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    Electronic device and method for transmitting and receiving signals
    1.
    发明授权
    Electronic device and method for transmitting and receiving signals 有权

    公开(公告)号：US11362689B2

    公开(公告)日：2022-06-14

    申请号：US16080482

    申请日：2017-03-07

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Yong-Lim Go ,  Tae-Sik Yun ,  Sung-Chul Park

    IPC: H04B1/04 ,  H04W52/02

    Abstract: The present invention relates to an electronic device and, more particularly, to an electronic device and a method for transmitting and receiving signals. To this end, the electronic device according to the present invention may comprise: a transceiving unit comprising a first group of power amplifiers (PAs) including at least one PA and a second group of PAs including at least one PA; an antenna unit comprising a first antenna selectively coupled to a PA supporting a first frequency range or a second frequency range of the first group of PAs and the second group of the PAs, and a second antenna selectively coupled to a PA supporting the second frequency range or a third frequency range of the first group of PAs and the second group of the PAs; a power supply unit comprising a first power supply modulator connected to the first group of PAs and a second power supply modulator connected to the second group of PAs; and a communication processor for changing an output voltage at least in part on the basis of transmit power of the PA coupled to at least one of the first power supply modulator and the second power supply modulator, wherein at least one of the first group of PAs and at least one of the second group of PAs are capable of transmitting signals simultaneously.

    Electronic apparatus and control method therefor
    2.
    发明授权
    Electronic apparatus and control method therefor 有权

    公开(公告)号：US11133571B2

    公开(公告)日：2021-09-28

    申请号：US15766249

    申请日：2016-10-05

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Sung-Chul Park ,  Yeon-Woo Kim ,  Jong-Hyuk Kim ,  Seung-Gil Jeon ,  Young-Ju Kim ,  Chae-Man Lim

    IPC: H01Q1/24 ,  H01Q21/00 ,  H04W88/06 ,  H01Q5/50 ,  H04B7/06 ,  H04B7/08 ,  H01Q3/24 ,  H01Q9/42 ,  H01Q1/44 ,  H04B1/00

    Abstract: An electronic apparatus, according to various embodiments of the present invention, comprises: a first antenna of a first bandwidth; a second antenna of a second bandwidth which partially overlaps with the first bandwidth; a third antenna of the first bandwidth; a fourth antenna of the second bandwidth; a transmission/reception path corresponding to each of a plurality of bandwidths; a reception path corresponding to each of the plurality of bandwidths; and a path formation unit which forms a path such that any one of the first antenna and the third antenna is connected to the transmission/reception path, the other of the first antenna and the third antenna is connected to the reception path, and any one of the second antenna and the fourth antenna is connected to the transmission/reception path, and the other of the second antenna and the fourth antenna is connected to the reception path.

    Semiconductor memory device including stacked chips and memory module having the same
    4.
    发明授权
    Semiconductor memory device including stacked chips and memory module having the same 有权

    公开(公告)号：US10229900B2

    公开(公告)日：2019-03-12

    申请号：US15693707

    申请日：2017-09-01

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Jong-Wan Kim ,  Sung-Chul Park ,  Won-Il Bae

    IPC: G11C5/02 ,  H01L25/18 ,  H01L25/065 ,  G11C7/10 ,  G11C5/04 ,  G11C5/06

    Abstract: A semiconductor memory device includes a memory structure including a first integrated circuit chip and a plurality of second integrated circuit chips stacked on each other, the first integrated circuit chip is interposed between a pair of the plurality of second integrated circuit chips, an interface unit disposed on the first integrated circuit chip, the memory structure is connected to a third circuit through the interface unit, and the interface unit transfers operation signals to the first integrated circuit chip and the plurality of second integrated circuit chips, at least one inter-chip interconnector connected with the interface unit and the first integrated circuit chip and the plurality of second integrated circuit chips, and an external interconnector connected with the interface unit and the third circuit.

    DUAL-POLARIZED DUAL-BAND USER EQUIPMENT ANTENNA ARRAY
    7.
    发明申请
    DUAL-POLARIZED DUAL-BAND USER EQUIPMENT ANTENNA ARRAY 有权

    公开(公告)号：US20250023257A1

    公开(公告)日：2025-01-16

    申请号：US18444439

    申请日：2024-02-16

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jiantong Li ,  Sung-Chul Park ,  Jianhua Mo ,  Aditya Dave ,  Young Han Nam ,  Won Suk Choi ,  Gang Xu

    IPC: H01Q25/00 ,  H01Q1/38

    Abstract: An apparatus includes a first, second, and third substrates. The first substrate includes a first antenna element supporting a first frequency band and a second frequency band higher than the first frequency band. The first substrate includes a first dielectric material having a first dielectric constant. The second substrate includes a second antenna element supporting the first frequency band and the second frequency band. The second substrate includes the first dielectric material. The third substrate is disposed between the first substrate and the second substrate and includes a third antenna element supporting the second frequency band. The third substrate includes a second dielectric material having a second dielectric constant lower than a first dielectric constant. The first and second antenna elements form a first beam in the first frequency band. The first, second, and third antenna elements form a second beam in the second frequency band.

    Method of outputting a signal using an antenna disposed adjacent to a conductive member of a connector and an electronic device using the same
    9.
    发明授权
    Method of outputting a signal using an antenna disposed adjacent to a conductive member of a connector and an electronic device using the same 有权

    公开(公告)号：US11114762B2

    公开(公告)日：2021-09-07

    申请号：US15967070

    申请日：2018-04-30

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Sang-Ho Hong ,  Gun Park ,  Yong-Woog Shin ,  Sung-Chul Park

    IPC: H01Q1/24 ,  H01Q5/335 ,  H01Q1/48 ,  H01Q15/14

    Abstract: An electronic device is provided and includes a first housing forming a portion of an outside surface of the electronic device, a second housing coupled with the first housing and forming another portion of the outside surface of the electronic device, an antenna formed in at least a portion of the second housing, a connector including one or more connection pins for connection with an external device, at least a portion of an outside surface of the connector being formed of a conductive member, an adjusting circuit electrically connected with, at least, the portion of the outside surface of the connector formed of the conductive member, wherein an impedance of the adjusting circuit is variable. The electronic device may further include a processor configured to vary the impedance of the adjusting circuit based on a signal to be output through the antenna, and output the signal through the antenna, with the impedance of the adjusting circuit being varied.

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