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公开(公告)号：US20230361460A1
公开(公告)日：2023-11-09
申请号：US17738787
申请日：2022-05-06
Applicant: Apple Inc.
Inventor： Xiaofang Mu , Chi V Pham , Mingjuan Zhu , Bo Tong Deng , Bo Zhang , Srinivasa Yasasvy Sateesh Bhamidipati , Vineet Nayak , Daniel C Kong
IPC: H01Q1/52 , H01L23/552 , H01L23/498 , H01Q1/48 , H01Q1/22
CPC classification number: H01Q1/526 , H01L23/552 , H01L23/49827 , H01Q1/48 , H01Q1/2283 , H01L2223/6677
Abstract: Techniques to reduce signal interference between wired signals communicated within an electronic device and wireless signals transmitted to or received from antennas of the electronic device are disclosed. The electronic device includes an interposer with an inner fence and an outer fence having offset gaps to prevent a pathway otherwise formed by overlapping tabs, where the pathway allows noise leakage from the wired signals. In some embodiments, the electronic device (e.g., in a main logic board package) includes a ground fencing of ground vias to prevent the noise leakage from harmonics associated with signal vias communicating the wired signals. The spacing between the ground vias is based on frequencies of signals that the ground vias are intended to block.
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公开(公告)号：US12261359B2
公开(公告)日：2025-03-25
申请号：US18103311
申请日：2023-01-30
Applicant: Apple Inc.
Inventor： Xiaofang Mu , Jorge L Rivera Espinoza , Bernd W Adler , Evan N Dvorak , Samuel E Vinci , Shaohua Lin
Abstract: An electronic device may include a first set of antennas, a second set of antennas, and a slip ring disposed between the first set of antennas and the second set of antennas. The slip ring may include a waveguide that provides a pathway for signals transmitted between the first set of and the second set of antennas. A diameter and a length of the waveguide may enable efficient transmission of the signals between the sets of antennas by reducing signal attenuation. Additionally, gaps between the sets of antennas and the slip ring may be sized to reduce radiation emitted from the electronic device. The gaps between the sets of antennas and the slip ring may enable wireless data transfer between the sets of antennas.
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公开(公告)号：US20250079715A1
公开(公告)日：2025-03-06
申请号：US18810228
申请日：2024-08-20
Applicant: Apple Inc.
Inventor： Xiaofang Mu , Bernd W Adler , Jorge L Rivera Espinoza , Grant S Haug
Abstract: A communications system may include a first electronic device and a second electronic device that communicate over a high speed short range wireless communications link. To support the link, each device includes one or more antennas that concurrently transmit(s) and receive(s) radio-frequency signals at the same frequency under an in-band full duplex (IBFD) scheme. One device may include a housing wall and a waveguide. The waveguide has an elongated portion facing the antenna(s) and a horn extending from the elongated portion. The waveguide may convey the radio-frequency signals between the antenna(s) and the other device through the wall. The waveguide may serve to mitigate signal leakage from a transmit port onto a receive port of the device while conveying wireless data over the high speed short range wireless communications link. In addition, the waveguide allows flexibility in configuring the antennas and enhances system robustness with larger alignment tolerances.
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公开(公告)号：US12069805B2
公开(公告)日：2024-08-20
申请号：US17482943
申请日：2021-09-23
Applicant: Apple Inc.
Inventor： Chi V. Pham , Xiaofang Mu
CPC classification number: H05K1/116 , H01P3/08 , H05K1/0243 , H05K2201/095
Abstract: Devices are disclosed that include a wideband millimeter wave (mmW) via transition design for multilayer printed circuit boards (MLBs). In various instances embodiments, a via is dimensioned to provide impedance matching to stripline tracing connected at the end of the via. Impedance matching in the via may eliminate the need for an impedance matching section on the stripline tracing. In some instances, the dimensions of the via pad diameter and the via keepout diameter are selected to tune a via transition structure to selected frequencies and/or frequency bandwidths.
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公开(公告)号：US20240097319A1
公开(公告)日：2024-03-21
申请号：US18103311
申请日：2023-01-30
Applicant: Apple Inc.
Inventor： Xiaofang Mu , Jorge L Rivera Espinoza , Bernd W Adler , Evan N Dvorak , Samuel E Vinci , Shaohua Lin
Abstract: An electronic device may include a first set of antennas, a second set of antennas, and a slip ring disposed between the first set of antennas and the second set of antennas. The slip ring may include a waveguide that provides a pathway for signals transmitted between the first set of and the second set of antennas. A diameter and a length of the waveguide may enable efficient transmission of the signals between the sets of antennas by reducing signal attenuation. Additionally, gaps between the sets of antennas and the slip ring may be sized to reduce radiation emitted from the electronic device. The gaps between the sets of antennas and the slip ring may enable wireless data transfer between the sets of antennas.
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Patent Agency Ranking
公开(公告)号：US12009849B2
公开(公告)日：2024-06-11
申请号：US17411892
申请日：2021-08-25
Applicant: Apple Inc.
