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    LIGHT-EMITTING DIODE (LED) PACKAGE
    2.
    发明申请
    LIGHT-EMITTING DIODE (LED) PACKAGE 有权
    发光二极管（LED）封装

    公开(公告)号：US20170033268A1

    公开(公告)日：2017-02-02

    申请号：US15162754

    申请日：2016-05-24

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Dong-kuk LEE ,  Si-han KIM ,  Hyung-kun KIM ,  Yong-min KWON ,  Geun-woo KO

    IPC: H01L33/60 ,  H01L33/32 ,  H01L33/56 ,  H01L33/00 ,  H01L33/62 ,  H01L33/38 ,  H01L33/06 ,  H01L33/18

    CPC classification number: H01L33/60 ,  H01L33/007 ,  H01L33/06 ,  H01L33/18 ,  H01L33/32 ,  H01L33/38 ,  H01L33/382 ,  H01L33/44 ,  H01L33/54 ,  H01L33/56 ,  H01L33/62 ,  H01L2933/0016 ,  H01L2933/005 ,  H01L2933/0058

    Abstract: A light-emitting diode (LED) package includes a light-emitting structure including a first conductive-type semiconductor layer, an active layer, and a second conductive-type semiconductor layer; an isolating insulation layer; a first connection electrode portion and a second connection electrode portion electrically connected to the first conductive-type semiconductor layer and the second conductive-type semiconductor layer, respectively; a first electrode pad and a second electrode pad electrically connected to the first connection electrode portion and the second connection electrode portion, respectively; a first molding resin layer provided between the first electrode pad and the second electrode pad; a first pillar electrode and a second pillar electrode electrically connected to the first electrode pad and the second electrode pad, respectively; and a second molding resin layer provided on the first molding resin layer, the first electrode pad, and the second electrode pad, and between the first pillar electrode and the second pillar electrode.

    Abstract translation: 发光二极管（LED）封装包括包括第一导电型半导体层，有源层和第二导电型半导体层的发光结构; 隔离绝缘层; 分别与第一导电型半导体层和第二导电型半导体层电连接的第一连接电极部分和第二连接电极部分; 分别电连接到第一连接电极部分和第二连接电极部分的第一电极焊盘和第二电极焊盘; 第一模塑树脂层，设置在所述第一电极焊盘和所述第二电极焊盘之间; 分别与第一电极焊盘和第二电极焊盘电连接的第一柱状电极和第二柱状电极; 以及设置在第一模塑树脂层，第一电极焊盘和第二电极焊盘上以及在第一柱状电极和第二柱状电极之间的第二模塑树脂层。

    LIGHT EMITTING DEVICE PACKAGE
    3.
    发明申请
    LIGHT EMITTING DEVICE PACKAGE 审中-公开
    发光装置包装

    公开(公告)号：US20150243846A1

    公开(公告)日：2015-08-27

    申请号：US14631611

    申请日：2015-02-25

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Yong-min KWON ,  Sung-jun IM ,  Kyoung-jun KIM

    IPC: H01L33/38 ,  H01L33/58 ,  H01L33/32 ,  H01L33/56 ,  H01L33/62 ,  H01L33/06

    CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L2224/16225

    Abstract: A light emitting device package including a first electrode pad and a second electrode pad formed to contact a lower surface of a light emitting device; a bonded insulating layer pattern formed to at least partially cover side surfaces and lower surfaces of the first electrode pad and the second electrode pad; a substrate, in which via holes are formed which penetrate the substrate from a first surface of the substrate that contacts a lower surface of the bonded insulating layer pattern to a second surface of the substrate that is opposite to the first surface; a through-electrode disposed in each via hole and contacting the lower surface of one of the respective first electrode pad and the second electrode pad; and a through-electrode insulating layer formed between the through-electrode and the substrate, and having an upper surface that contacts a portion of the lower surface of the bonded insulating layer pattern.

    Abstract translation: 一种发光器件封装，包括形成为接触发光器件的下表面的第一电极焊盘和第二电极焊盘; 形成为至少部分地覆盖所述第一电极焊盘和所述第二电极焊盘的侧表面和下表面的接合绝缘层图案; 基板，其中形成有从基板的与接合绝缘层图案的下表面接触到与第一表面相对的第二表面的基板的第一表面穿透基板的通孔; 设置在每个通孔中并与第一电极焊盘和第二电极焊盘之一接触的通孔; 以及在所述贯通电极和所述基板之间形成的贯通电极绝缘层，并且具有与所述接合绝缘层图案的下表面的一部分接触的上表面。

    LIGHT-EMITTING DIODE PACKAGE
    5.
    发明申请
    LIGHT-EMITTING DIODE PACKAGE 有权
    发光二极管封装

    公开(公告)号：US20150236228A1

    公开(公告)日：2015-08-20

    申请号：US14574094

    申请日：2014-12-17

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Jung-jin KIM ,  Min-young SON ,  Yong-min KWON

    IPC: H01L33/62 ,  H01L33/50 ,  H04N5/225 ,  H01L33/20 ,  H05B33/08 ,  H01L33/38 ,  H01L33/56

    CPC classification number: H01L33/62 ,  H01L33/0079 ,  H01L33/382 ,  H01L33/44 ,  H01L33/50 ,  H01L33/56 ,  H04N5/2256 ,  H04N5/2257 ,  H05B33/0845

    Abstract: A light-emitting diode package includes a light-emitting structure, a first electrode pad and a second electrode pad connected with the light-emitting structure, an insulating pattern layer in contact with a bottom surface of the light-emitting structure and abutting the first and second electrode pads, a substrate including via-holes in contact with a bottom surface of the insulating pattern layer and exposing a portion of the first electrode pad and a portion of the second electrode pad, a first penetrating electrode and a second penetrating electrode that are disposed in the via-holes and respectively connected with the first and second electrode pads, a fluorescent material layer disposed on the light-emitting structure, a glass disposed on and spaced apart from the light-emitting structure with the fluorescent material layer therebetween.

    Abstract translation: 发光二极管封装包括发光结构，第一电极焊盘和与发光结构连接的第二电极焊盘，与发光结构的底表面接触的绝缘图案层，并与第一 和第二电极焊盘，包括与绝缘图案层的底面接触的通孔的基板，暴露第一电极焊盘的一部分和第二电极焊盘的一部分，第一穿透电极和第二穿透电极， 设置在通孔中，分别与第一和第二电极焊盘连接，设置在发光结构上的荧光材料层，设置在发光结构上并与发光结构间隔开的玻璃，其间具有荧光材料层。

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