公开(公告)号：US12131929B2

公开(公告)日：2024-10-29

申请号：US17534716

申请日：2021-11-24

申请人： SEMES CO., LTD.

发明人： Myoung Hoon Woo

IPC分类号： G06K9/00 ,  G06T7/00 ,  G06T7/11 ,  G06T7/70 ,  G06T7/90 ,  H01L21/67

CPC分类号： H01L21/67288 ,  G06T7/0004 ,  G06T7/11 ,  G06T7/70 ,  G06T7/90 ,  G06T2207/10024 ,  G06T2207/30148

摘要： A wafer inspection method includes acquiring an inspection image from an edge region of a wafer, generating a color profile of the inspection image in a radial direction of the wafer, detecting a side surface of a layer formed on the wafer based on a change in the color profile in a first direction from a side surface of the wafer toward a center of the wafer, and calculating a distance between the side surface of the layer and the side surface of the wafer.

公开(公告)号：US20240339344A1

公开(公告)日：2024-10-10

申请号：US18747943

申请日：2024-06-19

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Yan-Hong LIU ,  Chien-Chih WU ,  Che-Fu CHEN

IPC分类号： H01L21/67 ,  G06T7/00 ,  H01L21/677 ,  H01L21/687 ,  H04N25/71

CPC分类号： H01L21/67288 ,  G06T7/0004 ,  H01L21/67742 ,  H01L21/68707 ,  H01L21/68764 ,  G06T2207/10061 ,  G06T2207/30148 ,  G06T2207/30164 ,  H04N25/71

摘要： A workstation includes: a processing chamber configured to process a workpiece; a load port configured to interface with an environment external to the workstation; a robotic arm configured to transfer the workpiece between the load port and the processing chamber; and a defect sensor configured to detect a defect along a surface of the workpiece when transferred between the load port and the processing chamber.

公开(公告)号：US12112963B2

公开(公告)日：2024-10-08

申请号：US17419581

申请日：2019-03-06

申请人： Hitachi High-Tech Corporation

发明人： Takashi Hiroi ,  Nobuaki Hirose ,  Takahiro Urano

IPC分类号： G06K9/00 ,  G06T7/00 ,  G06T7/73 ,  H01L21/67

CPC分类号： H01L21/67288 ,  G06T7/001 ,  G06T7/74 ,  G06T2200/24 ,  G06T2207/30148

摘要： The objective of the present invention is provide a defect inspection apparatus that increases defect position precision and can easily align a coordinate origin offset between a reviewing apparatus and the defect inspection apparatus, even when design data cannot be obtained or it is difficult to sufficiently use the design data. The defect inspection apparatus according to the present invention acquires a wafer swath image necessary for inspection, and uses the swath image to detect defects and calculate a positional deviation amount. During the calculation of the positional deviation amount, a template pattern is acquired from one arbitrary swath image via an image processing unit, and the template pattern and a plurality of swath images of the entire wafer are compared, whereby the positional deviation amount for a position corresponding to the template pattern on the wafer is calculated. For positions at which the template pattern is not present, an interpolated positional deviation amount is calculated by executing an interpolation operation by using the calculated positional deviation amount. A defect position is corrected on the basis of the positional deviation amount and the interpolated positional deviation amount, or by using a positional deviation map in which these positional deviation amounts have been mapped on the entire wafer.

公开(公告)号：US12112260B2

公开(公告)日：2024-10-08

申请号：US16424811

申请日：2019-05-29

申请人： ASML Netherlands B.V.

发明人： Lorenzo Tripodi ,  Patrick Warnaar ,  Grzegorz Grzela ,  Mohammadreza Hajiahmadi ,  Farzad Farhadzadeh ,  Patricius Aloysius Jacobus Tinnemans ,  Scott Anderson Middlebrooks ,  Adrianus Cornelis Matheus Koopman ,  Frank Staals ,  Brennan Peterson ,  Anton Bernhard Van Oosten

IPC分类号： G06N3/08 ,  G01B11/02 ,  G01N21/55 ,  G06T7/00

CPC分类号： G06N3/08 ,  G01B11/02 ,  G01N21/55 ,  G06T7/0006 ,  G06T7/001 ,  G01B2210/56 ,  G06T2207/20081 ,  G06T2207/20084 ,  G06T2207/30148

摘要： Disclosed is a method of determining a characteristic of interest relating to a structure on a substrate formed by a lithographic process, the method comprising: obtaining an input image of the structure; and using a trained neural network to determine the characteristic of interest from said input image. Also disclosed is a reticle comprising a target forming feature comprising more than two sub-features each having different sensitivities to a characteristic of interest when imaged onto a substrate to form a corresponding target structure on said substrate. Related methods and apparatuses are also described.

