公开(公告)号：US09982144B2

公开(公告)日：2018-05-29

申请号：US15100588

申请日：2014-12-19

Applicant: Mitsubishi Materials Electronic Chemicals Co., Ltd.

Inventor： Kensuke Kageyama

IPC: H01B1/02 ,  C09D5/24 ,  C09D11/52 ,  C09J9/02 ,  C09J11/00 ,  C09J201/00 ,  C23C18/16 ,  C23C18/31 ,  C23C18/44 ,  H01B1/22 ,  C23C18/42 ,  C23C18/52 ,  C08J3/12 ,  C08K9/10 ,  C09D163/00 ,  C09J11/06 ,  C09J11/08 ,  C09J7/00 ,  C09J11/04

CPC classification number: C09D5/24 ,  C08J3/128 ,  C08J2325/06 ,  C08J2333/00 ,  C08J2361/06 ,  C08K9/10 ,  C08K2201/001 ,  C09D7/40 ,  C09D7/62 ,  C09D7/63 ,  C09D7/65 ,  C09D7/68 ,  C09D7/69 ,  C09D7/70 ,  C09D11/52 ,  C09D163/00 ,  C09J7/00 ,  C09J7/10 ,  C09J9/02 ,  C09J11/00 ,  C09J11/04 ,  C09J11/06 ,  C09J11/08 ,  C09J201/00 ,  C09J2203/318 ,  C23C18/16 ,  C23C18/1633 ,  C23C18/1641 ,  C23C18/165 ,  C23C18/31 ,  C23C18/42 ,  C23C18/44 ,  C23C18/52 ,  H01B1/02 ,  H01B1/22

Abstract: Provided are highly reliable silver-coated conductive particles, which are prevented from an occurrence of migration, the silver-coated conductive particles in which: a tin layer is formed on a surface of each spherical base particle, and a silver plating layer is formed on a surface of the tin layer, and a surface of the silver plating layer is coated with a water repellent layer: the water repellent layer includes an organic sulfur compound that is mainly composed of a sulfide compound or a surfactant such as polyoxyethylene ethers: and a molded body that is formed by pressing the silver-coated conductive particles at a pressure of 14.7 MPa has a contact angle with water of 125 degree or more.

公开(公告)号：US20180138548A1

公开(公告)日：2018-05-17

申请号：US15568061

申请日：2016-04-20

Applicant: RHODIA OPERATIONS

Inventor： Olivier BUISINE

IPC: H01M10/0565 ,  C08G77/46 ,  C08K5/42 ,  G02F1/15

CPC classification number: H01M10/0565 ,  C08G77/46 ,  C08K5/42 ,  C08K2201/001 ,  G02F1/15 ,  G02F2001/164 ,  H01M2300/0082 ,  Y02E60/13

Abstract: The invention relates to a polymer electrolyte comprising a silicone polymer bearing pending polyoxyalkylene ether groups, at least one fluorinated salt and a solvent, said solvent representing between 10% and 60% by weight, relative to the total weight of the silicone polymer bearing pending polyoxyalkylene ether groups, of the fluorinated salt and of the solvent, and said solvent comprising at least one polyether solvent. In addition, the invention also relates to a process for producing said polymer electrolyte and to the uses thereof as an electrolyte in an electrochemical device, in particular as an electrolyte in a battery or in an electronic display device, in particular an electrochemical device.

公开(公告)号：US20180134938A1

公开(公告)日：2018-05-17

申请号：US15574642

申请日：2016-05-18

Applicant: Momentive Performance Materials Japan LLC

Inventor： Daigo HIRAKAWA ,  Masanori TAKANASHI

IPC: C09K5/14 ,  C08K3/38 ,  C08K3/28 ,  C08K7/18

CPC classification number: C09K5/14 ,  C08K3/28 ,  C08K3/38 ,  C08K5/5415 ,  C08K7/16 ,  C08K7/18 ,  C08K2003/282 ,  C08K2003/385 ,  C08K2201/001 ,  C08K2201/003 ,  C08K2201/005 ,  C08L83/04

Abstract: The present invention provides a thermally conductive composition good in thermal conductivity, low in viscosity and easy in application. The thermally conductive composition is a thermally conductive composition including (A) a spherical thermally conductive filler and (B) an alkoxysilane compound or dimethylpolysiloxane, wherein the spherical thermally conductive filler of component (A) is a mixture formulated with specific ratios of fillers having different average particle sizes, the mixture being formulated with a spherical thermally conductive filler made of a nitride and having an average particle size of 50 μm or more in an amount of 30% by mass or more.

公开(公告)号：US20180134920A1

公开(公告)日：2018-05-17

申请号：US15572778

申请日：2016-05-23

Applicant: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.

