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公开(公告)号：US10292291B2
公开(公告)日：2019-05-14
申请号：US15937723
申请日：2018-03-27
Applicant: Apple Inc.
Inventor： Christopher D. Prest , Claudio Di Leo
Abstract: An electronic device such as a media player is formed from electrical components such as integrated circuits, buttons, and a battery. Electrical input-output port contacts are used to play audio and to convey digital signals. Electrical components for the device are mounted to a substrate. The components are encapsulated in an encapsulant and covered with an optional housing structure. The electrical input-output port contacts and portions of components such as buttons remain uncovered by encapsulant during the encapsulation process. Integrated circuits are entirely encapsulated with encapsulant. The integrated circuits are packaged or unpackaged integrated circuit die. The substrate is a printed circuit board or is an integrated circuit to which components are directly connected without any printed circuit boards interposed between the integrated circuit and the components.
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公开(公告)号：US20190023611A1
公开(公告)日：2019-01-24
申请号：US16143119
申请日：2018-09-26
Applicant: Apple Inc.
Inventor： Victor Luzzato , Christopher D. Prest , Dale N. Memering , Matthew S. Rogers
IPC: C03C21/00
Abstract: Asymmetrically strengthened glass articles, methods for producing the same, and use of the articles in portable electronic device is disclosed. The asymmetrically strengthened glass articles include glass articles having a deeper compressive stress layer in a thicker portion of the glass article. Using a budgeted amount of compressive stress and tensile stress, asymmetric chemical strengthening is optimized for the utility of a glass article. In some aspects, the strengthened glass article can be designed for reduced damage, or damage propagation, when dropped.
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公开(公告)号：US20180292864A1
公开(公告)日：2018-10-11
申请号：US16006714
申请日：2018-06-12
Applicant: Apple Inc.
Inventor： Christopher D. Prest , Tseng-Mau Yang , Dale N. Memering
Abstract: An electronic device may be provided with a display mounted in a housing. The display may have an array of display pixels that provide image light to a user. The array of display pixels may form an active display structure with a rectangular shape. The rectangular active display structure may be surrounded by an inactive border region. Optical structures such as upper structures formed from a sheet of glass and lower optical structures that lie beneath the sheet of glass may be configured to bend light from the display pixels along the periphery of the active display structure. The upper optical structures may have an area that is larger than the area of the active display structure, so that the presence of the optical structures may serve to enlarge the apparent size of the display. The lower and upper optical structures may have curved surfaces for bending the light.
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公开(公告)号：US20180255388A1
公开(公告)日：2018-09-06
申请号：US15948920
申请日：2018-04-09
Applicant: Apple Inc.
Inventor： M. Evans Hankey , Emery A. Sanford , Christopher D. Prest , Way Chet Lim
IPC: H04R1/10 , H01R13/62 , H02J7/00 , H04W52/02 , H04M1/60 , H04M1/05 , H04M1/02 , H05K1/18 , H05K1/14
CPC classification number: H04R1/1025 , H01R13/6205 , H02J7/0042 , H02J7/0052 , H04M1/0262 , H04M1/0274 , H04M1/0277 , H04M1/05 , H04M1/6058 , H04M1/6066 , H04M2250/02 , H04R1/1016 , H04R1/1041 , H04R1/105 , H04R2201/105 , H04R2201/107 , H04R2420/07 , H04R2420/09 , H04W52/0274 , H05K1/147 , H05K1/189 , Y02D70/00 , Y02D70/142 , Y02D70/144 , Y02D70/23
Abstract: An in-ear hearing device having an ear interfacing portion integrally formed with an elongated stem portion, wherein the ear interfacing portion extends away from the elongated stem portion; a first acoustic port formed in the ear interfacing portion; a speaker disposed in the ear interfacing portion and aligned to emit sound from the acoustic port; a plurality of electrical contacts disposed at an end of the stem portion, the plurality of electrical contacts including first and second contacts; a second acoustic port formed at the end of the elongated stem portion between the first and second contacts; a microphone disposed in the stem portion; and a channel that fluidically couples the microphone to the second acoustic port.
