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公开(公告)号:USD636323S1
公开(公告)日:2011-04-19
申请号:US29352527
申请日:2009-12-22
申请人: Andre Cote
设计人: Andre Cote
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公开(公告)号:US20100218899A1
公开(公告)日:2010-09-02
申请号:US12759400
申请日:2010-04-13
申请人: Thomas J. Clare , Andre Cote , Eric Eckstein
发明人: Thomas J. Clare , Andre Cote , Eric Eckstein
CPC分类号: H01L24/81 , B23K20/004 , B23K2101/32 , B23K2101/40 , G06K19/07718 , G06K19/07745 , G06K19/07749 , G06K19/0775 , H01L21/67132 , H01L23/49855 , H01L24/75 , H01L24/83 , H01L2223/6677 , H01L2224/05573 , H01L2224/16 , H01L2224/2929 , H01L2224/293 , H01L2224/75 , H01L2224/78 , H01L2224/81121 , H01L2224/81801 , H01L2224/83851 , H01L2224/85 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/0105 , H01L2924/01054 , H01L2924/01057 , H01L2924/01061 , H01L2924/01077 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/19043 , Y10T156/12 , H01L2924/00 , H01L2224/29075 , H01L2924/00014
摘要: A method and apparatus for bonding integrated circuits uniquely suited to high volume tag production is described, where conductive material of a substrate at the die-attach-area is cut before an IC chip or transponder is placed on the conductive material over the cut and bonded. The apparatus performs the method of placing a first chip on a substrate having a conductive layer, measuring the location of the first chip on the substrate, cutting the conductive layer at a location of an expected subsequently placed chip to form a cut based on the measured location of the first chip, and placing the subsequently placed chip on the substrate over the cut.
摘要翻译: 描述了用于接合独特地适用于大容量标签制造的集成电路的方法和装置,其中在芯片附着区域之前的基板的导电材料在将IC芯片或应答器放置在切割和粘合的导电材料之前被切割 。 该装置执行将第一芯片放置在具有导电层的基板上的方法,测量基板上的第一芯片的位置,在预期的随后放置的芯片的位置处切割导电层,以基于测量的 第一芯片的位置,并将随后放置的芯片放置在切口上的基板上。
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公开(公告)号:US07709294B2
公开(公告)日:2010-05-04
申请号:US11166534
申请日:2005-06-24
申请人: Thomas J. Clare , Andre Cote , Eric Eckstein
发明人: Thomas J. Clare , Andre Cote , Eric Eckstein
CPC分类号: H01L24/81 , B23K20/004 , B23K2101/32 , B23K2101/40 , G06K19/07718 , G06K19/07745 , G06K19/07749 , G06K19/0775 , H01L21/67132 , H01L23/49855 , H01L24/75 , H01L24/83 , H01L2223/6677 , H01L2224/05573 , H01L2224/16 , H01L2224/2929 , H01L2224/293 , H01L2224/75 , H01L2224/78 , H01L2224/81121 , H01L2224/81801 , H01L2224/83851 , H01L2224/85 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/0105 , H01L2924/01054 , H01L2924/01057 , H01L2924/01061 , H01L2924/01077 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/19043 , Y10T156/12 , H01L2924/00 , H01L2224/29075 , H01L2924/00014
摘要: A method and apparatus for bonding integrated circuits uniquely suited to high volume tag production is described, where conductive material of a substrate at the die-attach-area is cut before an IC chip or transponder is placed on the conductive material over the cut and bonded. The apparatus performs the method of placing a first chip on a substrate having a conductive layer, measuring the location of the first chip on the substrate, cutting the conductive layer at a location of an expected subsequently placed chip to form a cut based on the measured location of the first chip, and placing the subsequently placed chip on the substrate over the cut.
