METHOD FOR CONTROLLING BEAM USING LENS IN WIRELESS COMMUNICATION SYSTEM

    公开(公告)号:US20230327343A1

    公开(公告)日:2023-10-12

    申请号:US18335517

    申请日:2023-06-15

    CPC classification number: H01Q19/06 H01Q3/36

    Abstract: A beamforming device in a wireless communication system is provided that includes a phased array antenna, at least one wireless communication circuit, and a lens, wherein the lens comprises a first surface oriented in a first direction, which is the direction toward the phased array antenna, and a second surface oriented in a second direction, which is the opposite direction of the first direction, and a first beam radiated from the phased array antenna is refracted after passing through a first point on the first surface, and forms a first path inside the lens and forms a second path along which the first beam is refracted at a second point on the second surface after passing through the inside of the lens along the first path, wherein the refraction angle at the second point may be formed so as to be dependent on the radiation angle of the first beam.

    APPARATUS AND METHOD FOR SETTING SEMICONDUCTOR PARAMETER

    公开(公告)号:US20230274985A1

    公开(公告)日:2023-08-31

    申请号:US17983319

    申请日:2022-11-08

    CPC classification number: H01L22/14 G06N3/08 H01L22/12 H01L22/20

    Abstract: Disclosed are a method and apparatus for setting a semiconductor parameter. The method for setting a semiconductor parameter according to an embodiment of the present disclosure is a method performed on a computing apparatus including one or more processors and a memory storing one or more programs executed by the one or more processors, the method including acquiring electrical measurement parameters corresponding to preset semiconductor manufacturing parameters, classifying the electrical measurement parameters into a plurality of groups according to a degree of correlation, extracting a correlation axis reflecting a correlation between electrical measurement parameters belonging to a corresponding group for each classified group, and predicting a figure of merit of a semiconductor device by using data values of electrical measurement parameters belonging to the corresponding group as input based on the correlation axis of each group.

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