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公开(公告)号：US10067535B2
公开(公告)日：2018-09-04
申请号：US13631141
申请日：2012-09-28
Applicant: Apple Inc.
Inventor： Christopher D. Prest , Tseng-Mau Yang , Dale N. Memering
Abstract: An electronic device may be provided with a display mounted in a housing. The display may have an array of display pixels that provide image light to a user. The array of display pixels may form an active display structure with a rectangular shape. The rectangular active display structure may be surrounded by an inactive border region. Optical structures such as upper structures formed from a sheet of glass and lower optical structures that lie beneath the sheet of glass may be configured to bend light from the display pixels along the periphery of the active display structure. The upper optical structures may have an area that is larger than the area of the active display structure, so that the presence of the optical structures may serve to enlarge the apparent size of the display. The lower and upper optical structures may have curved surfaces for bending the light.
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Patent Agency Ranking
公开(公告)号：US20180220542A1
公开(公告)日：2018-08-02
申请号：US15937723
申请日：2018-03-27
Applicant: Apple Inc.
Inventor： Christopher D. Prest , Claudio Di Leo
CPC classification number: H05K7/02 , G06F1/1626 , H01L23/3107 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2924/09701 , H01L2924/1305 , H01L2924/19041 , H01L2924/19107 , Y10T29/49146 , H01L2924/00014 , H01L2924/00
Abstract: An electronic device such as a media player is formed from electrical components such as integrated circuits, buttons, and a battery. Electrical input-output port contacts are used to play audio and to convey digital signals. Electrical components for the device are mounted to a substrate. The components are encapsulated in an encapsulant and covered with an optional housing structure. The electrical input-output port contacts and portions of components such as buttons remain uncovered by encapsulant during the encapsulation process. Integrated circuits are entirely encapsulated with encapsulant. The integrated circuits are packaged or unpackaged integrated circuit die. The substrate is a printed circuit board or is an integrated circuit to which components are directly connected without any printed circuit boards interposed between the integrated circuit and the components.
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公开(公告)号：US20180213660A1
公开(公告)日：2018-07-26
申请号：US15716086
申请日：2017-09-26
Applicant: Apple Inc.
Inventor： Christopher D. Prest , Stephen B. Lynch , Teodor Dabov
CPC classification number: H05K5/0217 , B22D19/04 , B22D19/14 , B29C33/38 , B29C35/02 , B29C45/14311 , B29C70/72 , B29C2035/0827 , B29C2035/0877 , B29K2105/16 , B29L2031/3437 , B29L2031/3481 , H04M1/0202 , H05K5/0086 , H05K5/0208 , H05K5/04
Abstract: A housing of an electronic device includes a substrate defining an external surface and internal surface of the housing, at least one sidewall extending from the substrate, and abrasion-resistant members at least partly embedded in the substrate and extending beyond the external surface. The abrasion-resistant members may be formed from metal or ceramic. The substrate comprises a moldable matrix. The abrasion-resistant members are harder than the moldable matrix.
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148.发明授权公开(公告)号：US09970079B2
公开(公告)日：2018-05-15
申请号：US14690253
申请日：2015-04-17
Applicant: Apple Inc.
