公开(公告)号：US20220035251A1

公开(公告)日：2022-02-03

申请号：US17033201

申请日：2020-09-25

Applicant: Applied Materials, Inc.

Inventor： Jinrui GUO ,  Ludovic GODET ,  Daihua ZHANG ,  Kang LUO ,  Rami HOURANI

IPC: G03F7/30 ,  G02B6/34

Abstract: A method of forming a three dimensional feature inwardly of a surface of a material includes providing a droplet dispenser including an outlet configured to dispense discrete droplets of a liquid material having a reactant therein capable of reacting with, and thereby removing, portions of the material layer with which the droplets come into contact, providing a support configured support the material thereon, the support, and the droplet dispenser, movable with respect to one another, such that the outlet of the droplet dispenser is positionable over different discrete areas of the surface of the material, and positioning the surface of the material under the droplet dispenser, and dispensing droplets to discrete portions of the surface of the material in a desired area thereof, to remove at least a portion of the material in the desired area and thereby form a three dimensional recess inwardly of the surface of the material.

公开(公告)号：US20220035245A1

公开(公告)日：2022-02-03

申请号：US17034004

申请日：2020-09-28

Applicant: Applied Materials, Inc.

Inventor： Ian Matthew MCMACKIN ,  Ludovic GODET

IPC: G03F7/00 ,  B29C33/42 ,  B29C43/02

Abstract: An apparatus for manufacturing a nano-imprint lithography stamp from a master template stamp, including a stamp chuck configured to selectively secure a stamp backing material thereto, a master chuck configured to support a master template stamp, the master template stamp including a master pattern thereon, the master chuck configured to support the master template stamp in facing relationship to the stamp backing material when selectively secured to the stamp chuck, wherein the master template stamp includes an electromagnetic energy curable material on and in the master pattern, and the stamp chuck is configured and arranged to position a portion of the backing material thereon spaced therefrom and in contact with the electromagnetic energy curable material, and the stamp chuck is further configured to position the portion of the backing material in contact with the energy curable material, after it is cured, in contact with the stamp chuck.

公开(公告)号：US20220026603A1

公开(公告)日：2022-01-27

申请号：US17371441

申请日：2021-07-09

Applicant: Applied Materials, Inc.

Inventor： Andrew CEBALLOS ,  Ludovic GODET ,  Karl J. ARMSTRONG ,  Rami HOURANI

IPC: G02B1/115 ,  C23C16/40 ,  C23C14/08

Abstract: Embodiments of the present disclosure relate to optical device films and methods of forming optical device films. Specifically, embodiments described herein provide for an optical device film having a constant oxygen-concentration, a first concentration profile of the first material, and a second concentration profile of the second material. The first material, described and referenced to herein, has a first refractive index about 2.0 or greater and the second material has a second refractive index less than 2.0.

公开(公告)号：US20210395139A1

公开(公告)日：2021-12-23

申请号：US17466803

申请日：2021-09-03

Applicant: Applied Materials, Inc.

Inventor： Yongan XU ,  Chien-An CHEN ,  Ludovic GODET

IPC: C03C17/36 ,  C03C17/38

Abstract: Aspects of the present disclosure relate generally to methods and apparatus of processing transparent substrates, such as glass substrates. In one implementation, a film stack for optical devices includes a glass substrate including a first surface and a second surface. The film stack includes a device function layer formed on the first surface, a hard mask layer formed on the device function layer, and a substrate recognition layer formed on the hard mask layer. The hard mask layer includes one or more of chromium, ruthenium, or titanium nitride. The film stack includes a backside layer formed on the second surface. The backside layer formed on the second surface includes one or more of a conductive layer or an oxide layer.

公开(公告)号：US20210305055A1

公开(公告)日：2021-09-30

申请号：US17344700

申请日：2021-06-10

Applicant: Applied Materials, Inc.

Inventor： Ludovic GODET ,  Rutger Meyer Timmerman Thijssen

IPC: H01L21/308 ,  H01L21/263 ,  H01L21/3065

Abstract: Embodiments described herein relate to methods forming optical device structures. One embodiment of the method includes exposing a substrate to ions at an ion angle relative to a surface normal of a surface of the substrate to form an initial depth of a plurality of depths. A patterned mask is disposed over the substrate and includes two or more projections defining exposed portions of the substrate or a device layer disposed on the substrate. Each projection has a trailing edge at a bottom surface contacting the device layer, a leading edge at a top surface of each projection, and a height from the top surface to the device layer. Exposing the substrate to ions at the ion angle is repeated to form at least one subsequent depth of the plurality of depths.

