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    DISPLAY PANEL FOR THE BLIND AND DISPLAY DEVICE
    113.
    发明申请
    DISPLAY PANEL FOR THE BLIND AND DISPLAY DEVICE 审中-公开

    公开(公告)号：US20190057619A1

    公开(公告)日：2019-02-21

    申请号：US16005875

    申请日：2018-06-12

    Applicant: BOE Technology Group Co., Ltd. ,  Beijing BOE Display Technology Co., Ltd.

    Inventor： Zhidong Wang ,  Yun Qiu

    IPC: G09B21/00 ,  G06F3/041 ,  G06F3/01

    Abstract: A display panel for the blind and a display device are provided in the embodiments of the disclosure. The display panel for the blind includes: a back plate; and a plurality of display units provided on the back plate, each comprising: supports provided on the back plate; and an elastic film layer provided on top of the supports and spaced apart from the back plate; the elastic film layer, the supports and the back plate cooperate with one another to define an accommodation cavity thereamong of a respective one of the plurality of display units, and the respective one of the plurality display units is configured to deform in a condition that it is energized so as to drive the accommodation cavity to change its shape and in turn to squeeze the elastic film layer to project outwards; the display device comprises the display panel for the blind as above and a housing configured to receive the display panel.

    WAFER PART AND CHIP PACKAGING METHOD
    115.
    发明申请
    WAFER PART AND CHIP PACKAGING METHOD 审中-公开

    公开(公告)号：US20190006197A1

    公开(公告)日：2019-01-03

    申请号：US15991374

    申请日：2018-05-29

    Applicant: BOE TECHNOLOGY GROUP CO., LTD. ,  BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.

    Inventor： Yuanxin Du ,  Zhidong Wang ,  Lianjie Qu ,  Yonglian Qi ,  Yun Qiu ,  Zhenhua Lv

    IPC: H01L21/56 ,  H01L23/31 ,  H01L21/02 ,  H01L23/544 ,  H01L29/06 ,  H01L21/78

    Abstract: A wafer part and a chip packaging method are provided. The wafer part is obtained by processing a round wafer. A profile of the wafer part is an inscribed closed pattern of a profile of the round wafer, and area of the inscribed closed pattern is larger than area of an inscribed square of the profile of the round wafer; the inscribed closed pattern includes an even number of straight edges, and each one of straight edges is parallel to another of the straight edges and has a length equal to that of the another of the straight edges. The chip packaging method includes: fixing the plurality of wafer parts on a first panel level substrate and forming a packaging structure on each chip; wherein the plurality of wafer parts are arranged closely on the first panel level substrate without being overlapped with each other.

    Organic electroluminescent device, manufacturing method thereof and electronic equipment
    116.
    发明授权
    Organic electroluminescent device, manufacturing method thereof and electronic equipment 有权

    公开(公告)号：US10115909B2

    公开(公告)日：2018-10-30

    申请号：US14907047

    申请日：2015-08-21

    Applicant: Boe Technology Group Co., Ltd. ,  Ordos Yuansheng Optoelectronics Co., Ltd.

    Inventor： Haidong Wu ,  Yun Qiu ,  Weilin Lai

    IPC: H01L51/00 ,  C09K11/06 ,  H01L51/56 ,  H01L51/50 ,  H01L51/52

    Abstract: The embodiments of the present invention provide an organic electroluminescent device, a manufacturing method thereof and an electronic equipment. The organic electroluminescent device comprises: an anode layer, a hole transport layer, a first light emitting layer, a second light emitting layer, an electron transport layer, and a cathode layer stacked in sequence; wherein the first light emitting layer and the second light emitting layer comprise a same substrate material; the first light emitting layer and/or the second light emitting layer are doped such that a hole mobility of the first light emitting layer is equal to an electron mobility of the second light emitting layer. In the embodiments of the present invention, two light emitting layers with the same substrate material are applied, which can realize a balanced injection for electrons and holes, thereby improving the efficiency and lifetime of the organic electroluminescent device.

    Rearview mirror
    118.
    发明授权
    Rearview mirror 有权

    公开(公告)号：US09914394B2

    公开(公告)日：2018-03-13

    申请号：US14906012

    申请日：2015-08-19

    Applicant: BOE TECHNOLOGY GROUP CO., LTD. ,  CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.

    Inventor： Shenglin Sun ,  Feng Bai ,  Yun Qiu ,  Zhidong Wang ,  Junguo Liu ,  Zhiguo Chen ,  Lihua Liu

    IPC: G02B26/00 ,  B60R1/08 ,  G02B26/02 ,  F21V8/00

    CPC classification number: B60R1/088 ,  G02B6/0011 ,  G02B26/005 ,  G02B26/02

    Abstract: The present invention provides a rearview mirror comprising a panel and a control circuit, a first substrate in the panel is provided with a planar transparent electrode layer, a second substrate is provided with a transparent hydrophobic material layer and multiple block electrodes, a side of the transparent hydrophobic material layer facing the first substrate is provided with multiple cells, lightproof electro-wetting ink is provided within each cell, the block electrodes are provided on a side of the transparent hydrophobic material layer away from the first substrate and can at least reflect part of light entering the rearview mirror from first substrate side, the control circuit is configured to control area of each cell covered by the electro-wetting ink in the cell by controlling a change in intensity of the electric field between the planar transparent electrode layer and the block electrodes.

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