Inventor： Kouji TAKAMI ,  Yoshihisa YAMAMOTO ,  Kenji KAMINO

IPC: C09J7/30 ,  B32B7/12 ,  B32B15/04 ,  B32B15/08 ,  C09J7/28 ,  C09J9/02 ,  H05K1/02

CPC classification number: C09J7/30 ,  B32B7/12 ,  B32B15/04 ,  B32B15/08 ,  B32B15/092 ,  B32B2255/06 ,  B32B2255/26 ,  B32B2307/212 ,  B32B2457/08 ,  C08K3/32 ,  C08K2201/001 ,  C09J7/28 ,  C09J9/02 ,  C09J153/005 ,  C09J163/00 ,  C09J2201/602 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2400/163 ,  C09J2453/00 ,  C09J2463/00 ,  C09K17/42 ,  H05K1/02 ,  H05K1/0216 ,  H05K9/0086 ,  C08L63/00 ,  C08K2003/329

Abstract: There is provided a shielding film that simultaneously satisfies excellent high-speed transmission characteristics and excellent flame retardancy. A shielding film according to the present invention includes: a metal layer; and a conductive adhesive layer arranged on one side of the metal layer. The conductive adhesive layer contains a cured product of an epoxy resin and a carboxyl group-containing elastomer, an organic phosphorus-based flame retardant, and a conductive filler; the metal layer has a thickness of from 0.3 μm to 7 μm; and a conductive adhesive forming the conductive adhesive layer contains 10 parts by weight to 50 parts by weight of the organic phosphorus-based flame retardant and 10 parts by weight to 80 parts by weight of the conductive filler with respect to 100 parts by weight of a total of the epoxy resin and the carboxyl group-containing elastomer.

公开(公告)号：US20180118960A1

公开(公告)日：2018-05-03

申请号：US15846493

申请日：2017-12-19

Applicant: Quirklogic, Inc.

Inventor： Mahshid Sam ,  Rustom B. Bhiladvala

IPC: C09D7/40 ,  C09D5/24 ,  C09D101/12 ,  C09D101/28 ,  C09D123/02 ,  C09D133/02

CPC classification number: C09D7/70 ,  C08K7/06 ,  C08K9/02 ,  C08K2003/0806 ,  C08K2003/0831 ,  C08K2201/001 ,  C08K2201/003 ,  C08K2201/011 ,  C08L1/12 ,  C08L1/284 ,  C09D5/24 ,  C09D101/12 ,  C09D101/28 ,  C09D123/02 ,  C09D133/02

Abstract: A material composition for manufacturing a translucent conductive film includes a fluid. The material composition further includes nanostructures disposed within the fluid. The material composition further includes a component that modifies a structure of a joint formed between at least two nanostructures of the plurality of nanostructures after the component is activated. The component may be activated by applying heath or optical radiation to the component.

公开(公告)号：US20180118888A1

公开(公告)日：2018-05-03

申请号：US15572501

申请日：2016-05-05

Applicant: SOREQ NUCLEAR RESEARCH CENTER ,  NANYANG TECHNOLOGICAL UNIVERSITY

Inventor： Assaf BOLKER ,  Nurit ATAR ,  Ronen VERKER ,  Eitan GROSSMAN ,  Manuela LOEBLEIN ,  Siu Hon Hon TSANG ,  Hang Tong Edwin TEO

IPC: C08G73/10 ,  C08K3/04

CPC classification number: C08G73/1071 ,  C08G73/105 ,  C08K3/042 ,  C08K2201/001 ,  C08K2201/011 ,  C08L79/08

Abstract: A polyimide produced from a polyamic acid solution of PMDA-ODA (pyromellitic dianhydryde-oxydianiline) in N-methyl-2-pyrrolidone (NMP).

公开(公告)号：US09958425B1

公开(公告)日：2018-05-01

申请号：US15426412

申请日：2017-02-07

Applicant: THE MITRE CORPORATION

Inventor： Sichu Li

IPC: G01N33/00 ,  G01N21/64

CPC classification number: G01N33/588 ,  B05D3/007 ,  C08K9/10 ,  C08K2201/001 ,  C08K2201/011 ,  G01N21/643 ,  G01N21/6489 ,  G01N21/783 ,  G01N33/0031 ,  G01N2021/6441

Abstract: A method of detecting the presence of a chemical vapor of interest using a quantum dot-polymer nanocomposite sensor array is provided. The method includes forming a plurality of sensors respectively of different nanocomposite films and a plurality of QDs. The plurality of sensors are exposed to a target chemical vapor and impingement by an excitation light source. Fluorescence emission intensity of the sensors is measured for a preselected duration of time and then the sensors are placed into contact with a chemical vapor. The changes in fluorescence emission intensity for all sensors are detected over time and the combined changes in fluorescence are compared to establish a unique combined response to identify the target chemical vapor.

