公开(公告)号：US20230089716A1

公开(公告)日：2023-03-23

申请号：US17930082

申请日：2022-09-07

Applicant: CHROMA ATE INC.

Inventor： Chien-Ming CHEN ,  Jui-Hsiung CHEN ,  Chi-Wei WANG

IPC: B65G47/90 ,  H01L21/673

Abstract: The present invention relates to a chip tray positioning device, which mainly comprises a frame body, a tray conveying module, a pulling module, a pushing module and a controller. The tray conveying module is disposed on the frame body, electrically connected to the controller and controlled to convey a chip tray from the start area to the end area. The pulling module and the pushing module are disposed on the frame body, electrically connected to the controller and controlled to cause the chip tray to be abutted against the end wall and the lateral wall of the frame body, thereby realizing the positioning of the chip tray and eliminating an error formed in the transfer process of the chip tray. In addition, the controller also controls the pushing module to knock the chip tray at a specific frequency so that the chip tray is vibrated.

公开(公告)号：US20230086540A1

公开(公告)日：2023-03-23

申请号：US17816086

申请日：2022-07-29

Applicant: CHROMA ATE INC.

Inventor： Chien-Ming CHEN ,  Jui-Hsiung CHEN ,  Yi-Sheng XU

IPC: G01R31/28

Abstract: The present invention relates to an electronic device pick-and-place system and an electronic device testing apparatus having the same, comprising a plurality of pick-and-place heads, a plurality of negative pressure generators and an air pressure regulating valve. Each pick-and-place head has a pick-and-place port; the plurality of negative pressure generators are communicated with the plurality of pick-and-place ports of the plurality of pick-and-place heads respectively; an inlet end of the air pressure regulating valve is communicated with an air pressure source, and an outlet end of the air pressure regulating valve is communicated with the plurality of negative pressure generators; the air pressure regulating valve can be used to adjust the suction forces of the pick-and-place ports of the pick-and-place heads in a batch. Accordingly, the suction forces and blowing forces of the pick-and-place ports of the pick-and-place heads can be adjusted in a batch.

公开(公告)号：US11609261B2

公开(公告)日：2023-03-21

申请号：US17337954

申请日：2021-06-03

Applicant: CHROMA ATE INC.

Inventor： Wei-Chih Chen ,  Ben-Mou Yu ,  Yi-Yen Lin

IPC: G01R31/26 ,  G01N21/95 ,  G01R31/28

Abstract: A wafer inspection system and a wafer inspection equipment thereof are provided. The wafer inspection system includes a susceptor device, probe card, and bridge module. The susceptor device includes a susceptor unit for placing a wafer under test. The probe card includes a probing portion and conducting portion. The conducting portion is disposed at the periphery of the probing portion and has a contact surface. The bridge module includes transmission units extended upward, positioned adjacent to a wafer placement area, and coupled to the susceptor unit. When the probing portion comes into contact with a testing point of the wafer, the contact surface of the conducting portion gets coupled to the transmission units to transmit a test signal to the probe card via the transmission units and conducting portion and thus form a test loop. Thus, the test loop path can be shortened and the accuracy of signal transmission and inspection can be enhanced.

公开(公告)号：US20230022501A1

公开(公告)日：2023-01-26

申请号：US17834035

申请日：2022-06-07

Applicant: CHROMA ATE INC.

Inventor： Chin-Yi OUYANG ,  Chien-Ming CHEN ,  Wei-Cheng KUO ,  Xin-Yi WU ,  Iching TSAI

IPC: G01R31/28 ,  G01R1/04

Abstract: The present invention relates to a multistory electronic device testing apparatus, which mainly comprises a feeding and binning device, a multi-axis transfer device, a chip-testing device and a main controller. The feeding and binning device includes an upper module and a lower module. The chip-testing device includes a plurality of testing units arranged vertically. The main controller not only controls the feeding, binning and testing operations, but also controls the multi-axis transfer device to transfer an electronic device to be tested or a tested electronic device between the feeding and binning device and the chip-testing device. Accordingly, the three-dimensional arrangement of the feeding and binning module and the testing device is realized, and the accommodating capacity and the testing capacity for the electronic devices to be tested and the tested electronic devices can be increased.

公开(公告)号：US20220200185A1

公开(公告)日：2022-06-23

申请号：US17548655

申请日：2021-12-13

Applicant: CHROMA ATE INC.

Inventor： HUI-JUNG WU ,  TSUNG-I LIN ,  SHOU-SHENG HSU

IPC: H01R13/24 ,  G01R1/04 ,  H05K7/10

Abstract: The present invention relates to a chip-fixing device for a socket, which comprises a fixing base body and a movable stop. The socket is assembled in a socket-accommodating recess of the fixing base body. The movable stop is assembled in the fixing base body and controlled in such a manner that a stopper is moved between a first position and a second position, wherein the first position refers to a position where the stopper is located right above the socket, and the second position refers to a position where the stopper is not located right above the socket. Accordingly, the socket-accommodating recess can be used to install sockets of different sizes, and the movable stop can drive the stopper to restrict a chip from falling off the socket or drive the stopper to release the chip, depending on presence or absence of an external force.

