Abstract:
A fluorescent lamp type light emitting apparatus is provided. The light emitting apparatus comprises a cover, a light emitting module, radiation pads, and cap parts. The cover comprises a first cover and a transmissive second cover coupled to the first cover. The light emitting module comprises a plurality of light emitting diodes in the cover. The radiation pads are disposed on the light emitting module. The cap parts comprise electrode terminals at both ends of the cover.
Abstract:
An electronic component includes a housing, a heat-generating component, a heat sink, and a sealing element. The housing is made of a first metallic material. The heat-generating component is disposed in the housing. The heat sink, which is made of a second metallic material, is disposed adjacent the heat-generating component and configured to dissipate heat from the heat-generating component. The sealing element is disposed between the housing and the heat sink and insulates the second metallic material from the first metallic material.
Abstract:
An integrated LED lamp housing can include a heat radiation section and a light transmission section. The integrated LED lamp housing can be prepared by co-extruding different polycarbonate resin compositions.
Abstract:
A lighting module may be provided that includes: a bottom plate having thermally a heat radiating characteristic; a light emitter comprising a substrate disposed on the bottom plate and a plurality of light emitting devices disposed on the substrate; an optical structure covering the light emitter, the optical structure comprising an outer frame surrounding the substrate and a plurality of lenses corresponding to the plurality of the light emitting devices; an upper case covering the optical structure and coupled to the bottom plate and having an opening for allowing lights which have passed through the plurality of lenses of the optical structure; and a gasket disposed between the outer frame of the optical structure and the upper case.
Abstract:
A lighting device may be provided that includes: a heat sink; a member which has a polygonal pillar shape having at least three sides and is disposed on the heat sink, wherein the sides are inclined at a predetermined angle toward the center of the heat sink; and a light source which is disposed on at least one among the sides of the member, wherein the light source includes: a substrate; at least two light emitting devices which are symmetrically disposed on the substrate with respect to the center of the substrate; and at least two lens units which are disposed on the light emitting devices respectively, and consequently, it is possible to meet U.S. Energy Star and ANSI specifications, to remarkably improve rear light distribution characteristics and to remove a dark portion.
Abstract:
An LED array is mounted on a base that is thermally coupled to a heat spreader. At least one aperture is provided between the support area and an edge of the heat spreader. The heat spreader may be coupled to a thermal pad which has sufficient thermal conductivity and is sufficiently thin to allow the thermal resistivity between the heat spreader and a corresponding heat sink to be below a predetermined value.
Abstract:
An improved led fixture apparatus and manufacturing methods thereto is disclosed herein. In preferred embodiments, the apparatus comprises a power supply, a base, a circuit board mounted within the base, a LED connected to the circuit board, and wherein the base is constructed from material comprising forged metal and configured to act as a heat sync. In preferred embodiments, the base is made from forged aluminum alloy anodized for emissivity conduction and comprises a plurality of fins adapted to increase the surface area of the base to improve heat dissipation.
Abstract:
Thermal management techniques and methods for various types of structures that require a thermal property, such as thermal conductivity and/or flame retardance, and have a surface in proximity to a source of thermal energy. Such a structure includes a substrate formed of a metallic material or a thermally conductive plastic material, and a white fluoropolymer layer directly on a surface of the substrate without a discrete adhesive layer therebetween. The white fluoropolymer layer defines an outermost surface of the structure, has a reflectivity of greater than 95%, and has a thickness sufficient to inhibit degradation of the thermal property of the structure resulting from impingement of the surface by the thermal energy.
Abstract:
A thermally efficient OGC lamp includes a positive terminal; a negative terminal; a connecting member formed with the negative terminal; a circuit board disposed substantially within the negative terminal; a housing formed with the connecting member; a thermally efficient element filled in the housing; a sealing member disposed on the connecting member; a lens disposed on a bottom of the housing and being distal the connecting member; and a plurality of integrated circuits disposed in the lens for emitting light. The integrated circuits are electrically connected to the circuit board. The circuit board is electrically connected to both the positive terminal and the negative terminal. The thermally efficient element is either oil or wax.
Abstract:
The present invention discloses a LED light bulb, comprising: a LED printed circuit board, a sealed body and a base. The sealed body made of two thermoplastic parts form vapor transport channel inside the body that extends between two heat transfer locations spaced apart on an exterior surface of the body, a wick or a plurality of grooves in the vapor transport channel wall that extends between the two heat transfer locations, and a working fluid that partially fills the vapor transport channel. In a method of making this LED light bulb, the two thermoplastic parts are desirably formed together as a seamless monolithic structure, the LED printed circuit board is bent, mounted and fixed on the sealed body. With the apparatus and manufacturing method introduced by present invention, the LED light bulb would be ease for manufacturing, heat dissipation effective and cost effective. The sealed body transfers heat as a conventional heat pipe.