摘要翻译: 描述了用于接合独特地适用于大容量标签制造的集成电路的方法和装置,其中在芯片附着区域之前的基板的导电材料在将IC芯片或应答器放置在切割和粘合的导电材料之前被切割 。 该装置执行将第一芯片放置在具有导电层的基板上的方法,测量基板上的第一芯片的位置,在预期的随后放置的芯片的位置处切割导电层,以基于测量的 第一芯片的位置,并将随后放置的芯片放置在切口上的基板上。
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公开(公告)号:US07646304B2
公开(公告)日:2010-01-12
申请号:US11400932
申请日:2006-04-10
申请人: Andre Cote , Detlef Duschek
发明人: Andre Cote , Detlef Duschek
IPC分类号: G08B13/14
CPC分类号: G06K19/07749 , G06K19/07718 , G06K19/0775 , G08B13/2414 , G08B13/2417 , G08B13/2437 , H01L21/4853 , H01L21/6835 , H01L23/49855 , H01L24/29 , H01L24/83 , H01L2221/68345 , H01L2223/6677 , H01L2224/16225 , H01L2224/838 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01033 , H01L2924/01072 , H01L2924/01079 , H01L2924/01082 , H01L2924/0781 , H01L2924/07811 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/30105 , Y10T29/4913
摘要: A method for efficiently producing a plurality of EAS or RFID tags or inlays that form a label ready for use. The process utilizes a first web of RFID chip straps or capacitor straps that are releasably secured to a liner using only a low tack adhesive and utilizes a second web of coils or antennas which are secured to a second liner. After indexing these two webs, selective heat and pressure are applied to the chips straps or to the capacitor straps to transfer them and electrically couple them to a corresponding coil or antenna. Where both chip straps and capacitor straps are applied to a common antenna, a third web of the additional strap is used in the process.
摘要翻译: 一种用于有效地生产形成准备使用的标签的多个EAS或RFID标签或嵌体的方法。 该方法利用RFID芯片带或电容器带的第一网片,其可释放地仅使用低粘性粘合剂固定到衬垫,并且利用固定到第二衬垫的线圈或天线的第二腹板。 在分离这两个网之后,将选择性的热和压力施加到芯片带或电容器带上以传送它们并将它们电耦合到相应的线圈或天线。 在将芯片带和电容器带都应用于公共天线的情况下,在该过程中使用附加带的第三网。
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公开(公告)号:US07564360B2
公开(公告)日:2009-07-21
申请号:US11679250
申请日:2007-02-27
申请人: Andre Cote , Farrokh Abadi
发明人: Andre Cote , Farrokh Abadi
IPC分类号: G08B13/14
CPC分类号: G01V15/00 , E05B73/0017 , G08B13/2434
摘要: A releasable security tag for attachment to an article of merchandise includes: a locking mechanism with a release for attaching the tag to the article of merchandise; an EAS resonant circuit or an RFID circuit for responding to a first RF signal at a predetermined frequency corresponding to the resonant circuit or to the RFID circuit; an ambient RF energy harvesting circuit; a release signal detection circuit coupled to and powered by the ambient RF energy harvesting circuit and an electro-mechanical actuator electrically coupled to the release signal detection circuit. The electro-mechanical actuator releases the locking mechanism whenever the release signal detection circuit receives a release signal.
摘要翻译: 用于附接到商品的可释放的安全标签包括:具有用于将标签附接到商品的释放的锁定机构; 用于响应于对应于谐振电路或RFID电路的预定频率的第一RF信号的EAS谐振电路或RFID电路; 环境RF能量收集电路; 耦合到环境RF能量收集电路并由其供电的释放信号检测电路和电耦合到释放信号检测电路的机电致动器。 每当释放信号检测电路接收释放信号时,机电执行器释放锁定机构。
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公开(公告)号:US20070205902A1
公开(公告)日:2007-09-06
申请号:US11679250
申请日:2007-02-27
申请人: Andre Cote , Farrokh Abadi
发明人: Andre Cote , Farrokh Abadi
IPC分类号: G08B13/14
CPC分类号: G01V15/00 , E05B73/0017 , G08B13/2434
摘要: A releasable security tag for attachment to an article of merchandise is disclosed. Features of the security tag include: a locking mechanism with a release for attaching the tag to the article of merchandise; an EAS resonant circuit or an RFID circuit for responding to a first RF signal at a predetermined frequency corresponding to the resonant circuit or to the RFID circuit; an ambient RF energy harvesting circuit; a release signal detection circuit coupled to and powered by the ambient RF energy harvesting circuit and an electro-mechanical actuator electrically coupled to the release signal detection circuit. The electro-mechanical actuator releases the locking mechanism whenever the release signal detection circuit receives a release signal.
