公开(公告)号：US12259664B2

公开(公告)日：2025-03-25

申请号：US17640899

申请日：2020-08-17

Applicant: ASML NETHERLANDS B.V.

Inventor： Jigang Ma ,  Hua Li

IPC: H01L23/544 ,  G03F9/00

Abstract: A method of configuring a mark having a trench to be etched into a substrate, the method including: obtaining a relation between an extent of height variation across a surface of a probationary layer deposited on a probationary trench of a probationary depth and a thickness of the probationary layer; determining an extent of height variation across the surface of a layer deposited on the mark allowing a metrology system to determine a position of the mark; and configuring the mark by determining a depth of the trench based on the relation, the extent of height variation and the thickness of a process layer to be deposited on the mark.

公开(公告)号：US12259546B2

公开(公告)日：2025-03-25

申请号：US17634023

申请日：2020-08-05

Applicant: ASML NETHERLANDS B.V. ,  IMEC v.z.w.

Inventor： Alexandre Halbach ,  Nitesh Pandey ,  Sebastianus Adrianus Goorden ,  Veronique Rochus ,  Luc Roger Simonne Haspeslagh ,  Guilherme Brondani Torri

IPC: G02B26/08 ,  B81B3/00 ,  B81B7/00 ,  G03F7/00

Abstract: A micromirror array includes a substrate, a plurality of mirrors for reflecting incident radiation, and for each mirror of the plurality of mirrors, a respective post connecting the substrate to the respective mirror. The micromirror array further includes, for each mirror of the plurality of mirrors, one or more electrostatic actuators connected to the substrate for applying force to the respective post to displace the respective post relative to the substrate, thereby displacing the respective mirror. Also disclosed is a method of forming such a micromirror array. The micromirror array may be used in a programmable illuminator. The programmable illuminator may be used in a lithographic apparatus and/or in an inspection apparatus.

公开(公告)号：US12247883B2

公开(公告)日：2025-03-11

申请号：US18048119

申请日：2022-10-20

Applicant: ASML Netherlands B.V.

Inventor： Engelbertus Antonius Fransiscus Van Der Pasch ,  Suzanne Johanna Antonetta Geertruda Cosijns ,  Koen Govert Olivier Van De Meerakker ,  Ivo Widdershoven

IPC: G01J9/02 ,  G01B9/02001 ,  G01B9/02002 ,  G01B9/02015 ,  G01B11/00 ,  G03F7/00

Abstract: The invention provides a wavelength tracking system comprising a wavelength tracking unit and an interferometer system. The wavelength tracking unit has reflection surfaces at stabile positions providing a first reflection path with a first path length and a second reflection path with a second path length. The first path length is substantially larger than the second path length. The interferometer system comprises: a beam splitter to split a light beam in a first measurement beam and a second measurement beam; at least one optic element to guide the first measurement beam, at least partially, along the first reflection path and the second measurement beam, at least partially, along the second reflection path; a first light sensor arranged at an end of the first reflection path to receive the first measurement beam and to provide a first sensor signal on the basis of the first measurement beam; a second light sensor arranged at an end of the second reflection path to receive the second measurement beam and to provide a second sensor signal on the basis of the second measurement beam; and a processing unit to determine a wavelength or change in wavelength on the basis of the first sensor signal and the second sensor signal.

公开(公告)号：US12245350B2

公开(公告)日：2025-03-04

申请号：US18075589

申请日：2022-12-06

Applicant: ASML Netherlands B.V.

Inventor： Yezheng Tao ,  Daniel John William Brown ,  Alexander Anthony Schafgans ,  Palash Parijat Das

IPC: H05G2/00 ,  H01S3/00 ,  H01S3/223 ,  H01S3/23

Abstract: An optical source for a photolithography tool includes a source configured to emit a first beam of light and a second beam of light, the first beam of light having a first wavelength, and the second beam of light having a second wavelength, the first and second wavelengths being different; an amplifier configured to amplify the first beam of light and the second beam of light to produce, respectively, a first amplified light beam and a second amplified light beam; and an optical isolator between the source and the amplifier, the optical isolator including: a plurality of dichroic optical elements, and an optical modulator between two of the dichroic optical elements.

公开(公告)号：US12243709B2

公开(公告)日：2025-03-04

申请号：US17373766

申请日：2021-07-12

Applicant: ASML Netherlands B.V.

Inventor： Weiming Ren ,  Xuedong Liu ,  Xuerang Hu ,  Zhong-Wei Chen

IPC: H01J37/145

Abstract: The present disclosure proposes an anti-rotation lens and using it as an anti-rotation condenser lens in a multi-beam apparatus with a pre-beamlet-forming mechanism. The anti-rotation condenser lens keeps rotation angles of beamlets unchanged when changing currents thereof, and thereby enabling the pre-beamlet-forming mechanism to cut off electrons not in use as much as possible. In this way, the multi-beam apparatus can observe a sample with high resolution and high throughput, and is competent as a yield management tool to inspect and/or review defects on wafers/masks in semiconductor manufacturing industry.

