公开(公告)号：US20100243912A1

公开(公告)日：2010-09-30

申请号：US12411048

申请日：2009-03-25

申请人： Steve Richards ,  Geoff Ryding ,  Ted Smick

发明人： Steve Richards ,  Geoff Ryding ,  Ted Smick

IPC分类号： H01J27/00 ,  H01F38/00

CPC分类号： H01J37/3171 ,  H01J37/248 ,  H01J2237/038

摘要： A sequence of series-connected transformers for transmitting power to high voltages incorporates an applied voltage distribution to maintain each transformer in the sequence below its withstanding voltage.

摘要翻译： 用于将功率传输到高电压的串联变压器的序列包括施加的电压分布，以将每个变压器维持在低于其耐受电压的序列中。

公开(公告)号：US20100167454A1

公开(公告)日：2010-07-01

申请号：US12347690

申请日：2008-12-31

申请人： Zuniga Steve

发明人： Zuniga Steve

IPC分类号： H01L21/18

CPC分类号： H01L31/1804 ,  H01L31/1892 ,  Y02E10/547 ,  Y02P70/521

摘要： A method for forming a photovoltaic cell is disclosed which comprises the steps of providing a semiconductor donor body having a first surface and a second surface opposite the first surface, cleaving a first portion from the first surface of the semiconductor donor body to form a first lamina of semiconductor material, wherein the first lamina of semiconductor material has a first lamina thickness, and cleaving a second portion from the second surface of the semiconductor donor body to form a second lamina of semiconductor material, wherein the second lamina of semiconductor material has a second lamina thickness.

摘要翻译： 公开了一种用于形成光伏电池的方法，其包括以下步骤：提供具有第一表面和与第一表面相对的第二表面的半导体施主体，从半导体施主体的第一表面切割第一部分以形成第一层 的半导体材料，其中所述半导体材料的所述第一层具有第一层厚度，并且从所述半导体施主体的所述第二表面切割第二部分以形成半导体材料的第二层，其中所述半导体材料的第二层具有第二层 椎板厚度。

公开(公告)号：US20090242031A1

公开(公告)日：2009-10-01

申请号：US12057274

申请日：2008-03-27

申请人： S. Brad Herner ,  Aditya Agarwal

发明人： S. Brad Herner ,  Aditya Agarwal

IPC分类号： H01L31/028 ,  H01L31/04 ,  H01L21/18

CPC分类号： H01L31/068 ,  H01L31/075 ,  H01L31/1896 ,  Y02E10/547 ,  Y02E10/548

摘要： A semiconductor donor body is affixed to a receiver element, and a thin semiconductor lamina is cleaved from the donor body, remaining affixed to the receiver element. A photovoltaic assembly is fabricated which includes the lamina and the receiver element, wherein a photovoltaic cell comprises the lamina. The bond between the semiconductor donor body and the receiver element must survive processing to complete the cell, as well as eventual assembly, transport, and operation in a finished photovoltaic module. It has been found that inclusion of a conductive layer such as titanium or aluminum aids bonding between the semiconductor donor body and the receiver element. In some embodiments, the conductive layer may also serve as an electrical contact and/or as a reflective layer.

摘要翻译： 将半导体施主体固定到接收器元件，并且将薄的半导体层从施主体断开，保持固定在接收器元件上。 制造包括层板和接收器元件的光伏组件，其中光伏电池包括层板。 半导体施主体和接收元件之间的结合必须能够经受处理以完成电池，以及在成品光伏模块中的最终组装，运输和操作。 已经发现，诸如钛或铝的导电层的包含有助于在半导体施主体和接收体之间粘合。 在一些实施例中，导电层还可以用作电接触和/或作为反射层。

公开(公告)号：US20090194162A1

公开(公告)日：2009-08-06

申请号：US12026530

申请日：2008-02-05

申请人： Srinivasan Sivaram ,  Aditya Agarwal ,  S. Brad Herner ,  Christopher J. Petti

发明人： Srinivasan Sivaram ,  Aditya Agarwal ,  S. Brad Herner ,  Christopher J. Petti

IPC分类号： H01L31/028 ,  H01L21/00 ,  H01L31/04

CPC分类号： H01L31/022425 ,  H01L31/0682 ,  H01L31/0747 ,  H01L31/1804 ,  H01L31/1892 ,  Y02E10/547 ,  Y02P70/521

摘要： A very thin photovoltaic cell is formed by implanting gas ions below the surface of a donor body such as a semiconductor wafer. Ion implantation defines a cleave plane, and a subsequent step exfoliates a thin lamina from the wafer at the cleave plane. A photovoltaic cell, or all or a portion of the base or emitter of a photovoltaic cell, is formed within the lamina. In preferred embodiments, the wafer is affixed to a receiver before the cleaving step. Electrical contact can be formed to both surfaces of the lamina, or to one surface only.