Inventor： Xiaofang Mu , Bo Zhang , Mingjuan Zhu , Chi V. Pham , Berke Cetinoneri , Timothy B. Ogilvie
CPC classification number: H04B1/0483 , H04B1/0057 , H04B1/52 , H04B2001/0408
Abstract: Frequency-filtering circuitry is disclosed that rejects power of a wireless signal having an undesired frequency while causing a decreased power loss to a wireless signal having a desired frequency using distributed elements, rather than lumped elements. The frequency-filtering circuitry may reject at least 5 decibels of power of a wireless signal having a frequency over 32 gigahertz, while causing a power loss of at most 1.1 decibels to a wireless signal having a frequency lower than 29.5 gigahertz. The frequency-filtering circuitry may include a main branch, a first parallel branch coupled and parallel to the main branch via a first connecting trace, and a second parallel branch coupled and parallel to the main branch via a second connecting trace. The first connecting trace intersects the main branch and the first parallel branch, and the second connecting trace intersects the main branch and the second parallel branch.
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公开(公告)号：US20230084538A1
公开(公告)日：2023-03-16
申请号：US17544262
申请日：2021-12-07
Applicant: Apple Inc.
Inventor： Xiaofang Mu , Annie Manuja , Christopher D. Guichet , Erik G. de Jong , Jorge L. Rivera Espinoza , Patrick J. Crowley , Steven C. Roach , Venkatesh Rajendran , William C. Lukens , Woojin Jung , Yue Chen , Zhiwei Gu , Derek Iwamoto , Siddharth Nangia , Scott D. Morrison , Kevin A. Klenk , Neeloy Roy
Abstract: A wireless communication system may include an electronic device having a wireless communication module. The wireless communication module may include an antenna radiating element on a first surface, a ground ring surrounding the antenna radiating element on the first surface, and a radio component mounted to a second surface. The wireless communication module may be incorporated into a system package that also includes other components. Encapsulation material may cover the wireless communication module and other components. A shielding material may cover the encapsulation material and be coupled to the ground ring. An opening in the shielding material may be aligned with the antenna radiating element. If desired, the wireless communication system may include external equipment having a wireless communication module communicatively coupled to the wireless communication module to convey firmware testing, debugging, restore, and/or other data.
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公开(公告)号：US20230078323A1
公开(公告)日：2023-03-16
申请号：US17482943
申请日：2021-09-23
Applicant: Apple Inc.
Inventor： Chi V. Pham , Xiaofang Mu
Abstract: Devices are disclosed that include a wideband millimeter wave (mmW) via transition design for multilayer printed circuit boards (MLBs). In various instances embodiments, a via is dimensioned to provide impedance matching to stripline tracing connected at the end of the via. Impedance matching in the via may eliminate the need for an impedance matching section on the stripline tracing. In some instances, the dimensions of the via pad diameter and the via keepout diameter are selected to tune a via transition structure to selected frequencies and/or frequency bandwidths.
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公开(公告)号：US20230064458A1
公开(公告)日：2023-03-02
申请号：US17411892
申请日：2021-08-25
Applicant: Apple Inc.
Inventor： Xiaofang Mu , Bo Zhang , Mingjuan Zhu , Chi V. Pham , Berke Cetinoneri , Timothy B. Ogilvie
Abstract: Frequency-filtering circuitry is disclosed that rejects power of a wireless signal having an undesired frequency while causing a decreased power loss to a wireless signal having a desired frequency using distributed elements, rather than lumped elements. The frequency-filtering circuitry may reject at least 5 decibels of power of a wireless signal having a frequency over 32 gigahertz, while causing a power loss of at most 1.1 decibels to a wireless signal having a frequency lower than 29.5 gigahertz. The frequency-filtering circuitry may include a main branch, a first parallel branch coupled and parallel to the main branch via a first connecting trace, and a second parallel branch coupled and parallel to the main branch via a second connecting trace. The first connecting trace intersects the main branch and the first parallel branch, and the second connecting trace intersects the main branch and the second parallel branch.
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公开(公告)号：US20250149782A1
公开(公告)日：2025-05-08
申请号：US19020580
申请日：2025-01-14
Applicant: Apple Inc.
Inventor： Xiaofang Mu , Chi V. Pham , Mingjuan Zhu , Bo Tong Deng , Bo Zhang , Srinivasa Yasasvy Sateesh Bhamidipati , Vineet Nayak , Daniel C. Kong
IPC: H01Q1/52 , H01L23/498 , H01L23/552 , H01Q1/22 , H01Q1/48 , H05K1/02
Abstract: Techniques to reduce signal interference between wired signals communicated within an electronic device and wireless signals transmitted to or received from antennas of the electronic device are disclosed. The electronic device includes an interposer with an inner fence and an outer fence having offset gaps to prevent a pathway otherwise formed by overlapping tabs, where the pathway allows noise leakage from the wired signals. In some embodiments, the electronic device (e.g., in a main logic board package) includes a ground fencing of ground vias to prevent the noise leakage from harmonics associated with signal vias communicating the wired signals. The spacing between the ground vias is based on frequencies of signals that the ground vias are intended to block.
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