公开(公告)号：US20150243846A1

公开(公告)日：2015-08-27

申请号：US14631611

申请日：2015-02-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yong-min KWON ,  Sung-jun IM ,  Kyoung-jun KIM

IPC: H01L33/38 ,  H01L33/58 ,  H01L33/32 ,  H01L33/56 ,  H01L33/62 ,  H01L33/06

CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L2224/16225

Abstract: A light emitting device package including a first electrode pad and a second electrode pad formed to contact a lower surface of a light emitting device; a bonded insulating layer pattern formed to at least partially cover side surfaces and lower surfaces of the first electrode pad and the second electrode pad; a substrate, in which via holes are formed which penetrate the substrate from a first surface of the substrate that contacts a lower surface of the bonded insulating layer pattern to a second surface of the substrate that is opposite to the first surface; a through-electrode disposed in each via hole and contacting the lower surface of one of the respective first electrode pad and the second electrode pad; and a through-electrode insulating layer formed between the through-electrode and the substrate, and having an upper surface that contacts a portion of the lower surface of the bonded insulating layer pattern.

Abstract translation: 一种发光器件封装，包括形成为接触发光器件的下表面的第一电极焊盘和第二电极焊盘; 形成为至少部分地覆盖所述第一电极焊盘和所述第二电极焊盘的侧表面和下表面的接合绝缘层图案; 基板，其中形成有从基板的与接合绝缘层图案的下表面接触到与第一表面相对的第二表面的基板的第一表面穿透基板的通孔; 设置在每个通孔中并与第一电极焊盘和第二电极焊盘之一接触的通孔; 以及在所述贯通电极和所述基板之间形成的贯通电极绝缘层，并且具有与所述接合绝缘层图案的下表面的一部分接触的上表面。

公开(公告)号：US20160284927A1

公开(公告)日：2016-09-29

申请号：US15067868

申请日：2016-03-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyuk-jin CHO ,  Kyoung-jun KIM ,  Dong-hoon LEE

IPC: H01L33/00 ,  H01L33/48

CPC classification number: H01L33/005 ,  H01L33/0079 ,  H01L33/382 ,  H01L33/486 ,  H01L2224/16225 ,  H01L2933/0033 ,  H01L2933/005

Abstract: Provided is a method of manufacturing a light-emitting diode (LED) package. The method includes: preparing a support structure on which a plurality of LED chips, each of which includes a semiconductor stack structure, and a light-transmissive material layer covering the plurality of LED chips are formed; mounting the support structure, on which the LED chips and the light-transmissive material layer are formed, on a cutting stage; and cutting the light-transmissive material layer, the semiconductor stack structure, and the support structure between the plurality of LED chips, by using a cutting device having a pattern blade on the cutting stage to singulate each of the individual LED packages.

Abstract translation: 提供一种制造发光二极管（LED）封装的方法。 该方法包括：制备其上包括半导体堆叠结构的多个LED芯片和覆盖多个LED芯片的透光材料层的支撑结构; 在切割台上安装其上形成有LED芯片和透光材料层的支撑结构; 以及通过使用在所述切割台上具有图案刮刀的切割装置来切割所述多个LED芯片之间的所述透光材料层，所述半导体堆叠结构和所述支撑结构，以对所述各个LED封装进行单片化。