公开(公告)号：US20040003891A1

公开(公告)日：2004-01-08

申请号：US10189883

申请日：2002-07-02

Applicant: ASM Assembly Automation Ltd.

Inventor： Chi Wah Cheng ,  Kin Yik Hung ,  Ping Chun (Benson) Chong ,  See Lok Chan

IPC: B32B031/00

CPC classification number: B23K3/0623 ,  B23K2101/40 ,  H05K3/3436 ,  H05K3/3489 ,  Y10T156/1089 ,  Y10T156/1707 ,  Y10T156/1798

Abstract: The invention provides an apparatus and method for the application of adhesive substances to objects, such as solder balls, for the purpose of mounting them onto substrates. The apparatus comprises an applicator having a layer of the adhesive substance and a pick carrier to carry objects and move the objects from a supply source to a substrate for mounting the objects thereon. The applicator is located so that the applicator applies the adhesive substance to the objects while the objects carried on the pick carrier are moving between the supply source and the substrate.

Abstract translation: 本发明提供了一种用于将粘合剂物质应用于诸如焊球的物体的装置和方法，用于将它们安装到基底上。 该装置包括具有粘合剂物质层的拾取器和用于携带物体并将物体从供应源移动到基板以将物体安装在其上的拾取托架。 涂抹器的位置使得涂抹器将粘合剂施加到物体上，同时携带在拾取载体上的物体在供给源和基底之间移动。