公开(公告)号：US20250062526A1

公开(公告)日：2025-02-20

申请号：US18720583

申请日：2022-12-19

Applicant: THALES NEDERLAND B.V.

Inventor： Robert FENNIS

IPC: H01Q1/52 ,  H01Q21/06

Abstract: To limit interference between antennas such as radar patch antennas in a structure, rows of pin elements are provided intersecting a propagation path on the surface of the structure. These rows may comprise inner and outer rows separated by a predetermined distance determined as a function of the operating frequency of the antennas. One or more intermediate rows may be provided between the inner and outer rows. The length and diameter of pin elements as well as the spacing between pin elements of a given row, may equally be selected with a view to the operating frequency of the antennas. The pin elements of the inner and outer rows may be offset with respect to each other.

公开(公告)号：US12230898B2

公开(公告)日：2025-02-18

申请号：US17973081

申请日：2022-10-25

Applicant: Chasm Advanced Materials, Inc.

Inventor： Robert F. Praino ,  David J. Arthur ,  Emiliano Mezzarobba ,  Daniel Skiba

IPC: H01Q1/36 ,  H01Q1/52 ,  H01Q9/04

Abstract: This disclosure includes, and results in the creation of, a printed carbon nanotube and/or graphene hybrid antenna and/or EMI shield, comprised of a conductive layer that comprises a metal mesh (MM) layer or a nanowire layer on a substrate, with a printed Signal Enhancement Layer (SEL) on the conductive layer. The SEL includes an ink that includes one or both of carbon nanotube (CNT) and graphene. The circuit pattern results after the “exposed” conductive layer (i.e., the regions where the CNT/graphene ink is not printed) is removed via chemical etching or mechanical cutting. The structure (the antenna/EMI shield) is preferably but not necessarily transparent.

公开(公告)号：US12230879B2

公开(公告)日：2025-02-18

申请号：US17738787

申请日：2022-05-06

Applicant: Apple Inc.

Inventor： Xiaofang Mu ,  Chi V Pham ,  Mingjuan Zhu ,  Bo Tong Deng ,  Bo Zhang ,  Srinivasa Yasasvy Sateesh Bhamidipati ,  Vineet Nayak ,  Daniel C Kong

IPC: H05K1/02 ,  H01L23/498 ,  H01L23/552 ,  H01Q1/22 ,  H01Q1/48 ,  H01Q1/52

Abstract: Techniques to reduce signal interference between wired signals communicated within an electronic device and wireless signals transmitted to or received from antennas of the electronic device are disclosed. The electronic device includes an interposer with an inner fence and an outer fence having offset gaps to prevent a pathway otherwise formed by overlapping tabs, where the pathway allows noise leakage from the wired signals. In some embodiments, the electronic device (e.g., in a main logic board package) includes a ground fencing of ground vias to prevent the noise leakage from harmonics associated with signal vias communicating the wired signals. The spacing between the ground vias is based on frequencies of signals that the ground vias are intended to block.

公开(公告)号：US12225700B2

公开(公告)日：2025-02-11

申请号：US18419131

申请日：2024-01-22

Applicant: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. ,  BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Chao Wang ,  Binfeng Feng ,  Yonghui Luo ,  Fei Li ,  Yupeng Chen ,  Jiaxiang Wang ,  Zijie Zhang ,  Qifeng Li

IPC: H04M1/04 ,  H01Q1/24 ,  H01Q1/52 ,  H05K7/20 ,  H05K9/00

Abstract: A display panel, a display module and a manufacture method thereof, and a communication device are provided. The display panel includes a display substrate and a multiplexing circuit arranged on a first surface of the display substrate. The display panel further includes a wave-absorbing material layer arranged on a second surface of the display substrate. The wave-absorbing material layer is configured to absorb electromagnetic wave interference signals. The second surface is a surface opposite to the first surface.

公开(公告)号：US20250046990A1

公开(公告)日：2025-02-06

申请号：US18290845

申请日：2022-07-20

Applicant: NITTO DENKO CORPORATION

Inventor： Takehiro UI ,  Kazuhiro FUKE ,  Yuya MATSUZAKI ,  Kyohei AKIYAMA

IPC: H01Q1/52 ,  G01S7/02 ,  H01Q15/00 ,  H01Q17/00

Abstract: An electromagnetic shield includes a plate-shaped base and first projecting portions. The base has a first surface and a second surface, the first surface being configured to allow an electromagnetic wave to be incident on the first surface. The second surface is distant from the first surface and extends along the first surface. The electromagnetic shield includes a dielectric. In the electromagnetic shield, at least one of the first projecting portions has a side including a first point and a second point, the side makes different inclination angles with a projecting direction of the first projecting portion at the first point and the second point. In the projecting direction of the first projecting portion, the second point is closer to the first surface-than the first point is. On the side, an inclination angle β is greater than an inclination angle α.