公开(公告)号：US11333704B2

公开(公告)日：2022-05-17

申请号：US16559701

申请日：2019-09-04

Applicant: Chroma Ate Inc.

Inventor： Chin-Yi Ouyang ,  Chien-Ming Chen ,  Meng-Kung Lu

IPC: G01R31/28 ,  G01R1/04

Abstract: The invention relates to a sliding test device for electronic components, which mainly comprises a base, a sliding frame and a pressing member, wherein an electronic component to be tested is placed in a chip receiving module of the base, and the sliding frame is slidably moved with respect to the base under sliding engagement between a first sliding guide and a second sliding guide so that a pressing block of the pressing member is aligned with the electronic component presses the electronic component. According to the present invention, the pressing member presses the electronic component and exerts a sufficient contact force on the electronic component, and a reaction force caused by the contact force and the elastic restoring force of probes is internally balanced in the device.

公开(公告)号：US11143640B2

公开(公告)日：2021-10-12

申请号：US16540162

申请日：2019-08-14

Applicant: Chroma Ate Inc.

Inventor： Yung-Chih Chen ,  Chien-Ming Chen ,  Yun-Jui Cheng

IPC: G01N33/00

Abstract: A rotating buffer station for a chip mainly comprises an upper cover plate, a rotatable plate, a movable jaw member and a lower base. The upper cover plate is arranged on the lower base and formed with a guide slot. The rotatable plate is located between the lower base and the upper cover plate and formed with a cam slot. The rotatable plate is pivotally coupled to the lower base. The movable jaw member is slidably engaged with the cam slot and the guide slot. When the rotatable plate is rotated, the cam slot forces the movable jaw member to move radially along the guide slot so as to form a chip socket. Accordingly, with rotation of the rotatable plate, the cam slot forces the movable jaw member to move radially along the guide slot so that the chip socket can be resized to hold various differently-sized chips.

公开(公告)号：US11080860B2

公开(公告)日：2021-08-03

申请号：US16693360

申请日：2019-11-24

Applicant: CHROMA ATE INC.

Inventor： Ting-Wei Chen ,  Yu-Hsin Liu ,  Ming-Kai Hsueh

IPC: G06T7/174 ,  G06T7/90 ,  G06T7/11 ,  G06T7/00

Abstract: An image inspection method includes capturing a target object image, which the target object image comprises a plurality of graphical features; choosing a block image comprising a specific graphical feature of the plurality of graphical features from the target object image; capturing all the graphical features of the block image to obtain a region of interest (ROI); executing a filtering process or a recovering process on the ROI to obtain a pre-processed region; and inspecting, according to the pre-processed region, the target object image to determine whether the target object image has defects.

公开(公告)号：US20210199690A1

公开(公告)日：2021-07-01

申请号：US17023445

申请日：2020-09-17

Applicant: Chroma Ate Inc.

Inventor： Chin-Yi OUYANG ,  Chien-Ming CHEN ,  Bo-An SU ,  Yu-Hsuen WANG

IPC: G01R1/04

Abstract: The present invention relates to a locking mechanism for a press head, and an electronic device testing apparatus comprising the same, wherein a slider and a locking pin are disposed on the press head and a test socket substrate, respectively. When the press head is moved and engaged with the test socket substrate, an actuator drives the slider to secure the locking pin, so as to secure the press head and the test socket substrate and prevent the press head and the test socket substrate from being separated from each other. The mechanism is simple in construction, easy to install and maintain, reliable, and can be integrated into the support arms, and occupies a relatively small space. Energy is consumed only when the actuator is actuated to effect locking or unlocking. That is, only when the slider is driven and moved, energy is consumed. No extra energy is needed to persistently press down or drive the locking mechanism.

公开(公告)号：US10965096B2

公开(公告)日：2021-03-30

申请号：US16358800

申请日：2019-03-20

Applicant: Chroma Ate Inc.

Inventor： James E. Hopkins

IPC: H01S5/00 ,  H01S5/183 ,  H01S5/024

Abstract: A fixture assembly for testing a surface emitting laser diode and a testing apparatus having the same are provided. The fixture assembly comprises a base, an upper cover and a latch mechanism. The base includes at least one pocket, and at least one electrical contact interface disposed in the pocket. The upper cover includes a body, an abutting block and a pressing member disposed in the body. The abutting block is engageable with the body for slidable movement with respect to the body. The latch mechanism is disposed on the base and the upper cover, and is configured to selectively connect or disconnect the base to or from the upper cover. When the latch mechanism is operated to connect the base to the upper cover, the pocket and an opening of the abutting block form into a through cavity through which the laser diode emits the laser beam.