公开(公告)号：US20240331131A1

公开(公告)日：2024-10-03

申请号：US18128491

申请日：2023-03-30

申请人： Applied Materials, Inc.

发明人： Rahul Reddy KOMATIREDDI ,  Rohith CHERIKKALLIL ,  Sneha Rupa KONGARA ,  Satwik Swarup MISHRA ,  Sachin DANGAYACH ,  Si En CHAN ,  Remus Zhen Hui KOH ,  Prayudi LIANTO ,  Yin Wei LIM ,  Peng SUO ,  Krishnaprasad Reddy MALLAVARAM ,  Khor Wui CHENG

IPC分类号： G06T7/00 ,  G06T7/13

CPC分类号： G06T7/001 ,  G06T7/13 ,  G06T2207/20081 ,  G06T2207/20084 ,  G06T2207/30148

摘要： A method, apparatus and system for the automatic detection and measurement of chipping defects on diced wafers includes receiving an image of at least a portion of a diced wafer, aligning the received image of the at least the portion of the diced wafer, determining edges of the at least the portion of the diced wafer depicted in the aligned, received image, automatically determining at least one baseline from which to measure chipping defects on the at least the portion of the diced wafer from the determined edges, and measuring chipping defects on the at least the portion of the diced wafer using at least one determined, respective baseline. In some embodiments, the method, apparatus and system can further include applying a machine learning model to measured chipping defects to determine if a critical failure exists on the diced wafer.

公开(公告)号：US12107052B2

公开(公告)日：2024-10-01

申请号：US18312177

申请日：2023-05-04

申请人： AUROS TECHNOLOGY, INC.

发明人： Hyun Chul Lee ,  Hyun Jin Chang

IPC分类号： H01L23/544 ,  G03F7/00 ,  G06T7/00

CPC分类号： H01L23/544 ,  G03F7/70633 ,  G03F7/70683 ,  G03F7/706837 ,  G03F7/706851 ,  G06T7/001 ,  G06T2207/30148 ,  G06T2207/30204 ,  H01L2223/54426

摘要： An overlay mark forming a Moire pattern, an overlay measurement method using the overlay mark, an overlay measurement apparatus using the overlay mark, and a manufacturing method of a semiconductor device using the overlay mark are provided. The overlay mark for measuring an overlay based on an image is configured to determine a relative misalignment between at least two pattern layers. The overlay mark includes a first overlay mark including a pair of first grating patterns which has a first pitch along a first direction and which is rotationally symmetrical by 180 degrees, and includes a second overlay mark including a pair of second grating patterns and a pair of third grating patterns. The second grating patterns partially overlap the first grating patterns and are rotationally symmetrical by 180 degrees, and the third grating patterns partially overlap the first grating patterns and are rotationally symmetrical by 180 degrees.

公开(公告)号：US12105026B2

公开(公告)日：2024-10-01

申请号：US17805773

申请日：2022-06-07

申请人： NuFlare Technology, Inc.

发明人： Yasuhiro Yamashita

IPC分类号： G01N21/88 ,  G01N21/956 ,  G06T7/00

CPC分类号： G01N21/8806 ,  G01N21/95607 ,  G06T7/001 ,  G01N2021/8835 ,  G06T2207/30148

摘要： An image acquisition method includes storing a coefficient of a relational expression between a parameter corresponding to a light quantity incident on an imaging sensor including a photo sensor element and an output value of the imaging sensor in the case of the light incident on the imaging sensor which employs a reference image accumulation time, inputting a desired image accumulation time, and calculating a parameter for obtaining a desired output value of the imaging sensor by using a corrected relational expression obtained by correcting using an output value of the imaging sensor employing the desired image accumulation time in the case of the incident light quantity being zero, adjusting the light quantity incident on the imaging sensor to be a calculated parameter, and acquiring a target image by the imaging sensor on which an adjusted light quantity is incident, and outputting data of the acquired image.