公开(公告)号：US20210269355A1

公开(公告)日：2021-09-02

申请号：US16803956

申请日：2020-02-27

Applicant: Applied Materials, Inc.

Inventor： Yongan XU ,  Chien-An CHEN ,  Ludovic GODET

IPC: C03C17/36 ,  C03C17/38

Abstract: Aspects of the present disclosure relate generally to methods and apparatus of processing transparent substrates, such as glass substrates. In one implementation, a film stack for optical devices includes a glass substrate including a first surface and a second surface. The film stack includes a device function layer formed on the first surface, a hard mask layer formed on the device function layer, and a substrate recognition layer formed on the hard mask layer. The hard mask layer includes one or more of chromium, ruthenium, or titanium nitride. The film stack includes a backside layer formed on the second surface. The backside layer formed on the second surface includes one or more of a conductive layer or an oxide layer.

公开(公告)号：US20210263410A1

公开(公告)日：2021-08-26

申请号：US16798261

申请日：2020-02-21

Applicant: Applied Materials, Inc.

Inventor： Yongan XU ,  Ludovic GODET

IPC: G03F7/00 ,  G03F7/20 ,  G03F7/038 ,  G03F7/004

Abstract: In one embodiment, a method of fabricating a device having at least two features of differing heights comprises: depositing a resist over a substrate; determining a topography pattern for the at least two features of the device; determining an exposure pattern for the at least two features of the device; exposing a first area of the resist with a first dose of light, the first area corresponding to a first feature of the at least two features; exposing a second area of the resist with a second dose of light that is different from the first dose of light, the second area corresponding to a second feature of the at least two features; and developing the resist.

公开(公告)号：US20210208317A1

公开(公告)日：2021-07-08

申请号：US16735603

申请日：2020-01-06

Applicant: Applied Materials, Inc.

Inventor： Yongan XU ,  Rutger MEYER TIMMERMAN THIJSSEN ,  Jinrui GUO ,  Ludovic GODET

IPC: G02B5/18 ,  G03F1/42 ,  G03F7/20

Abstract: A method of forming patterned features on a substrate is provided. The method includes positioning a plurality of masks arranged in a mask layout over a substrate. The substrate is positioned in a first plane and the plurality of masks are positioned in a second plane, the plurality of masks in the mask layout have edges that each extend parallel to the first plane and parallel or perpendicular to an alignment feature on the substrate, the substrate includes a plurality of areas configured to be patterned by energy directed through the masks arranged in the mask layout. The method further includes directing energy towards the plurality of areas through the plurality of masks arranged in the mask layout over the substrate to form a plurality of patterned features in each of the plurality of areas.

公开(公告)号：US20210195695A1

公开(公告)日：2021-06-24

申请号：US17119377

申请日：2020-12-11

Applicant: Applied Materials, Inc.

Inventor： Hiram CERVERA ,  Yongan XU ,  Ludovic GODET

IPC: H05B3/74 ,  H05B3/28 ,  F27D5/00 ,  H05B3/62

Abstract: Embodiments of the present disclosure relate to bake apparatuses for handling and uniform baking of substrates and methods for the handling and the uniform baking of substrates. The bake apparatuses allow the substrates to be heated to a temperature greater than 50° C. without bowing of about 1 mm to about 2 mm from the edge of the substrates to the center of the substrates. The bake apparatuses heat the substrates uniformly or substantially uniformly to improve substrate quality.

公开(公告)号：US20200373188A1

公开(公告)日：2020-11-26

申请号：US16993069

申请日：2020-08-13

Applicant: Applied Materials, Inc.

Inventor： Joseph YUDOVSKY ,  Visweswaren SIVARAMAKRISHNAN ,  Ludovic GODET ,  Rutger MEYER TIMMERMAN THIJSSEN

IPC: H01L21/683 ,  H01L21/687

Abstract: Embodiments described herein relate to a substrate chucking apparatus having a plurality of cavities formed therein. The cavities are formed in a body of the chucking apparatus. In one embodiment, a first plurality of ports are formed in a chucking surface of the body and extend to a bottom surface of the body. In another embodiment, a second plurality of ports are formed in a bottom surface of the plurality of cavities and extend through the body to a bottom surface of the body.