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公开(公告)号：US10650957B1
公开(公告)日：2020-05-12
申请号：US16176630
申请日：2018-10-31
Applicant: Texas Instruments Incorporated
Inventor： Yi Yan , Luu Thanh Nguyen , Ashok Prabhu , Anindya Poddar
Abstract: Apparatus to form a transformer, an inductor, a capacitor or other passive electronic component, with patterned conductive features in a lamination structure, and one or more ferrite sheets or other magnetic core structures attached to the lamination structure via one or more inkjet printed magnetic adhesive layers that join the magnetic core structure or structures to the lamination structure.
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公开(公告)号：US11870341B2
公开(公告)日：2024-01-09
申请号：US17677072
申请日：2022-02-22
Applicant: Texas Instruments Incorporated
Inventor： Yi Yan , Vivek Arora
CPC classification number: H02M3/003 , H01F27/30 , H01F41/0246 , H02M3/33523 , H05K7/2089
Abstract: An isolated power converter package includes a leadframe including a first and second die pad, first and second supports connected to first leads, second leads. A first semiconductor die is on the first die pad and a second semiconductor die is on the second die pad. The molded transformer includes a top and bottom side magnetic sheet each having a magnetic mold material including magnetic particles in a second dielectric material on respective sides of a laminate substrate including a dielectric material and a first coil and a second coil that each include a coil contact. Edges of the laminate substrate are on the supports. Bond wires are between the first die bond pads and the second leads, between the second die bond pads and the second leads, between the first die bond pads and coil contacts, and between the second die bond pads and the coil contacts.
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公开(公告)号：US20230268826A1
公开(公告)日：2023-08-24
申请号：US17677072
申请日：2022-02-22
Applicant: Texas Instruments Incorporated
Inventor： Yi Yan , Vivek Arora
CPC classification number: H02M3/003 , H02M3/33523 , H05K7/2089 , H01F27/30 , H01F41/0246
Abstract: An isolated power converter package includes a leadframe including a first and second die pad, first and second supports connected to first leads, second leads. A first semiconductor die is on the first die pad and a second semiconductor die is on the second die pad. The molded transformer includes a top and bottom side magnetic sheet each having a magnetic mold material including magnetic particles in a second dielectric material on respective sides of a laminate substrate including a dielectric material and a first coil and a second coil that each include a coil contact. Edges of the laminate substrate are on the supports. Bond wires are between the first die bond pads and the second leads, between the second die bond pads and the second leads, between the first die bond pads and coil contacts, and between the second die bond pads and the coil contacts.
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公开(公告)号：US11410875B2
公开(公告)日：2022-08-09
申请号：US16225875
申请日：2018-12-19
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Hau Thanh Nguyen , Woochan Kim , Yi Yan , Luu Thanh Nguyen , Ashok Prabhu , Anindya Poddar , Masamitsu Matsuura , Kengo Aoya , Mutsumi Masumoto
IPC: H01L21/768 , H01L23/528 , H01L23/31 , H01L23/00
Abstract: An electronic device (100) includes a substrate (110) and an integrated circuit (120) provided on the substrate (110) having a surface facing away from the substrate (110). An insulating layer (150) extends over the substrate (110) and around the integrated circuit (120) to define an interface (154) between the insulating layer (150) and the integrated circuit (120). An electrically conductive via (130) is provided on the surface of the integrated circuit (120). An insulating material (140) extends over the via (130) and includes an opening (142) exposing a portion of the via (130). A repassivation member (162) extends over the insulating layer (150) and has a surface (164) aligned with the interface (154). An electrically conductive redistribution member (181) is electrically connected to the via (130) and extends over the repassivation member (162) into contact with the insulating layer (150).
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公开(公告)号：US10541220B1
公开(公告)日：2020-01-21
申请号：US16053199
申请日：2018-08-02
Applicant: Texas Instruments Incorporated
Inventor： Daiki Komatsu , Makoto Shibuya , Yi Yan , Hau Nguyen , Luu Thanh Nguyen , Anindya Poddar
IPC: H01L21/48 , H01L21/56 , H01L21/78 , H01L23/00 , H01L23/367 , H01L23/498 , H01L23/495 , H01L23/31
Abstract: Described examples provide integrated circuits and methods, including forming a conductive seed layer at least partially above a conductive feature of a wafer, forming a conductive structure on at least a portion of the conductive seed layer, performing a printing process that forms a polymer material on a side of the wafer proximate a side of the conductive structure, curing the deposited polymer material, and attaching a solder ball structure to a side of the conductive structure.