公开(公告)号：US20240319099A1

公开(公告)日：2024-09-26

申请号：US18577859

申请日：2022-09-30

申请人： JI HUA LABORATORY

发明人： Zhaoming HE ,  Hai BI ,  Jiangwei DUAN ,  Wei WANG ,  Wanli YANG

IPC分类号： G01N21/64 ,  G01N21/95 ,  G06T7/00 ,  H01L21/66 ,  H01L21/67

CPC分类号： G01N21/6489 ,  G01N21/9505 ,  G06T7/0004 ,  H01L21/67288 ,  H01L22/12 ,  G06T2207/20021 ,  G06T2207/30148

摘要： A defect detection method includes: acquiring a photoluminescence detection result of a wafer to be detected; generating a defect heat map corresponding to said wafer according to the photoluminescence detection result and a preset heat map model, the preset heat map model being constructed on the basis of a photoluminescence detection result sample after electroluminescent defect marking; and determining a defect detection result of said wafer according to the defect heat map.

公开(公告)号：US12100133B2

公开(公告)日：2024-09-24

申请号：US17418345

申请日：2019-10-11

申请人： Hitachi High-Tech Corporation

发明人： Shuyang Dou ,  Yasutaka Toyoda ,  Fumihiro Bekku ,  Takefumi Kakinuma ,  Shinichi Shinoda

IPC分类号： G06T7/00 ,  G06F18/21 ,  G06F18/214 ,  G06F18/24 ,  G06N20/00 ,  G06V10/25

CPC分类号： G06T7/001 ,  G06F18/214 ,  G06F18/217 ,  G06F18/24 ,  G06N20/00 ,  G06V10/25 ,  G06T2207/20081 ,  G06T2207/30148

摘要： The purpose of the present invention is to provide an image evaluation device and method which can detect unknown defects and which can prevent misrecognition by a machine learning model. This image evaluation device, which uses a machine learning classifier to classify defect information in a defect image of an electronic device, is characterized by being provided with: an image storage unit which stores a defect image of an electronic device; a defect region storage unit which stores defect region information that is in the defect image; a classifier which classifies the defect information with machine learning; an image extraction unit which, in the course of the defect image classification processing, extracts image-of-interest information which the classifier will focus on; and an evaluation unit which compares the image-of-interest information and the defect region information to evaluate the classifiability of the defect image.

公开(公告)号：US20240313153A1

公开(公告)日：2024-09-19

申请号：US18481568

申请日：2023-10-05

申请人： Samsung Display Co., LTD.

发明人： Futoshi YOSHIDA ,  Jong Hyup KIM ,  Jin Pyung LEE ,  Chung Sic CHOI

IPC分类号： H01L33/00 ,  G01L1/24 ,  G06T7/90 ,  H01L23/00 ,  H01L25/075 ,  H01L33/62

CPC分类号： H01L33/0095 ,  G01L1/24 ,  G06T7/90 ,  H01L24/32 ,  H01L24/75 ,  H01L24/83 ,  H01L25/0753 ,  H01L33/62 ,  G06T2207/10024 ,  G06T2207/10056 ,  G06T2207/30148 ,  H01L2224/32227 ,  H01L2224/75283 ,  H01L2224/7592 ,  H01L2224/83005 ,  H01L2224/83203 ,  H01L2224/83908 ,  H01L2924/12041 ,  H01L2924/1426 ,  H01L2933/0066

摘要： The disclosure provides a pressure detection method of a bonding device and a bonding system. The pressure detection method of a bonding device includes forming a backplane substrate including a light emitting element, disposing a pressure detection sheet on the backplane substrate, transferring the backplane substrate and the pressure detection sheet into a chamber, bonding the light emitting element by pressurizing the pressure detection sheet, photographing the pressure detection sheet, and detecting a color developing area of the pressure detection sheet. In the pressure detection method of the bonding device and the bonding system, it can be inspected whether uniform pressure is applied to a pressure detection sheet.