摘要翻译: 公开了用于附接到商品的可释放的安全标签。 安全标签的特征包括:锁定机构,具有用于将标签附接到商品的释放件; 用于响应于对应于谐振电路或RFID电路的预定频率的第一RF信号的EAS谐振电路或RFID电路; 环境RF能量收集电路; 耦合到环境RF能量收集电路并由其供电的释放信号检测电路和电耦合到释放信号检测电路的机电致动器。 每当释放信号检测电路接收释放信号时,机电执行器释放锁定机构。
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公开(公告)号:US20070186839A1
公开(公告)日:2007-08-16
申请号:US11532720
申请日:2006-09-18
申请人: Daniel MERCIER , Philip GODFREY , Claude GAGNON , Andre COTE , Denys LAPOINTE , Mathieu DUQUETTE , Alex MIKLOSI
发明人: Daniel MERCIER , Philip GODFREY , Claude GAGNON , Andre COTE , Denys LAPOINTE , Mathieu DUQUETTE , Alex MIKLOSI
摘要: A boat has a hull and a deck supported by the hull. The deck has a rearward passenger area. A seat is disposed in the rearward passenger area. A first console is disposed on the deck at a front of the rearward passenger area and forwardly of the seat. The first console has a top. A first windshield is disposed generally transverse to a longitudinal axis of the boat. The first windshield is movable between a first position where the first windshield extends a first distance vertically above the top of the first console and a second position where at least a portion of the first windshield extends a second distance vertically below the top of the first console. When the first windshield is in the second position the at least one portion of the first windshield is in a substantially vertical position.
摘要翻译: 一艘船有一个船体和甲板,由船体支撑。 甲板上有一个向后的乘客区。 后排乘客区域设有座椅。 第一控制台设置在甲板上的后方乘客区域的前方,并且位于座椅的前方。 第一个控制台有一个顶部。 第一挡风玻璃大致横向于船的纵向轴线设置。 第一挡风玻璃可以在第一位置和第二位置之间移动,在第一位置,第一挡风玻璃垂直地延伸在第一控制台的顶部上方的第一距离和第二位置,其中第一挡风玻璃的至少一部分在第一控制台的顶部垂直延伸第二距离 。 当第一挡风玻璃处于第二位置时,第一挡风玻璃的至少一部分处于基本垂直的位置。
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公开(公告)号:US20070146143A1
公开(公告)日:2007-06-28
申请号:US11614475
申请日:2006-12-21
申请人: Andre Cote , Luis Soler Bonnin
发明人: Andre Cote , Luis Soler Bonnin
IPC分类号: G08B13/14
CPC分类号: G06K19/07749 , G08B13/2417 , G08B13/2445
摘要: A communication-ready corrugated article and method for making the corrugated article is disclosed. The corrugated article includes a linersheet (e.g., craft paper), an undulating medium (e.g., craft paper), a conductive strip (e.g., metal, aluminum, wire, coil), and a security chip (e.g., RFID chip, EAS chip, integrated circuit, chip strap, RFID tag, EAS tag). The linersheet has a first side and a second side. The undulating medium is coupled to the first side of the linersheet, the conductive strip is positioned on the first side of the linersheet between the linersheet and the undulating medium. The security chip is attached to the second side of the linersheet opposite the conductive strip and is coupled to the conductive strip through the linersheet.
