Electronic devices having wideband antennas

    公开(公告)号:US11862838B2

    公开(公告)日:2024-01-02

    申请号:US16851812

    申请日:2020-04-17

    Applicant: Apple Inc.

    CPC classification number: H01Q5/10 H01Q5/328 H01Q7/00

    Abstract: An electronic device may include a curved cover layer and an antenna. The antenna may include a ground and a resonating element on a curved surface of a substrate. The curved surface may have a curvature that matches that of the cover layer. The resonating element may include first, second, and third arms fed by a feed. The first arm and a portion of the ground may form a loop antenna resonating element. The second arm and the first arm may form an inverted-F antenna resonating element, where a portion of the first arm forms a return path to the antenna ground for the inverted-F antenna resonating element. A gap between the first and second arms may form a distributed capacitance. The third arm may form an L-shaped antenna resonating element. The antenna may have a wide bandwidth from below 2.4 GHz to greater than 9.0 GHz.

    Systems With Wireless Communications
    123.
    发明公开

    公开(公告)号:US20230333376A1

    公开(公告)日:2023-10-19

    申请号:US18166367

    申请日:2023-02-08

    Applicant: Apple Inc.

    CPC classification number: G02B27/017 H01Q1/241

    Abstract: A head-mounted device may have a head-mounted housing. The head-mounted housing may have rear-facing displays that display images for a user. The images are viewable from eye boxes while the head-mounted device is being worn by the user. A peripheral conductive member may run along a peripheral edge of the front face of the housing. Dielectric-filled gaps may divide the peripheral conductive member into elongated conductive segments. The conductive segments may form antenna resonating elements for antennas on the front face. Radio-frequency transceiver circuitry such as cellular telephone transceiver circuitry may be coupled to the antennas.

    Electronic devices having antennas with hybrid substrates

    公开(公告)号:US11646501B2

    公开(公告)日:2023-05-09

    申请号:US17338481

    申请日:2021-06-03

    Applicant: Apple Inc.

    CPC classification number: H01Q19/005 H01Q1/38 H01Q21/065 H01Q1/243

    Abstract: An electronic device may have an antenna embedded in a substrate. The substrate may have first layers, second layers on the first layers, and third layers on the second layers. The antenna may include a first patch on the first layers that radiates in a first band, a second patch on the second antenna layers that radiates in a second band, and a parasitic patch on the third layers. A short path may couple ground to a location on the first patch that allows the first patch to form a ground extension in the second band for the second patch without affecting performance of the first patch in the first band. The first layers may have a higher dielectric permittivity than the second and third layers to minimize the thickness of the substrate without requiring a separate dielectric loading layer over the substrate.

    Electronic Devices Having Antennas with Hybrid Substrates

    公开(公告)号:US20220393365A1

    公开(公告)日:2022-12-08

    申请号:US17338481

    申请日:2021-06-03

    Applicant: Apple Inc.

    Abstract: An electronic device may have an antenna embedded in a substrate. The substrate may have first layers, second layers on the first layers, and third layers on the second layers. The antenna may include a first patch on the first layers that radiates in a first band, a second patch on the second antenna layers that radiates in a second band, and a parasitic patch on the third layers. A short path may couple ground to a location on the first patch that allows the first patch to form a ground extension in the second band for the second patch without affecting performance of the first patch in the first band. The first layers may have a higher dielectric permittivity than the second and third layers to minimize the thickness of the substrate without requiring a separate dielectric loading layer over the substrate.

    Electronic devices having differentially-loaded millimeter wave antennas

    公开(公告)号:US11502391B2

    公开(公告)日:2022-11-15

    申请号:US17031618

    申请日:2020-09-24

    Applicant: Apple Inc.

    Abstract: An electronic device may have an antenna that conveys radio-frequency signals at frequencies greater than 10 GHz. The antenna may be embedded in a substrate. The substrate may have routing layers, first antenna layers on the routing layers, second antenna layers on the first antenna layers, and a third antenna layers on the second antenna layers. The antenna may include first traces on the first antenna layers, second traces on the second antenna layers, and third traces on the third antenna layers. The first antenna layers may have a first bulk dielectric permittivity. The second layers may have a second bulk dielectric permittivity. The third layers may have a third bulk dielectric permittivity. At least one of the first, second, and third bulk dielectric permittivities may be different from the others. This may differentially load the antenna across the antenna layers, thereby broadening the bandwidth of the antenna.

    Electronic Devices Having Multilayer Millimeter Wave Antennas

    公开(公告)号:US20220094048A1

    公开(公告)日:2022-03-24

    申请号:US17028864

    申请日:2020-09-22

    Applicant: Apple Inc.

    Abstract: An electronic device may have a phased antenna array. An antenna in the array may include a rectangular patch element with diagonal axes. The antenna may have first and second antenna feeds coupled to the patch element along the diagonal axes. The antenna may be rotated at a forty-five degree angle relative to other antennas in the array. The antenna may have one or two layers of parasitic elements overlapping the patch element. For example, the antenna may have a layer of coplanar parasitic patches separated by a gap. The antenna may also have an additional parasitic patch that is located farther from the patch element than the layer of coplanar parasitic patches. The additional parasitic patch may overlap the patch element and the gap in the coplanar parasitic patches. The antenna may exhibit a relatively small footprint and minimal mutual coupling with other antennas in the array.

    Electronic Devices with Antennas and Optical Components

    公开(公告)号:US20210333823A1

    公开(公告)日:2021-10-28

    申请号:US17206010

    申请日:2021-03-18

    Applicant: Apple Inc.

    Abstract: A head-mounted device may have a head-mounted housing. The housing may include a frame with left and right openings that receive respective left and right optical modules that present images to a user's eyes. Each optical module may have a lens and display that presents an image through the lens. Camera support members may be coupled to respective left and right peripheral portions of the frame. Each camera support member may have openings configured to receive cameras. Antennas may be formed on a camera support member. The antennas may have metal traces on a surface of the camera support member, may have conductive structures embedded within the camera support member, and/or may have patterned metal traces on printed circuits attached to or embedded in the camera support member. The cameras may operate through portions of a display cover layer that covers an outwardly-facing display on the head-mounted housing.

    Electronic Device With Millimeter Wave Antennas

    公开(公告)号:US20210306014A1

    公开(公告)日:2021-09-30

    申请号:US17211710

    申请日:2021-03-24

    Applicant: Apple Inc.

    Abstract: An electronic device may be provided with wireless circuitry. The wireless circuitry may include one or more antennas. The antennas may include phased antenna arrays each of which includes multiple antenna elements. Phased antenna arrays may be mounted along edges of a housing for the electronic device, behind a dielectric window such as a dielectric logo window in the housing, in alignment with dielectric housing portions at corners of the housing, or elsewhere in the electronic device. A phased antenna array may include arrays of patch antenna elements on dielectric layers separated by a ground layer. A baseband processor may distribute wireless signals to the phased antenna arrays at intermediate frequencies over intermediate frequency signal paths. Transceiver circuits at the phased antenna arrays may include upconverters and downconverters coupled to the intermediate frequency signal paths.

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