Invention Application
- Patent Title: LED LIGHT BULB AND MANUFACTURING METHOD OF THE SAME
- Patent Title (中): LED灯泡及其制造方法
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Application No.: US13897358Application Date: 2013-05-18
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Publication No.: US20140340913A1Publication Date: 2014-11-20
- Inventor: HONG JUAN CUI
- Applicant: HONG JUAN CUI
- Main IPC: F21V29/00
- IPC: F21V29/00 ; F21K99/00

Abstract:
The present invention discloses a LED light bulb, comprising: a LED printed circuit board, a sealed body and a base. The sealed body made of two thermoplastic parts form vapor transport channel inside the body that extends between two heat transfer locations spaced apart on an exterior surface of the body, a wick or a plurality of grooves in the vapor transport channel wall that extends between the two heat transfer locations, and a working fluid that partially fills the vapor transport channel. In a method of making this LED light bulb, the two thermoplastic parts are desirably formed together as a seamless monolithic structure, the LED printed circuit board is bent, mounted and fixed on the sealed body. With the apparatus and manufacturing method introduced by present invention, the LED light bulb would be ease for manufacturing, heat dissipation effective and cost effective. The sealed body transfers heat as a conventional heat pipe.
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