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公开(公告)号：US20210010891A1
公开(公告)日：2021-01-14
申请号：US17034533
申请日：2020-09-28
发明人： Alexander A. Ned , Scott Goodman
摘要： Header construction and techniques are disclosed that utilize header layers that provide support for electrical interconnections. A sensor header assembly includes: an upper header layer having upper through holes arranged in a first configuration; a lower header layer having lower through holes arranged in a second configuration axially offset relative to the first configuration; depressions extending from the lower header layer top surface and partially through the lower header layer, each depression defining a footprint corresponding to the first configuration of the corresponding upper through holes of the upper header layer; upper header pins extending through the corresponding upper through holes and at least partially into the corresponding lower level depressions; and lower header pins extending through the corresponding lower through holes and in electrical communication with the corresponding upper header pins. The depressions form support surfaces for supporting at least the corresponding upper header pins during high-pressure operation.
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公开(公告)号：US20210010890A1
公开(公告)日：2021-01-14
申请号：US16969887
申请日：2018-02-15
发明人： Levent ERKOCAK
摘要： A pressure sensing device includes: a body assembly having a main body with a sensor housing defined by an inner bottom wall and a side wall of the main body extending upwardly from the bottom wall into which a pressure sensor is disposed; the pressure sensor provided with a lower surface to be exposed to an applied pressure and having an upper contact portion disposed at an upper surface of the pressure sensor; a fluid inlet channel formed on the main body and a fluid pressure port formed in the sensor housing in communication with the fluid inlet channel and a connector assembly being at least partly placed into the body assembly having a connector body with an electrical circuit for providing an electrical output signal corresponding to the applied pressure; the electronic circuit having a connection member housing portion.
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公开(公告)号：US10890502B2
公开(公告)日：2021-01-12
申请号：US16114156
申请日：2018-08-27
发明人： Shuntaro Miyake , Shojiro Kurimata
摘要： A pressure sensor device including: an absolute pressure sensor unit; a sensor case to accommodate the absolute pressure sensor unit; and an adhesive provided between the absolute pressure sensor unit and the sensor case to fix the absolute pressure sensor unit and the sensor case together, is provided. The sensor case has protrusions on the bottom surface, the absolute pressure sensor unit is provided above the protrusions, and there is space free of the adhesive at a part of a region between the absolute pressure sensor unit and the sensor case, and under the absolute pressure sensor unit.
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公开(公告)号：US20210003467A1
公开(公告)日：2021-01-07
申请号：US16918508
申请日：2020-07-01
申请人： AZBIL CORPORATION
发明人： Masaru Soeda , Takuya Ishihara , Masashi Sekine
IPC分类号： G01L9/06 , G01L19/14 , G01L9/00 , G01L9/08 , H01L41/113
摘要： A pressure sensor includes a movable electrode formed in a movable region of a diaphragm, and a fixed electrode formed opposite to the movable electrode. A pressure receiving surface of the diaphragm is held in an inactive state. The inactive pressure receiving surface of the diaphragm is in a state in which molecules of gas to be measured are hard to absorb onto the pressure receiving surface. The pressure receiving surface of the diaphragm can be made inactive by predetermined surface treatment. A layer for making the pressure receiving surface of the diaphragm inactive is formed by the surface treatment, and the pressure receiving surface of the diaphragm is held inactive with the presence of the layer.
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公开(公告)号：US20200378855A1
公开(公告)日：2020-12-03
申请号：US16497272
申请日：2018-03-21
发明人： Christian Huber , Klaus Lechner , Friedbert Roether , Karin Pohley , Amadeus Mlynarski , Stefan Niedermeier
摘要： An electronic control unit for a vehicle, including: a pressure-sensor-element (PSE); a housing having a pressure-guide by which the PSE has a pressure-medium applied to it under pressure; an evaluation-unit to generate a pressure-signal, dependent on the pressure detected by the pressure-sensor-element in the pressure-guide; and a circuit-carrier on which at least part of control-electronics of the control-unit is arranged; the pressure-signal of the evaluation-unit being put in the control-electronics, the pressure-guide making direct contact with the circuit-carrier and a sealing-element arranged in the contact-region between the pressure-guide and the circuit-carrier, the sealing-element sealing a region of the pressure-guide to which the pressure-medium is applied under pressure from the surroundings, the PSE being arranged directly on the circuit-carrier, such that the PSE is arranged in the region of the pressure-guide to which the pressure-medium is applied under pressure, and the evaluation-unit being electrically directly connected to the circuit-carrier.
