公开(公告)号：US20130285085A1

公开(公告)日：2013-10-31

申请号：US13935431

申请日：2013-07-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyung-kun KIM

IPC: H01L27/15 ,  H01L33/50

CPC classification number: H01L27/15 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/50 ,  H01L2924/0002 ,  H01L2924/12042 ,  H01L2924/00

Abstract: Provided are a light-emitting device package and a method of manufacturing the same. The light-emitting device package may include a plurality of light-emitting chips on one substrate (board). The plurality of light-emitting chips may produce colors around a target color. The target color may be produced by combinations of the colors of light emitted from the plurality of light-emitting chips. The colors around the target color may have the same hue as the target color and have color temperatures different from that of the target color. The plurality of light-emitting chips may have color temperatures within about ±250K of that of the target color.

Abstract translation: 提供一种发光器件封装及其制造方法。 发光器件封装可以在一个衬底（板）上包括多个发光芯片。 多个发光芯片可以产生围绕目标颜色的颜色。 可以通过从多个发光芯片发射的光的颜色的组合来产生目标颜色。 目标颜色周围的颜色可能具有与目标颜色相同的色相，并且具有与目标颜色不同的色温。 多个发光芯片的颜色温度可以在目标颜色的大约±250K的范围内。

公开(公告)号：US20170033268A1

公开(公告)日：2017-02-02

申请号：US15162754

申请日：2016-05-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dong-kuk LEE ,  Si-han KIM ,  Hyung-kun KIM ,  Yong-min KWON ,  Geun-woo KO

IPC: H01L33/60 ,  H01L33/32 ,  H01L33/56 ,  H01L33/00 ,  H01L33/62 ,  H01L33/38 ,  H01L33/06 ,  H01L33/18

CPC classification number: H01L33/60 ,  H01L33/007 ,  H01L33/06 ,  H01L33/18 ,  H01L33/32 ,  H01L33/38 ,  H01L33/382 ,  H01L33/44 ,  H01L33/54 ,  H01L33/56 ,  H01L33/62 ,  H01L2933/0016 ,  H01L2933/005 ,  H01L2933/0058

Abstract: A light-emitting diode (LED) package includes a light-emitting structure including a first conductive-type semiconductor layer, an active layer, and a second conductive-type semiconductor layer; an isolating insulation layer; a first connection electrode portion and a second connection electrode portion electrically connected to the first conductive-type semiconductor layer and the second conductive-type semiconductor layer, respectively; a first electrode pad and a second electrode pad electrically connected to the first connection electrode portion and the second connection electrode portion, respectively; a first molding resin layer provided between the first electrode pad and the second electrode pad; a first pillar electrode and a second pillar electrode electrically connected to the first electrode pad and the second electrode pad, respectively; and a second molding resin layer provided on the first molding resin layer, the first electrode pad, and the second electrode pad, and between the first pillar electrode and the second pillar electrode.

Abstract translation: 发光二极管（LED）封装包括包括第一导电型半导体层，有源层和第二导电型半导体层的发光结构; 隔离绝缘层; 分别与第一导电型半导体层和第二导电型半导体层电连接的第一连接电极部分和第二连接电极部分; 分别电连接到第一连接电极部分和第二连接电极部分的第一电极焊盘和第二电极焊盘; 第一模塑树脂层，设置在所述第一电极焊盘和所述第二电极焊盘之间; 分别与第一电极焊盘和第二电极焊盘电连接的第一柱状电极和第二柱状电极; 以及设置在第一模塑树脂层，第一电极焊盘和第二电极焊盘上以及在第一柱状电极和第二柱状电极之间的第二模塑树脂层。