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    PACKAGE SUBSTRATE FILM AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
    2.
    发明申请
    PACKAGE SUBSTRATE FILM AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME 有权

    公开(公告)号：US20220173026A1

    公开(公告)日：2022-06-02

    申请号：US17340280

    申请日：2021-06-07

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Kyoungsuk YANG ,  Soyoung LIM ,  Yechung CHUNG

    IPC: H01L23/498 ,  H01L21/48 ,  H01L21/66 ,  H01L23/538

    Abstract: A package substrate film including a film substrate including upper and lower surfaces; a test pattern including an upper test line pattern extending on the upper surface of the film substrate; a lower test line pattern extending on the lower surface of the film substrate; a first test via pattern penetrating the film substrate and connecting the upper test line pattern to the lower test line pattern; a second test via pattern penetrating the film substrate outside the first test via pattern and connecting the upper test line pattern to the lower test line pattern; and a test pad between the first test via pattern and the second test via pattern, the test pad including first test pad at an outer side of the first test via pattern; and second test pad at an inner side of the second test via pattern and facing the first test pad.

    FINGERPRINT SENSOR PACKAGE CARRIER AND FINGERPRINT SENSOR PACKAGE ASSEMBLY METHOD
    4.
    发明申请
    FINGERPRINT SENSOR PACKAGE CARRIER AND FINGERPRINT SENSOR PACKAGE ASSEMBLY METHOD 有权

    公开(公告)号：US20250131230A1

    公开(公告)日：2025-04-24

    申请号：US18672381

    申请日：2024-05-23

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Yechung CHUNG ,  Woonbae KIM ,  Youngjun YOON ,  Soyoung LIM ,  Jaehyun LIM ,  Inho CHOI

    IPC: G06K19/07 ,  G06K19/077 ,  G06V40/13

    Abstract: A fingerprint sensor package carrier includes: a film member including through-holes formed in sides of the film member; and a plurality of fingerprint sensor packages arranged on the film member, wherein each of the plurality of fingerprint sensor packages includes a substrate and a controller chip disposed on the substrate, wherein the substrate of each of the plurality of fingerprint sensor packages includes a plurality of first sensing patterns and a plurality of second sensing patterns, wherein the plurality of first sensing patterns are spaced apart from each other in a first direction and extend in a second direction intersecting the first direction, and the plurality of second sensing patterns are spaced apart from each other in the second direction and extend in the first direction, and wherein the film member has adhesiveness, such that the plurality of fingerprint sensor packages are configured to be detached from the film member.

    CHIP ON FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME
    5.
    发明申请
    CHIP ON FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME 有权

    公开(公告)号：US20250096085A1

    公开(公告)日：2025-03-20

    申请号：US18767435

    申请日：2024-07-09

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Soyoung LIM ,  Inho CHOI

    IPC: H01L23/495 ,  H01L23/00 ,  H01L25/065

    Abstract: A chip on film (COF) package may include a base film including a first side extending in a first horizontal direction, a plurality of conductive lines on an upper surface of the base film and extending in a second horizontal direction perpendicular to the first horizontal direction, a plurality of bridge patterns respectively connected with the plurality of conductive lines and arranged along the first side of the base film, an interlayer insulation layer on the base film and covering a plurality of bridge patterns, and a plurality of input pads on the interlayer insulation layer and respectively connected with the plurality of bridge patterns.

    DISPLAY APPARATUS
    7.
    发明申请
    DISPLAY APPARATUS 有权
    显示设备

    公开(公告)号：US20140328031A1

    公开(公告)日：2014-11-06

    申请号：US14262658

    申请日：2014-04-25

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： KYOUNGSUK YANG ,  Jeong-Kyu HA ,  PaLan LEE ,  NARAE SHIN ,  Soyoung LIM ,  Jae-Min JUNG ,  KyongSoon CHO

    IPC: H05K1/02 ,  H05K5/00

    CPC classification number: H05K1/118 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/0949 ,  H05K2201/10128

    Abstract: Provided is a display apparatus. The display apparatus includes a display panel, a flexible circuit film having a rear surface connected to the display panel, and a front surface opposite to the rear surface, the front surface having a chip mounted thereon, and a first lead bonding portion electrically connecting the chip to the display panel. The first lead bonding portion includes a first portion connected to the chip and overlying a portion of the flexible circuit film, a second portion passing through the flexible circuit film, and a third portion disposed between the flexible circuit film and the display panel on the rear surface of the flexible circuit film, where the third portion overlaps the first portion.

    Abstract translation: 提供了一种显示装置。 显示装置包括显示面板，具有连接到显示面板的后表面的柔性电路薄膜和与背面相对的前表面，前表面具有安装在其上的芯片，以及第一引线接合部分， 芯片到显示面板。 第一引线接合部分包括连接到芯片并覆盖柔性电路膜的一部分的第一部分，穿过柔性电路膜的第二部分和设置在柔性电路膜和后面的显示面板之间的第三部分 柔性电路膜的表面，其中第三部分与第一部分重叠。

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