公开(公告)号：US20250046983A1

公开(公告)日：2025-02-06

申请号：US18361952

申请日：2023-07-31

Applicant: Intel Corporation

Inventor： Bala SUBRAMANYA ,  Prakash KURMA RAJU ,  Jayprakash THAKUR ,  Zaman Zaid MULLA ,  Praveen KUMAR ,  Yagnesh Vinodrai WAGHELA ,  Maruti TAMRAKAR ,  Prasanna PICHUMANI ,  Harry SKINNER

IPC: H01Q1/22 ,  H01Q1/40 ,  H01Q1/48 ,  H01Q1/52

Abstract: Disclosed herein is an encapsulated antenna for reducing the impact of radio frequency interference (RFI) that may couple to the antenna at frequencies within the Wi-FI 5/6e bandwidths. The encapsulated antenna device may include an insulating housing and a metal layer arranged within a cavity of the housing. The encapsulated antenna device also includes an antenna device comprising a ground terminal and an antenna body, wherein the ground terminal is connected to the metal layer, wherein the antenna body is arranged above the metal layer and within the cavity. The encapsulated antenna device also includes a spacer between the metal layer and the antenna body that provides an offset distance between the metal layer and the antenna body.

公开(公告)号：US12218430B2

公开(公告)日：2025-02-04

申请号：US18495206

申请日：2023-10-26

Applicant: Telefonaktiebolaget LM Ericsson (publ)

Inventor： Martin Da Silveira ,  Neil McGowan ,  Andrew McNair ,  Weigang Zeng ,  Chunyun Jian ,  Martin Ethier ,  Francis Marion ,  Zhen Hong Wang

IPC: H01P7/06 ,  H01P1/207 ,  H01P1/213 ,  H01Q1/24 ,  H01Q1/52 ,  H01Q3/26 ,  H01Q21/06

Abstract: According to one aspect, an integrated antenna and filter unit, IAFU, is provided. The IAFU includes a filter portion including at least one filter configured to filter RF signals to generate filtered RF signals and a plurality of filter pins configured to output filtered RF signals, and an antenna portion securable to the filter portion where the antenna portion includes a PCB including a plurality of conductor traces each mateable with a corresponding one of the plurality of filter pins to electrically couple the plurality of filter pins directly to corresponding ones of the plurality of conductor traces on the PCB, and a plurality of antennas securable to the PCB where the plurality of antennas are electrically coupled to the plurality of conductor traces.

公开(公告)号：US20250040028A1

公开(公告)日：2025-01-30

申请号：US18696838

申请日：2023-05-16

Applicant: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

Inventor： Patrick LENHARDT

IPC: H05K1/02 ,  H01L21/48 ,  H01L23/13 ,  H01L23/15 ,  H01L23/367 ,  H01L23/498 ,  H01L23/552 ,  H01L23/66 ,  H01Q1/02 ,  H01Q1/52 ,  H01Q9/04 ,  H04B1/00 ,  H04B1/40 ,  H05K1/03 ,  H05K3/46

Abstract: There is described a radio frequency module, comprising: i) a stack comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; and ii) a RF front-end functionality that is integrated in the stack. Further, an RF arrangement, a manufacture method and a use are described.

公开(公告)号：US20250038493A1

公开(公告)日：2025-01-30

申请号：US18715374

申请日：2021-12-01

Applicant: Hitachi Energy Ltd

Inventor： Arne SCHROEDER ,  Michele LUVISOTTO ,  Torsten NILSSON

IPC: H02B1/24 ,  H01Q1/52 ,  H01Q13/20

Abstract: The present disclosure relates to a high voltage (HV) installation, comprising a plurality of power electronic cells, in particular power electronic switching cells, configured to operate at different electrical potentials, each power electronic cell comprising a cell-side transceiver with an antenna for receiving and/or transmitting high frequency (HF) communication signals, and a waveguide configured to carry and shield HF communication signals of the plurality of power electronic cells. The waveguide has a plurality of sections configured to leak HF communication signals present in the waveguide into a corresponding plurality of adjoining areas and vice versa. Each power electronic cell of the plurality of power electronic cells is arranged physically separated and in proximity to the waveguide, such that the respective power electronic cell is electrically insulated from the waveguide and the antenna of the respective cell-side transceivers is arranged in the respective adjoining area.

公开(公告)号：US20250030149A1

公开(公告)日：2025-01-23

申请号：US18908429

申请日：2024-10-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sinhyung JEON ,  Sanggi OH ,  Jeongnam CHEON

IPC: H01Q1/22 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q1/52 ,  H05K1/02

Abstract: An electronic device according to an embodiment includes: a printed circuit board; a first antenna module including at least one antenna; a second antenna module including at least one antenna; a Bluetooth module comprising circuitry; and at least one processor, comprising processing circuitry, wherein the first antenna module includes: a chip antenna; a feeding line; at least one first ground area; a set of first conductive patterns; and a first lumped element comprising a conductive material, set including a first lumped element, a second lumped element, a third lumped element, and a fourth lumped element. A third conductive pattern, fourth conductive pattern, and the at least one first ground area form a closed loop by the second lumped element, the third lumped element, and the fourth lumped element.