公开(公告)号：US20130330871A1

公开(公告)日：2013-12-12

申请号：US13494687

申请日：2012-06-12

申请人： Bonna Newman ,  Venkatesan Murali ,  Zhiyong Li ,  Liang Chen

发明人： Bonna Newman ,  Venkatesan Murali ,  Zhiyong Li ,  Liang Chen

IPC分类号： H01L31/18

CPC分类号： H01L31/02363 ,  H01L31/02167 ,  H01L31/022425 ,  H01L31/0747 ,  H01L31/1892 ,  Y02E10/50

摘要： A method for modifying the texture of a semiconductor material is provided. The method includes performing a first texture step comprising reactive ion etching to a first surface of semiconductor material. After the first texture step, the first surface of the semiconductor material has a random texture comprising a plurality of peaks and a plurality of valleys, and wherein at least fifty percent of the first surface has a peak-to-valley height of less than one micron and an average peak-to-peak distance of less than one micron. Additional texture steps comprising wet etch or RIE etching may be optionally applied.

摘要翻译： 提供了一种修改半导体材料纹理的方法。 该方法包括执行包括对半导体材料的第一表面的反应离子蚀刻的第一纹理步骤。 在第一纹理步骤之后，半导体材料的第一表面具有包括多个峰和多个谷的随机纹理，并且其中至少百分之五十的第一表面具有小于一个的峰谷高度 平均峰 - 峰距离小于1微米。 可以任选地应用包括湿蚀刻或RIE蚀刻的附加纹理步骤。

公开(公告)号：US20130200496A1

公开(公告)日：2013-08-08

申请号：US13558826

申请日：2012-07-26

申请人： Venkatesan Murali ,  Thomas Edward Dinan, JR. ,  Steve Bababyan ,  Gopal Prabhu

发明人： Venkatesan Murali ,  Thomas Edward Dinan, JR. ,  Steve Bababyan ,  Gopal Prabhu

IPC分类号： H01L21/30 ,  H01L29/02 ,  H01L21/20

CPC分类号： H01L21/84 ,  H01L31/1892 ,  Y02E10/50

摘要： The invention provides a method of forming an electronic device from a lamina that has a coefficient of thermal expansion that is matched or nearly matched to a constructed metal support. In some embodiments the method comprises implanting the top surface of a donor body with an ion dosage to form a cleave plane followed by exfoliating a lamina from the donor body. After exfoliating the lamina, a flexible metal support that has a coefficient of thermal expansion with a value that is within 10% of the value of the coefficient of thermal expansion of the lamina is constructed on the lamina. In some embodiments the coefficients of thermal expansion of the metal support and the lamina are within 10% or within 5% of each other between the temperatures of 100 and 600 ° C.

摘要翻译： 本发明提供了一种从薄片形成电子器件的方法，其具有与构造的金属支撑件匹配或接近匹配的热膨胀系数。 在一些实施方案中，该方法包括用离子剂量植入供体体的顶表面以形成切割平面，随后从供体体剥离薄片。 在剥离层之后，在层板上形成具有热膨胀系数为10％以内的层的热膨胀系数的柔性金属支撑体。 在一些实施例中，金属载体和薄层的热膨胀系数在100和600℃的温度之间彼此的10％或5％以内。

公开(公告)号：US20130199611A1

公开(公告)日：2013-08-08

申请号：US13366338

申请日：2012-02-05

申请人： Venkatesan Murali ,  Gopal Prabhu ,  Thomas Edward Dinan, JR. ,  Orion Leland

发明人： Venkatesan Murali ,  Gopal Prabhu ,  Thomas Edward Dinan, JR. ,  Orion Leland

IPC分类号： H01L31/0376 ,  H01L31/18

CPC分类号： H01L31/0376 ,  H01L31/03762 ,  H01L31/056 ,  H01L31/068 ,  H01L31/1896 ,  Y02E10/52 ,  Y02E10/547 ,  Y02E10/548

摘要： The invention provides for a semiconductor wafer with a metal support element suitable for the formation of a flexible or sag tolerant photovoltaic cell. A method for forming a photovoltaic cell may comprise providing a semiconductor wafer have a thickness greater than 150 μm, the wafer having a first surface and a second surface opposite the first and etching the semiconductor wafer a first time so that the first etching reduces the thickness of the semiconductor wafer to less than 150 μm. After the wafer has been etched a first time, a metal support element may be constructed on or over the first surface; and a photovoltaic cell may be fabricated, wherein the semiconductor wafer comprises the base of the photovoltaic cell.

