Abstract:
An organic electroluminescent (EL) display device and a method of manufacturing the same are provided. The organic electroluminescent display device includes a rear substrate, a organic EL portion formed on one surface of the rear substrate with a first electrode, an organic layer and a second electrode sequentially laminated. The front substrate is coupled to the rear substrate to seal an internal space in which the organic EL portion is accommodated, for isolating the organic EL portion from the outside. The front substrate further has a transparent moisture-absorbing layer coated on its internal surface.
Abstract:
A thin film transistor which may be included in a pixel circuit includes: a substrate; a semiconductor layer formed on the substrate and including a source region, a first drain region spaced apart from the source region by a first current path, and a second drain region spaced apart from the source region by a second current path having a length different from that of the first current path; a gate electrode insulated from the semiconductor layer by a gate insulating layer; a source electrode connected to the source region of the semiconductor layer; a first drain electrode connected to the first drain region of the semiconductor layer; and a second drain electrode connected to the second drain region of the semiconductor layer. Currents having different magnitudes may be simultaneously provided through the first current path and the second current path.
Abstract:
An organic light-emitting display apparatus is disclosed. The organic light-emitting display apparatus includes a first sub-pixel, a second sub-pixel, and a third sub-pixel, where each of said first, second and third sub-pixels displays a different color, a substrate, a first electrode disposed on the substrate, a second electrode disposed on the first electrode, facing the first electrode, an organic emission layer disposed between the first electrode and the second electrode, including a first organic emission layer, a second organic emission layer, and a third organic emission layer, and an electron acceptor layer disposed between the first electrode and the second electrode configured to contact the organic emission layer, where the first organic emission layer is disposed in the first sub-pixel, the second organic emission layer is disposed in the second sub-pixel, and the third organic emission layer is commonly disposed over the first sub-pixel, the second sub-pixel, and the third sub-pixel, and where the electron acceptor layer is disposed between the first organic emission layer and the third organic emission layer in the first sub-pixel and between the second organic emission layer and the third organic emission layer in the second sub-pixel.
Abstract:
A method of preparing an organic light-emitting device includes forming an organic emission unit on a substrate, and forming a thin film encapsulation layer that contacts an environmental element, and that includes at least one inorganic layer including a low temperature viscosity transition (LVT) inorganic material, wherein the inorganic layer is formed using a process including forming a pre-inorganic layer including the LVT inorganic material by providing the LVT inorganic material onto the organic emission unit on which the environmental element is located, performing a first healing process on the pre-inorganic layer at a temperature greater than a viscosity transition temperature of the LVT inorganic material, and performing a second healing process on the pre-inorganic layer having undergone the first healing process to increase a binding force between the environmental element and the LVT inorganic material, and to increase a binding force among the LVT inorganic material.
Abstract:
An organic light-emitting display device including: a substrate; an organic emission unit that is formed on the substrate and includes a laminate of a first electrode, an organic emission layer, and a second electrode; at least one organic layer that is formed on the substrate; and at least one inorganic layer that is formed on the substrate, contacts the organic layer in a planar direction, and contacts an environmental element to surround at least one border of the environmental element.
Abstract:
A method of preparing an organic light-emitting device having excellent sealing characteristics against external environment and flexibility.
Abstract:
An organic light emitting diode (OLED) display includes a red pixel, a green pixel, and a blue pixel. The red pixel, the green pixel and the blue pixel each includes: a pixel electrode; a hole auxiliary layer on the pixel electrode; a blue organic emission layer on the hole auxiliary layer; an electron auxiliary layer on the blue organic emission layer; and a common electrode on the electron auxiliary layer. The red pixel and the green pixel include: a red boundary layer and a green boundary layer, respectively; a red resonance assistance layer and a green resonance assistance layer, respectively; and a red organic emission layer and a green organic emission layer formed between the red resonance assistance layer and the blue organic emission layer, and between the green resonance assistance layer and the blue organic emission layer, respectively.
Abstract:
Disclosed is a photosensitive resin composition including (A) a photopolymerizable monomer including a compound represented by the following Chemical Formula 1, wherein the substituents of Chemical Formula 1 are the same as defined in the specification, (B) a binder resin, (C) a photopolymerization initiator, (D) a pigment and (E) a solvent, and a color filter using the same.
Abstract:
A liquid crystal display with an integrated touch screen panel is disclosed. According to some aspects, conductive patterns or conducting patterns provided to the LCD are used as driving electrodes of the touch screen panel. A driving electrode of the touch screen panel may be formed on one surface of a polarizing plate or window attached to the LCD so as to be positioned close to a contact point, thereby improving touch sensitivity.
Abstract:
A semiconductor package includes a wiring board including an upper connection pad provided on a first surface and a lower connection pad provided on a second surface opposite to the first surface, a semiconductor chip having a bonding pad area in which a bonding pad is provided and an adhesive area except the bonding pad area, and being mounted on the first surface of the wiring board in a flip-chip manner such that the bonding pad is electrically connected to the upper connection pad, a first molding layer provided between the adhesive area of the semiconductor chip and the first surface of the wiring board, and a second molding layer provided between the bonding pad area of the semiconductor chip and the first area of the wiring board while covering the first surface of the wiring board and the semiconductor chip. The first molding layer has a lower modulus than the second molding layer.