摘要翻译: 公开了一种用于制造瓦楞纸制品的通信型波纹制品和方法。 波纹制品包括衬垫(例如工艺纸),波状介质(例如工艺纸),导电带(例如金属,铝,线,线圈)和安全芯片(例如,RFID芯片,EAS芯片 ,集成电路,芯片带,RFID标签,EAS标签)。 衬垫具有第一侧和第二侧。 波纹介质耦合到衬垫的第一侧,导电带位于衬垫和波纹介质之间的衬垫的第一侧上。 安全芯片附接到与导电条相对的衬垫的第二侧,并通过衬垫与导电带相连。
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公开(公告)号:US20070114659A1
公开(公告)日:2007-05-24
申请号:US11560692
申请日:2006-11-16
申请人: Andre Cote , Detlef Dusckek
发明人: Andre Cote , Detlef Dusckek
IPC分类号: H01L23/34
CPC分类号: H01L21/67144 , H01L24/95 , H01L2224/75822 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01033 , H01L2924/01058 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/00
摘要: A rotary chip attach process and manufacturing approach takes chips (e.g., integrated circuits (ICs)) from a wafer in a rotary process. A chip wafer with a positioning unit is placed over the top of a sprocketed wheel that picks the ICs directly from the wafer and moves them in a semi-continuous in-step motion to a web that will accept the ICs. The sprocketed wheel includes chips that are preferably the same type as used in a typical pick-and-place robotic system, with vacuum heads adapted to pierce the wafer flat membrane (if needed), grab and IC and place and IC as desired. This positioning system keeps the IC's placement in an accurate position on the web, which can be made to move continuously with a plurality of sprocketed wheel placement units in place.
摘要翻译: 旋转芯片连接工艺和制造方法在旋转工艺中从晶片获取芯片(例如,集成电路(IC))。 具有定位单元的芯片晶片被放置在链轮的顶部上,该轮链轮从晶片直接拾取IC并将它们以半连续的逐步运动移动到将接受IC的网。 链轮包括优选地与典型的拾放机器人系统中使用的相同类型的切屑,其中真空头适合于根据需要刺穿晶片平膜(如果需要),抓斗和IC以及放置和IC。 该定位系统将IC的放置位置保持在纸幅上的准确位置,可以使多个链轮轮放置单元在适当位置上连续移动。
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公开(公告)号:US20070018824A1
公开(公告)日:2007-01-25
申请号:US11457890
申请日:2006-07-17
申请人: Thomas Clare , Andre Cote
发明人: Thomas Clare , Andre Cote
IPC分类号: G08B13/14
CPC分类号: G06K19/07718 , G06K19/07749 , G06K19/07752 , G06K19/07779 , G06K19/07783 , G06K19/07786 , H01L2224/16225 , H01L2224/16227
摘要: A method for installing an RFID tag on shipping articles includes applying a strip of conductive material to the surface of the article and providing an RFID chip having a body, a first bottom conductive point, a second bottom conductive point and a nonconductive fin between the first bottom conductive point and the second bottom conductive point. The fin is received in the shipping article. The RFID chip is attached to the shipping article by inserting the chip onto the strip of conductive material on the shipping article such that the fin severs the strip into a first strip and a second strip. The first bottom conductive point is electrically attached to the first strip and the second bottom conductive point is electrically attached to the second strip.
摘要翻译: 一种用于在运送物品上安装RFID标签的方法包括将导电材料条施加到制品的表面,并提供具有主体,第一底部导电点,第二底部导电点和非导电鳍片的RFID芯片,其在第一 底部导电点和第二底部导电点。 散货在货运文章中收到。 将RFID芯片通过将芯片插入到运输制品上的导电材料条上而连接到运输制品,使得翅片将条切割成第一条带和第二条带。 第一底部导电点电连接到第一条带,并且第二底部导电点电连接到第二条带。
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