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公开(公告)号:US20200239299A1
公开(公告)日:2020-07-30
申请号:US16774956
申请日:2020-01-28
发明人: Jianwei Liu , Keith G. Fife
摘要: A method of forming a multiple layer, hybrid interposer structure includes forming a plurality of first openings through a substrate, the substrate comprising a heat spreading material; forming a first metal material within the plurality of first openings and on top and bottom surfaces of the substrate; patterning the first metal material; forming a dielectric layer over the patterned first metal material; forming a plurality of second openings within the dielectric layer to expose portions of the patterned first metal material on the top and bottom surfaces of the substrate; filling the plurality of second openings with a second metal material, in contact with the exposed portions of the patterned first metal material; forming a third metal material on the top and bottom surfaces of the substrate, the third metal material in contact with the second metal material and the dielectric layer; and patterning the third metal material.
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公开(公告)号:US10709415B2
公开(公告)日:2020-07-14
申请号:US16739517
申请日:2020-01-10
发明人: Abraham Neben , Karl Thiele , Brenda Gonyeau
摘要: Aspects of the technology described herein relate to ultrasound imaging of lungs. An ultrasound device may be configured with a set of parameter values associated with a shallow lung imaging mode. A selection of a change in imaging depth may be received. If the selected imaging depth is greater than or equal to a threshold imaging depth, the ultrasound device may be configured with a set of parameter values associated with a deep lung imaging mode. The set of parameter values associated with the shallow lung imaging mode may be optimized for imaging lung sliding and the set of parameter values associated with the deep lung imaging mode may be optimized for imaging A lines and B lines.
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123.
公开(公告)号:US10707201B2
公开(公告)日:2020-07-07
申请号:US16197438
申请日:2018-11-21
IPC分类号: B81B3/00 , B81B7/00 , H01L21/56 , H01L21/8238 , H01L23/522 , H01L23/528 , H01L27/06 , B06B1/02 , H01L27/092 , B81C1/00 , H01L21/3213 , H01L21/768 , A61B8/00
摘要: Micromachined ultrasonic transducers formed in complementary metal oxide semiconductor (CMOS) wafers are described, as are methods of fabricating such devices. A metallization layer of a CMOS wafer may be removed by sacrificial release to create a cavity of an ultrasonic transducer. Remaining layers may form a membrane of the ultrasonic transducer.
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公开(公告)号:US10702242B2
公开(公告)日:2020-07-07
申请号:US15626771
申请日:2017-06-19
发明人: Matthew de Jonge , Robert Schneider , David Elgena , Alex Rothberg , Jonathan M. Rothberg , Michal Sofka , Tomer Gafner , Karl Thiele , Abraham Neben
IPC分类号: A61B8/00 , G06K9/00 , G06K9/62 , G06K9/46 , A61B8/08 , A61B8/06 , G06T7/70 , G06T19/00 , A61B8/02 , G06T7/00 , G06T11/60 , G06K9/66 , A61B90/00 , A61B34/20
摘要: Aspects of the technology described herein relate to techniques for guiding an operator to use an ultrasound device. Thereby, operators with little or no experience operating ultrasound devices may capture medically relevant ultrasound images and/or interpret the contents of the obtained ultrasound images. For example, some of the techniques disclosed herein may be used to identify a particular anatomical view of a subject to image with an ultrasound device, guide an operator of the ultrasound device to capture an ultrasound image of the subject that contains the particular anatomical view, and/or analyze the captured ultrasound image to identify medical information about the subject.
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公开(公告)号:USD887562S1
公开(公告)日:2020-06-16
申请号:US29677065
申请日:2019-01-16
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公开(公告)号:US10672974B2
公开(公告)日:2020-06-02
申请号:US16158999
申请日:2018-10-12
发明人: Jonathan M. Rothberg , Susan A. Alie , Keith G. Fife , Nevada J. Sanchez , Tyler S. Ralston , Jaime Scott Zahorian
摘要: Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.
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128.
公开(公告)号:US20200060658A1
公开(公告)日:2020-02-27
申请号:US16669443
申请日:2019-10-30
发明人: Tomer Gafner , Igor Lovchinsky , Ardavan Saeedi
摘要: Aspects of technology described herein relate to guiding collection of ultrasound data collection using motion and/or orientation data. A directional indicator corresponding to an instruction for moving an ultrasound imaging device relative to a subject may be displayed in an augmented reality display. The direction of the directional indicator in the augmented reality display may be independent of an orientation of the ultrasound imaging device. The augmented reality display may include video captured by a camera that depicts the ultrasound imaging device and a fiducial marker on the ultrasound imaging device. The direction of the directional indicator may be based on the pose of the camera relative to the fiducial marker and the rotation and/or tilt of the ultrasound imaging device relative to the axis of gravity. The direction of the directional indicator may also be based on the pose of the camera relative to the subject.
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公开(公告)号:USD870296S1
公开(公告)日:2019-12-17
申请号:US29677071
申请日:2019-01-16
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130.
公开(公告)号:US20190336111A1
公开(公告)日:2019-11-07
申请号:US16513677
申请日:2019-07-16
发明人: Kailiang Chen , Keith G. Fife
摘要: A time gain compensation (TGC) circuit for an ultrasound device includes a first amplifier having an integrating capacitor and a control circuit configured to generate a TGC control signal that controls an integration time of the integrating capacitor, thereby controlling a gain of the first amplifier. The integration time is an amount of time an input signal is coupled to the first amplifier before the input signal is isolated from the first amplifier.
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