, and second interconnection lines extending in the outer region from a second side of the chip mounting region towards an edge of the outer region of the flexible film substrate. The edge of the inner region and the edge of the outer region are located on the first side of the semiconductor chip.

Abstract translation: 半导体封装包括柔性膜基板，该柔性膜基板包括芯片安装区域和插入在柔性膜基板的内部区域和外部区域之间的切割线，该切割线部分地围绕内部区域。 所述半导体封装还包括在所述内部区域中从所述芯片安装区域的第一侧朝向所述柔性膜基板的内部区域的边缘延伸的第一互连线，以及在所述外部区域中从所述第二侧延伸到所述第二互连线 芯片安装区域朝向柔性膜基板的外部区域的边缘。 内部区域的边缘和外部区域的边缘位于半导体芯片的第一侧。

公开(公告)号：US20120021600A1

公开(公告)日：2012-01-26

申请号：US13184810

申请日：2011-07-18

Applicant: Sang-Uk Han ,  Dae-Woo Son ,  Kwan-Jai Lee ,  Ye-Chung Chung ,  Jeong-Kyu Ha ,  Yun-Young Kim

Inventor： Sang-Uk Han ,  Dae-Woo Son ,  Kwan-Jai Lee ,  Ye-Chung Chung ,  Jeong-Kyu Ha ,  Yun-Young Kim

IPC: H01L21/283

CPC classification number: H01L23/4985 ,  H01L23/49811 ,  H01L23/49838 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method of fabricating a film circuit substrate and a method of fabricating a chip package. The method of fabricating a film circuit substrate can include providing a base film including a chip packaging area to package a chip and a separation area to separate the two chip packaging areas from each other, the separation area including a cut area and an uncut area; forming a reserve interconnection pattern having a first height on the base film; and forming an interconnection pattern having a second height that is lower than the first height on the out area by selectively etching the reserve interconnection pattern of the cut area.

Abstract translation: 薄膜电路基板的制造方法以及芯片封装的制造方法。 制造薄膜电路基板的方法可以包括提供包括芯片封装区域以包装芯片的基膜和分离区域，以将两个芯片封装区域彼此分离，分离区域包括切割区域和未切割区域; 在基膜上形成具有第一高度的保留互连图案; 以及通过选择性地蚀刻所述切割区域的预留互连图案，形成具有低于所述外部区域上的所述第一高度的第二高度的互连图案。