摘要翻译： 本发明提供一种具有金属支撑元件的半导体晶片，该金属支撑元件适用于形成柔性或容忍光伏电池。 形成光伏电池的方法可以包括提供厚度大于150μm的半导体晶片，所述晶片具有第一表面和与第一表面相对的第二表面，并且第一次蚀刻半导体晶片，使得第一蚀刻减小厚度 的半导体晶片小于150μm。 在第一次蚀刻晶片之后，金属支撑元件可以构造在第一表面上或上面; 并且可以制造光伏电池，其中半导体晶片包括光伏电池的基极。

公开(公告)号：US20120208317A1

公开(公告)日：2012-08-16

申请号：US13211258

申请日：2011-08-16

申请人： S. Brad Herner ,  Mark H. Clark ,  Christopher J. Petti

发明人： S. Brad Herner ,  Mark H. Clark ,  Christopher J. Petti

IPC分类号： H01L31/18

CPC分类号： H01L21/187 ,  H01L31/0747 ,  H01L31/1804 ,  H01L31/1896 ,  Y02E10/547 ,  Y02P70/521

摘要： A donor silicon wafer may be bonded to a substrate and a lamina cleaved from the donor wafer. A photovoltaic cell may be formed from the lamina bonded to the substrate. An intermetal stack is described that is optimized for use in such a cell. The intermetal stack may include a transparent conductive oxide layer serving as a quarter-wave plate, a low resistance layer, an adhesion layer to help adhesion to the receiver element, and may also include a barrier layer to prevent or impede unwanted diffusion within the stack.

摘要翻译： 供体硅晶片可以结合到基底和从施主晶片分离的薄片。 可以从结合到衬底的薄片形成光伏电池。 描述了优化用于这种电池的金属间堆叠。 金属间堆叠可以包括用作四分之一波片的透明导电氧化物层，低电阻层，用于帮助粘附到接收器元件的粘合层，并且还可以包括防止或阻碍堆叠内的不期望扩散的阻挡层 。

公开(公告)号：US20120192935A1

公开(公告)日：2012-08-02

申请号：US13425870

申请日：2012-03-21

申请人： Steven M. Zuniga ,  Christopher J. Petti ,  Gopal Prabhu

发明人： Steven M. Zuniga ,  Christopher J. Petti ,  Gopal Prabhu

IPC分类号： H01L31/0352 ,  H01L31/02

CPC分类号： H01L27/142 ,  H01L31/03921 ,  H01L31/042 ,  H01L31/0682 ,  H01L31/1804 ,  H01L31/1896 ,  Y02E10/547 ,  Y02P70/521

摘要： A method to fabricate a photovoltaic device includes forming first and second contact regions at the first surface of a semiconductor donor body. A cleave plane may be formed by implanting ions into the donor body, and a lamina that includes the contact regions is cleaved from the donor body at the cleave plane. The first surface of the lamina may be contacted with a temporary support and fabricated into a photovoltaic device, wherein the lamina comprises the base of the photovoltaic device.

摘要翻译： 制造光伏器件的方法包括在半导体施主体的第一表面形成第一和第二接触区域。 可以通过将离子注入给体体中形成切割平面，并且包括接触区域的层在分裂面处从施主体断裂。 薄片的第一表面可以与临时支撑件接触并制成光伏器件，其中薄片包括光伏器件的基极。

公开(公告)号：US20120171809A1

公开(公告)日：2012-07-05

申请号：US13331909

申请日：2011-12-20

申请人： Adam Kell ,  Robert Clark-Phelps ,  Joseph D. Gillespie ,  Gopal Prabhu ,  Takao Sakase ,  Theodore H. Smick ,  Steve Zuniga ,  Steve Bababyan

发明人： Adam Kell ,  Robert Clark-Phelps ,  Joseph D. Gillespie ,  Gopal Prabhu ,  Takao Sakase ,  Theodore H. Smick ,  Steve Zuniga ,  Steve Bababyan

IPC分类号： H01L31/0376 ,  H01L21/762

CPC分类号： H01L31/0288 ,  H01L21/67092 ,  H01L21/6838 ,  H01L31/0747 ,  H01L31/1892 ,  Y02E10/50

摘要： A method for producing a lamina from a donor body includes implanting the donor body with an ion dosage and heating the donor body to an implant temperature during implanting. The donor body is separably contacted with a susceptor assembly, where the donor body and the susceptor assembly are in direct contact. A lamina is exfoliated from the donor body by applying a thermal profile to the donor body. Implantation and exfoliation conditions may be adjusted in order to maximize the defect-free area of the lamina.

摘要翻译： 用于从施主实体产生层的方法包括：在植入期间，将施主体以离子剂量植入，并将施主体加热至植入温度。 施主体与供体体和基座组件直接接触的基座组件分离接触。 通过向施主体施加热分布，使薄片从供体体剥离。 可以调整植入和剥脱条件以最大化层的无缺陷区域。