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96.发明授权公开(公告)号：US10852318B2
公开(公告)日：2020-12-01
申请号：US15866028
申请日：2018-01-09
发明人： Fumiya Ueno
IPC分类号： G01P15/125 , G01F1/684 , G01F1/692 , F02D41/18 , G01F5/00 , G01F15/14 , G01L19/00 , G01L9/00 , G01L19/14 , G01P1/02 , G01P15/12
摘要： An inner housing part has through-holes for connecting first lead pins (power supply terminal, output terminal, ground terminal) with the connector pins. The inner housing part has grooves that house second lead pins for adjusting output signals of a sensor chip. Three of the grooves each has a shape in which a distance between opposing sides of the groove is less than a diameter of the second lead pin that corresponds to the groove. The inner housing part is fixed to a case by a thermoset adhesive so as to house lead pins arranged in the case included in a sensor element. The second lead pins are fitted in the grooves, suppressing lifting of the inner housing part during curing of the adhesive.
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公开(公告)号：US20200326252A1
公开(公告)日：2020-10-15
申请号：US16824765
申请日：2020-03-20
摘要： A pressure sensor and method of manufacturing the like are provided for determining a pressure of a fluid. An example pressure sensor includes a pressure sensor housing sealably attached to a diaphragm at a first end. The header includes a lip configured to engageably fit with the second end of the pressure sensor housing to create a hermetically sealed component compartment. The header also includes header pin(s) configured to transmit electrical signals between an interior and an exterior of the hermetically sealed component compartment. A sensing element and a processor are disposed within the hermetically sealed component compartment and in communication with one another. The sensing element is mounted to the processor within the hermetically sealed compartment. The corresponding method of manufacture is also provided.
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公开(公告)号：US10801908B2
公开(公告)日：2020-10-13
申请号：US16086105
申请日：2016-12-08
发明人： Yusuke Fuji , Tatsunori Yamada , Daiki Goto , Junki Iwabuchi
摘要： A pressure sensor including: a cylindrical casing extending in an axial direction; a diaphragm joined to the distal end side of the casing, extending in a direction intersecting the axis of the casing and deforming in accordance with pressure received on the distal end side; and a sensor section disposed inside the casing and outputting an electric signal corresponding to the deformation of the diaphragm. The diaphragm is provided with a plate-shaped base part and three or more protruding parts protruding from the distal end side surface of the base part toward the distal end side and set apart from each other. The relationships 0.05≤H≤2.5T and 0.05≤(S2/S1)≤0.8 are satisfied, where T (thickness), H (length), S1 (area of base distal end surface) and S2 (total area of protruding distal end surfaces) are as defined herein.
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公开(公告)号：US10800651B2
公开(公告)日：2020-10-13
申请号：US15496987
申请日：2017-04-25
申请人： ANALOG DEVICES, INC.
发明人： Thomas M. Goida
IPC分类号： G01L9/00 , G01C5/06 , H01L29/84 , B81B7/00 , H01L23/24 , H01L23/20 , H01L23/49 , H01L23/538 , H01L23/50 , H01L23/04 , H01L23/00 , G01L19/14 , H01L23/498 , H01L23/31
摘要： An integrated device package is disclosed. The integrated device package can include a packaging structure defining a cavity. An integrated device die can be disposed at least partially within the cavity. A gel can be disposed within the cavity surrounding the integrated device. A portion of the gel can be disposed between a lower surface of the integrated device die and an upper surface of the packaging structure within the cavity.
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公开(公告)号：US20200319050A1
公开(公告)日：2020-10-08
申请号：US16376703
申请日：2019-04-05
发明人： Lamar Floyd Ricks , Ian Bentley , Jim Cook , Josh M. Fribley
摘要： A pressure sensor is provided. The pressure sensor includes a substrate, and a first pressure sensing element, a second pressure sensing element, and sensor conditioning circuitry disposed on the first surface of the substrate. The sensor conditioning circuitry is electronically coupled to the first pressure sensing element and the second pressure sensing element.
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