公开(公告)号：US11984661B2

公开(公告)日：2024-05-14

申请号：US17026974

申请日：2020-09-21

Applicant: Apple Inc.

Inventor： Yi Jiang ,  Jiangfeng Wu ,  Siwen Yong ,  Hao Xu ,  Ana Papio Toda ,  Carlo di Nallo ,  Michael D. Quinones ,  Mattia Pascolini ,  Amin Tayebi ,  Aaron J. Cooper ,  Per Jakob Helander ,  Johan Avendal

IPC: H01Q1/24 ,  H01Q3/30 ,  H01Q9/04

CPC classification number: H01Q3/30 ,  H01Q1/24 ,  H01Q9/0414 ,  H01Q9/0421

Abstract: An electronic device may include first and second phased antenna arrays and a triplet of first, second, and third ultra-wideband antennas. An antenna module in the device may include a dielectric substrate. The first and second arrays and the triplet may be formed on the dielectric substrate. The third and second ultra-wideband antennas may be separated by a gap. The first array may be laterally interposed between the third and second ultra-wideband antennas within the gap. The third ultra-wideband antenna may be laterally interposed between the first phased antenna array and at least some of the second array. An integrated circuit may be mounted to the dielectric substrate using an interposer. The antenna module may occupy a minimal amount of space within the device and may be less expensive to manufacture relative to scenarios where the arrays and the ultra-wideband antennas are formed on separate substrates.

公开(公告)号：US20220094053A1

公开(公告)日：2022-03-24

申请号：US17026974

申请日：2020-09-21

Applicant: Apple Inc.

Inventor： Yi Jiang ,  Jiangfeng Wu ,  Siwen Yong ,  Hao Xu ,  Ana Papio Toda ,  Carlo di Nallo ,  Michael D. Quinones ,  Mattia Pascolini ,  Amin Tayebi ,  Aaron J. Cooper ,  Per Jakob Helander ,  Johan Avendal

IPC: H01Q3/30 ,  H01Q9/04 ,  H01Q1/24

Abstract: An electronic device may include first and second phased antenna arrays and a triplet of first, second, and third ultra-wideband antennas. An antenna module in the device may include a dielectric substrate. The first and second arrays and the triplet may be formed on the dielectric substrate. The third and second ultra-wideband antennas may be separated by a gap. The first array may be laterally interposed between the third and second ultra-wideband antennas within the gap. The third ultra-wideband antenna may be laterally interposed between the first phased antenna array and at least some of the second array. An integrated circuit may be mounted to the dielectric substrate using an interposer. The antenna module may occupy a minimal amount of space within the device and may be less expensive to manufacture relative to scenarios where the arrays and the ultra-wideband antennas are formed on separate substrates.