Inventor： Joseph C. Poole , Theodore A. Waniuk , Jeffrey L. Mattlin , Michael S. Nashner , Christopher D. Prest
CPC classification number: C22C1/002 , B22F7/02 , C21D1/18 , C21D1/38 , C21D2251/00 , C22C45/00 , C23C24/106 , H01F1/15308
Abstract: Described herein are methods of constructing a three-dimensional part using metallic glass alloys, layer by layer, as well as metallic glass-forming materials designed for use therewith. In certain embodiments, a layer of metallic glass-forming powder or a sheet of metallic glass material is deposited to selected positions and then fused to a layer below by suitable methods such as laser heating or electron beam heating. The deposition and fusing are then repeated as need to construct the part, layer by layer. One or more sections or layers of non-metallic glass material can be included as needed to form composite parts. In one embodiment, the metallic glass-forming powder is a homogenous atomized powder. In another embodiment, the metallic glass-forming powder is formed by melting a metallic glass alloy to an over-heat threshold temperature substantially above the Tliquidus of the alloy, and quenching the melt at a high cooling rate such that the cooling material is kept substantially amorphous during cooling to form the metallic glass. In various embodiments, the melt is atomized during cooling to form the metallic glass-forming powder.
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公开(公告)号：US09810482B2
公开(公告)日：2017-11-07
申请号：US14445531
申请日：2014-07-29
Applicant: Apple Inc. , Crucible Intellectual Property, LLC
Inventor： Theodore A. Waniuk , Joseph Stevick , Sean O'Keeffe , Dermot J. Stratton , Joseph C. Poole , Matthew S. Scott , Christopher D. Prest
IPC: B22D17/20 , B22D17/10 , C22C45/00 , F27D11/06 , B22D25/06 , B22D27/04 , B22D27/20 , B22D41/01 , C22C45/10 , B22D18/06 , B22D37/00 , H05B6/36 , B22D17/04 , H05B6/44 , C22C45/02 , F27D3/00 , F27D3/14 , F27D11/12 , H05B6/06 , H05B6/30
CPC classification number: F27D11/06 , B22D17/04 , B22D17/10 , B22D17/2038 , B22D18/06 , B22D25/06 , B22D27/04 , B22D27/20 , B22D37/00 , B22D41/01 , C22C45/00 , C22C45/003 , C22C45/008 , C22C45/02 , C22C45/10 , F27D3/0025 , F27D3/14 , F27D11/12 , H05B6/067 , H05B6/30 , H05B6/36 , H05B6/367 , H05B6/44 , Y02P10/253
Abstract: Various embodiments provide apparatus and methods for melting materials and for containing the molten materials within melt zone during melting. Exemplary apparatus may include a vessel configured to receive a material for melting therein; a load induction coil positioned adjacent to the vessel to melt the material therein; and a containment induction coil positioned in line with the load induction coil. The material in the vessel can be heated by operating the load induction coil at a first RF frequency to form a molten material. The containment induction coil can be operated at a second RF frequency to contain the molten material within the load induction coil. Once the desired temperature is achieved and maintained for the molten material, operation of the containment induction coil can be stopped and the molten material can be ejected from the vessel into a mold through an ejection path.
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公开(公告)号：US09725796B2
公开(公告)日：2017-08-08
申请号：US13631098
申请日：2012-09-28
Applicant: Apple Inc. , Crucible Intellectual Property, LLC
Inventor： Theodore A. Waniuk , Joseph Stevick , Sean O'Keeffe , Dermot J. Stratton , Joseph C. Poole , Matthew S. Scott , Christopher D. Prest
IPC: C23C8/06 , C22C45/00 , B22D25/06 , B22D27/00 , C22C1/00 , C22C33/00 , C22C45/02 , C22C45/10 , B22D17/00
CPC classification number: C22C45/00 , B22D17/00 , B22D25/06 , B22D27/006 , C22C1/002 , C22C33/003 , C22C45/001 , C22C45/003 , C22C45/02 , C22C45/10 , C23C8/06
Abstract: Exemplary embodiments described herein relate to methods and apparatus for forming a coating layer at least partially on surface of a BMG article formed of bulk solidifying amorphous alloys. In embodiments, the coating layer may be formed in situ during formation of a BMG article and/or post formation of a BMG article. The coating layer may provide the BMG article with surface hardness, wear resistance, surface activity, corrosion resistance, etc.
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