公开(公告)号：US12242204B2

公开(公告)日：2025-03-04

申请号：US17775361

申请日：2020-10-16

Applicant: ASML NETHERLANDS B.V.

Inventor： Ruud Antonius Catharina Maria Beerens ,  Koen Gerhardus Winkels ,  Dirk Willem Harberts ,  Lucas Henricus Johannes Stevens ,  Dennis Dominic Van Der Voort ,  Edwin Johannes Cornelis Bos ,  George Alois Leonie Leenknegt ,  Nicolaas Ten Kate

IPC: G03F7/20 ,  G03F7/00 ,  H01L21/67 ,  H01L21/687

Abstract: A substrate support configured to support a substrate. The substrate support has a plurality of burls protruding from a base surface of the substrate support. The burls have distal ends for supporting a lower surface of the substrate with a gap between the base surface of the substrate support and the lower surface of the substrate. The substrate support has a liquid supply channel configured to supply a conductive liquid to the gap so as to bridge the gap between the base surface of the substrate support and the lower surface of the substrate, to allow charge to pass between the substrate support and the substrate. The substrate support has a controlled electrical potential such that charge distribution at the lower surface of the substrate can be manipulated.

公开(公告)号：US12242201B2

公开(公告)日：2025-03-04

申请号：US17276533

申请日：2019-09-20

Applicant: ASML NETHERLANDS B.V.

Inventor： Youping Zhang ,  Weixuan Hu ,  Fei Yan ,  Wei Peng ,  Vivek Kumar Jain

IPC: G03F7/00

Abstract: A method of hot spot ranking for a patterning process. The method includes obtaining (i) a set of hot spots of a patterning process, (ii) measured values of one or more parameters of the patterning process corresponding to the set of hot spots, and (ii) simulated values of the one or more parameters of the patterning process corresponding to the set of hot spots; determining a measurement feedback based on the measured values and the simulated values of the one or more parameters of the patterning process; and determining, via simulation of a process model of the patterning process, a ranking of a hot spot within the set of hot spots based on the measurement feedback.

公开(公告)号：US12235096B2

公开(公告)日：2025-02-25

申请号：US18486811

申请日：2023-10-13

Applicant: ASML Netherlands B.V.

Inventor： Henricus Petrus Maria Pellemans ,  Arie Jeffrey Den Boef

IPC: G01B11/24 ,  G03F7/00

Abstract: A scatterometer for measuring a property of a target on a substrate includes a radiation source, a detector, and a processor. The radiation source produces a radiated spot on the target. The scatterometer adjusts a position of the radiated spot along a first direction across the target and along a second direction that is at an angle with respect to the first direction. The detector receives radiation scattered by the target. The received radiation is associated with positions of the radiated spot on the target along at least the first direction. The detector generates measurement signals based on the positions of the radiated spot on the target. The processor outputs, based on the measurement signals, a single value that is representative of the property of the target. The processor also combines the measurement signals to output a combined signal and derives, based on the combined signal, the single value.

公开(公告)号：US20250060682A1

公开(公告)日：2025-02-20

申请号：US18724144

申请日：2022-11-22

Applicant: ASML Netherlands B.V.

Inventor： Armin Bernhard RIDINGER ,  Muchen XU

IPC: G03F7/00

Abstract: A lithographic apparatus includes an illumination system to illuminate a pattern of a patterning device and a projection system to project an image of the pattern onto a substrate. The illumination system includes a first and second enclosures, a scaling device, and a protective device. The first enclosure encloses a first environment and includes a first opening and first connection corresponding to the first opening. The second enclosure includes a second connection structure to couple to the first connection structure to prevent mixing of substances between the first environment and a second environment outside of the first and second enclosures. The sealing device is disposed between the first and second connection structures. The material of the sealing device is chemically reactive to the first environment. The protective device is disposed on the sealing device proximal to the first environment to shield the sealing device from the first environment.

公开(公告)号：US20250060680A1

公开(公告)日：2025-02-20

申请号：US18721405

申请日：2022-12-14

Applicant: ASML NETHERLANDS B.V.

Inventor： Aabid PATEL ,  Joshua ADAMS ,  Lisa DIXON ,  Igor Matheus Petronella AARTS

IPC: G03F7/00 ,  G01B11/27

Abstract: Generating an alignment signal for alignment of features in a layer of a substrate as part of a semiconductor manufacturing process is described. The present systems and methods can be faster and/or generate more information than typical methods for generating alignment signals because they utilize one or more existing structures in a patterned semiconductor wafer instead of a dedicated alignment structure. A feature (not a dedicated alignment mark) of the patterned semiconductor wafer is continuously scanned, where the scanning includes: continuously irradiating the feature with radiation; and continuously detecting reflected radiation from the feature. The scanning is performed perpendicular to the feature, along one side of the feature, or along both sides of the feature.