公开(公告)号：US09944831B2

公开(公告)日：2018-04-17

申请号：US15021094

申请日：2014-09-24

Applicant: LINTEC CORPORATION

Inventor： Wataru Morita ,  Kunihisa Kato ,  Tsuyoshi Mutou

IPC: C09J7/00 ,  C09J9/02 ,  H01L35/32 ,  C09J9/00 ,  C09J11/04 ,  C09J175/04 ,  C09J183/04 ,  C09J201/00 ,  H01L35/30 ,  H01L35/34 ,  C08G18/62 ,  C08G18/81 ,  C08K3/08 ,  C08K3/22 ,  C08K3/28 ,  C08K3/38

CPC classification number: C09J7/00 ,  C08G18/6229 ,  C08G18/6254 ,  C08G18/8116 ,  C08K3/08 ,  C08K3/22 ,  C08K3/28 ,  C08K2003/385 ,  C08K2201/001 ,  C09J7/10 ,  C09J9/00 ,  C09J9/02 ,  C09J11/04 ,  C09J175/04 ,  C09J183/04 ,  C09J201/00 ,  C09J2201/40 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2475/00 ,  C09J2483/00 ,  H01L35/30 ,  H01L35/32 ,  H01L35/34

Abstract: The present invention provides a thermally conductive adhesive sheet that can be easily laminated on an electronic device without an adhesive layer therebetween and can further selectively dissipate heat in a particular direction to provide a sufficient temperature difference to the inside of the electronic device, a method for producing the same, and an electronic device using the same. The present invention includes a thermally conductive adhesive sheet comprising a high thermally conductive portion and a low thermally conductive portion, wherein the high thermally conductive portion and the low thermally conductive portion have adhesiveness, and the high thermally conductive portion and the low thermally conductive portion each independently constitute an entire thickness of the thermally conductive adhesive sheet, or at least either the high thermally conductive portion or the low thermally conductive portion constitutes a portion of a thickness of the thermally conductive adhesive sheet, and a method for producing the thermally conductive adhesive sheet, and an electronic device using the thermally conductive adhesive sheet.

公开(公告)号：US20180094113A1

公开(公告)日：2018-04-05

申请号：US15833689

申请日：2017-12-06

Applicant: International Business Machines Corporation

Inventor： Joseph Kuczynski ,  Kevin M. O'Connell ,  Chelsie M. Peterson ,  Mark D. Plucinski ,  Timothy J. Tofil

IPC: C08K3/22 ,  C08K7/06 ,  H01L23/373 ,  C09K5/14

CPC classification number: C08K3/22 ,  C08K7/06 ,  C08K2201/001 ,  C09K5/14 ,  H01L23/3733

Abstract: Disclosed is a shape memory polymer (SMP) thermal interface material. The shape memory polymer may include a SMP matrix. The SMP matrix may include a liquid crystal elastomer. The SMP material may also include a thermally conductive filler embedded within the SMP matrix. The thermally conductive filler may include one or more substantially aligned subcomponents.

公开(公告)号：US20180086954A1

公开(公告)日：2018-03-29

申请号：US15705470

申请日：2017-09-15

Applicant: NITTO DENKO CORPORATION

Inventor： Ryo MORIOKA ,  Akira HIRAO ,  Mitsuhiro KANADA

IPC: C09J133/08 ,  C09J9/02 ,  C09J11/04

CPC classification number: C09J133/08 ,  C08K3/013 ,  C08K2201/001 ,  C09J7/385 ,  C09J9/02 ,  C09J11/04 ,  C09J2201/602 ,  C09J2201/622 ,  C09J2203/318 ,  C09J2203/322 ,  C09J2203/326 ,  C09J2205/102

Abstract: Provided is a filler-containing pressure-sensitive adhesive tape having an excellent pressure-sensitive adhesive strength while suppressing the occurrence of a volatile component. The filler-containing pressure-sensitive adhesive tape includes a pressure-sensitive adhesive layer containing a pressure-sensitive adhesive resin containing an acrylic polymer and a filler dispersed in the pressure-sensitive adhesive resin, in which the acrylic polymer contains at least a constituent unit derived from a (meth)acrylic acid alkyl ester having a linear or branched alkyl group having 1 to 20 carbon atoms, a constituent unit derived from a nitrogen-containing monomer, and a constituent unit derived from a carboxyl group-containing monomer, and has a ratio (mass ratio) of the constituent unit derived from the carboxyl group-containing monomer to the constituent unit derived from the nitrogen-containing monomer of from 0.01 to 40.