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Patent Agency Ranking
公开(公告)号：US20240170207A1
公开(公告)日：2024-05-23
申请号：US18427734
申请日：2024-01-30
Applicant: Texas Instruments Incorporated
Inventor： Yi Yan , Zhemin Zhang , Yuki Sato , Kenji Otake , Vijaylaxmi Khanolkar
CPC classification number: H01F41/041 , H01F27/2804
Abstract: A method includes performing a printing process that deposits a magnetic paste onto a first side and into an opening of a laminate; curing the magnetic paste to form a first transformer core piece having a first portion along the first side and a second portion filling the opening of the laminate; joining a second transformer core piece to a side of the second portion of the first transformer core piece to form a transformer. A transformer includes a laminate; a first core piece; and a second core piece, the first core piece comprising: a cured magnetic paste, a first portion along a side of the laminate, and a second portion filling an opening of the laminate, the second core piece extending along a side of the second portion of the first transformer core piece, and the laminate having windings that encircle the opening.
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公开(公告)号：US11887776B2
公开(公告)日：2024-01-30
申请号：US16904875
申请日：2020-06-18
Applicant: Texas Instruments Incorporated
Inventor： Yi Yan , Zhemin Zhang , Yuki Sato , Kenji Otake , Vijaylaxmi Khanolkar
CPC classification number: H01F41/041 , H01F27/2804
Abstract: A method includes performing a printing process that deposits a magnetic paste onto a first side and into an opening of a laminate; curing the magnetic paste to form a first transformer core piece having a first portion along the first side and a second portion filling the opening of the laminate; joining a second transformer core piece to a side of the second portion of the first transformer core piece to form a transformer. A transformer includes a laminate; a first core piece; and a second core piece, the first core piece comprising: a cured magnetic paste, a first portion along a side of the laminate, and a second portion filling an opening of the laminate, the second core piece extending along a side of the second portion of the first transformer core piece, and the laminate having windings that encircle the opening.
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公开(公告)号：US20220310302A1
公开(公告)日：2022-09-29
申请号：US17215457
申请日：2021-03-29
Applicant: Texas Instruments Incorporated
Inventor： Yi Yan , Zhemin Zhang , Ken Pham , Vijaylaxmi Khanolkar , Dongbin Hou
Abstract: A microelectronic device includes a magnetic component having a first magnetic core segment and a second magnetic core segment, with a winding lamina between them. The first magnetic core segment includes a winding support portion with ferromagnetic material. The winding lamina is attached to the winding support portion. The first magnetic core segment also includes an extension portion with ferromagnetic material extending from the winding support portion. The winding lamina has winding loops of electrically conductive material that surround ferromagnetic material. A filler material is formed between the winding lamina and the first magnetic core segment, contacting both the winding lamina and the first magnetic core segment. The second magnetic core segment is attached to the extension portion of the first magnetic core segment. The second magnetic core segment includes ferromagnetic material. The winding loops are electrically coupled to external leads through electrical connections.
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公开(公告)号：US20210398736A1
公开(公告)日：2021-12-23
申请号：US16904875
申请日：2020-06-18
Applicant: Texas Instruments Incorporated
Inventor： Yi Yan , Zhemin Zhang , Yuki Sato , Kenji Otake , Vijaylaxmi Khanolkar
Abstract: A method includes performing a printing process that deposits a magnetic paste onto a first side and into an opening of a laminate; curing the magnetic paste to form a first transformer core piece having a first portion along the first side and a second portion filling the opening of the laminate; joining a second transformer core piece to a side of the second portion of the first transformer core piece to form a transformer. A transformer includes a laminate; a first core piece; and a second core piece, the first core piece comprising: a cured magnetic paste, a first portion along a side of the laminate, and a second portion filling an opening of the laminate, the second core piece extending along a side of the second portion of the first transformer core piece, and the laminate having windings that encircle the opening.
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公开(公告)号：US20200043878A1
公开(公告)日：2020-02-06
申请号：US16053199
申请日：2018-08-02
Applicant: Texas Instruments Incorporated
Inventor： Daiki Komatsu , Makoto Shibuya , Yi Yan , Hau Nguyen , Luu Thanh Nguyen , Anindya Poddar
IPC: H01L23/00 , H01L23/367 , H01L23/498 , H01L23/495 , H01L23/31 , H01L21/48 , H01L21/56 , H01L21/78
Abstract: Described examples provide integrated circuits and methods, including forming a conductive seed layer at least partially above a conductive feature of a wafer, forming a conductive structure on at least a portion of the conductive seed layer, performing a printing process that forms a polymer material on a side of the wafer proximate a side of the conductive structure, curing the deposited polymer material, and attaching a solder ball structure to a side of the conductive structure.
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