公开(公告)号：US20040003891A1

公开(公告)日：2004-01-08

申请号：US10189883

申请日：2002-07-02

Applicant: ASM Assembly Automation Ltd.

Inventor： Chi Wah Cheng ,  Kin Yik Hung ,  Ping Chun (Benson) Chong ,  See Lok Chan

IPC: B32B031/00

CPC classification number: B23K3/0623 ,  B23K2101/40 ,  H05K3/3436 ,  H05K3/3489 ,  Y10T156/1089 ,  Y10T156/1707 ,  Y10T156/1798

Abstract: The invention provides an apparatus and method for the application of adhesive substances to objects, such as solder balls, for the purpose of mounting them onto substrates. The apparatus comprises an applicator having a layer of the adhesive substance and a pick carrier to carry objects and move the objects from a supply source to a substrate for mounting the objects thereon. The applicator is located so that the applicator applies the adhesive substance to the objects while the objects carried on the pick carrier are moving between the supply source and the substrate.

Abstract translation: 本发明提供了一种用于将粘合剂物质应用于诸如焊球的物体的装置和方法，用于将它们安装到基底上。 该装置包括具有粘合剂物质层的拾取器和用于携带物体并将物体从供应源移动到基板以将物体安装在其上的拾取托架。 涂抹器的位置使得涂抹器将粘合剂施加到物体上，同时携带在拾取载体上的物体在供给源和基底之间移动。

公开(公告)号：US20030200987A1

公开(公告)日：2003-10-30

申请号：US10413602

申请日：2003-04-14

Applicant: ASM Assembly Automation Ltd

Inventor： Yiu Ming Cheung ,  Chak Tong Albert Sze

IPC: C25F001/00

CPC classification number: H01L21/67092 ,  B08B3/024 ,  B08B2203/0288 ,  H01L21/67051

Abstract: The invention provides an ultrasonic cleaning module and a method for cleaning singulated electronic packages. The module comprises a cutting chuck having a surface with a plurality of cutting recesses defined in it for enabling a cutting device to separate individual electronic packages from a substrate having a plurality of electronic packages on the surface of the chuck. A pulsator nozzle is supported above the chuck and the separated electronic packages on the chuck such that the pulsator nozzle may emit fluid toward the packages. An ultrasonic generator is associated with the nozzle that is adapted to ultrasonically energize fluid that passes through the nozzle to enhance cleaning of the packages.

Abstract translation: 本发明提供了一种超声波清洗模块和清洁单个电子封装的方法。 模块包括具有限定在其中的多个切割凹部的表面的切割卡盘，用于使得切割装置能够在卡盘的表面上具有多个电子封装的基板上分离各个电子封装。 波轮喷嘴支撑在卡盘上方和卡盘上分离的电子包装件上，使得波轮喷嘴可朝向包装发射流体。 超声波发生器与喷嘴相关联，该喷嘴适于对通过喷嘴的流体进行超声波激励以增强包装的清洁。

公开(公告)号：US20030084642A1

公开(公告)日：2003-05-08

申请号：US10041426

申请日：2001-11-07

Applicant: ASM Assembly Automation Ltd.

Inventor： Yiu Ming Cheung ,  Hoi Fung Tsang ,  Yui Ko Wong

IPC: B65B005/04

CPC classification number: H01L21/67271 ,  H01L21/67796

Abstract: The invention relates to an apparatus for off-loading items of varying size such as electronic packages into receptacles such as tubes, there being means automatically to adjust dimension parameters of the apparatus whereby to accommodate packages of different size and load same into a tube therefor. The apparatus also has means for stacking a plurality of tubes for loading a bottom one of the stack, ejecting that one when loaded, and providing a subsequent tube from the stack for loading.

Abstract translation: 本发明涉及一种用于将各种尺寸的物品（例如电子包装物料）卸载到诸如管子之类的容器中的装置，存在自动调节装置的尺寸参数的装置，从而将不同尺寸的包装和相同的包装容纳在其中。 该装置还具有用于堆叠用于装载堆叠的底部的多个管的装置，当加载时弹出该管，并且从堆叠提供用于装载的随后的管。