公开(公告)号：US12090642B2

公开(公告)日：2024-09-17

申请号：US17002008

申请日：2020-08-25

Applicant: SEMES CO., LTD. ,  SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chang Bu Jeong ,  Jong Sung Park ,  Jung Sub Kim ,  Young Gun Park ,  Dae Seok Choi ,  Sang Hoon Jung ,  Min Gu Lee ,  Eui Sun Choi ,  Kang San Lee ,  Dae Ho Min ,  Seung Dae Seok

IPC: B25J15/06 ,  B65G47/91

CPC classification number: B25J15/0616 ,  B65G47/911 ,  B65G2249/045

Abstract: Provided are a die pickup module and a die bonding apparatus including the same. The die pickup module includes a wafer stage for supporting a wafer including dies attached on a dicing tape, a die ejector arranged under the dicing tape and for separating a die to be picked up from the dicing tape, a non-contact picker for picking up the die in a non-contact manner so as not to contact a front surface of the die, a vertical driving unit for moving the non-contact picker in a vertical direction to pick up the die and an inverting driving unit for inverting the non-contact picker to invert a die picked up by the non-contact picker.

公开(公告)号：US11600515B2

公开(公告)日：2023-03-07

申请号：US17002009

申请日：2020-08-25

Applicant: Semes Co., Ltd. ,  Samsung Electronics Co., Ltd.

Inventor： Chang Bu Jeong ,  Min Gu Lee ,  Eui Sun Choi ,  Kang San Lee ,  Dae Ho Min ,  Seung Dae Seok

IPC: H01L21/683 ,  H01L21/687 ,  H01L21/673

Abstract: Provided are a die pickup module and a die bonding apparatus including the same. The die pickup module includes a wafer stage for supporting a wafer including dies attached on a dicing tape, a die ejector arranged under the dicing tape and for separating a die to be picked up from the dicing tape, a non-contact picker for picking up the die in a non-contact manner so as not to contact a front surface of the die, a vacuum gripper for partially vacuum adsorbing a rear surface of the die picked up by the non-contact picker and an inverting driving unit for inverting the vacuum gripper to invert the die so that a rear surface of the die gripped by the vacuum gripper faces upward.

公开(公告)号：US20170136570A1

公开(公告)日：2017-05-18

申请号：US15340303

申请日：2016-11-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seung Dae Seok ,  Sang Yoon Kim ,  Hui Jae KIM ,  Jae Bong SHIN ,  Byung Joon LEE

IPC: B23K20/02 ,  B23K20/00 ,  B23K20/26 ,  H01L23/00

CPC classification number: B23K20/026 ,  B23K3/085 ,  B23K20/004 ,  B23K20/26 ,  B23K37/003 ,  H01L24/75 ,  H01L2224/75251 ,  H01L2224/75501 ,  H01L2224/7598 ,  H01L2224/75988

Abstract: A bonding stage is provided. The bonding stage includes a first heater disposed under a first region of a substrate having a plurality of semiconductor chips disposed thereon, a second heater disposed under a second region different from the first region of the substrate, a cooler disposed under the first heater and the second heater and blocking heat of the first heater and heat of the second heater from being transferred to lower portions of the first heater and the second heater, and a thin plate disposed on the first heater and the second heater to support the substrate and transferring the heat of the first heater and the heat of the second heater to the substrate, wherein the first heater and the second heater are independently operated.

公开(公告)号：US09620476B2

公开(公告)日：2017-04-11

申请号：US14532190

申请日：2014-11-04

Applicant: SEMES CO., LTD. ,  SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hang Lim Lee ,  Jong Jin Weon ,  Soon Hyun Kim ,  Seung Dae Seok

IPC: B32B37/00 ,  H01L23/00 ,  H01L21/683

CPC classification number: H01L24/75 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2224/75252 ,  H01L2224/75253 ,  H01L2224/75301 ,  H01L2224/75305 ,  H01L2224/75312 ,  H01L2224/75502 ,  H01L2224/7565 ,  H01L2224/75745 ,  H01L2224/759 ,  H01L2224/81048 ,  H01L2224/81203 ,  H01L2224/83048 ,  H01L2224/83203 ,  H01L2924/00012 ,  H01L2924/01029 ,  H01L2924/01013 ,  H01L2924/00014

Abstract: A bonding head and a die bonding apparatus having the same are disclosed. The bonding head includes a body connected to a driving section for transferring the die, a plate heater mounted to a lower surface of the body and a collet mounted to a lower surface of the plate heater and configured to hold the die using a vacuum pressure. A cooling channel is formed at the lower surface of the body, and cooling passages are formed through the body and connected with the cooling channel to supply a cooling fluid into the cooling channel and to recover the cooling fluid from the cooling channel thereby cooling the plate heater.

公开(公告)号：US09508577B2

公开(公告)日：2016-11-29

申请号：US14337571

申请日：2014-07-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byung Joon Lee ,  Masato Kajinami ,  Yoshiaki Yukimori ,  Sang-Yoon Kim ,  Hui-Jae Kim ,  Byeong-Kuk Park ,  Seung Dae Seok ,  Jae Bong Shin ,  Byeong Kap Choi

IPC: H01L21/66 ,  H01L21/67 ,  H01L23/00 ,  H05K13/04

CPC classification number: H01L21/67259 ,  H01L21/67109 ,  H01L21/67144 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/73204 ,  H01L2224/75502 ,  H01L2224/7565 ,  H01L2224/75753 ,  H01L2224/75824 ,  H01L2224/7598 ,  H01L2224/81127 ,  H01L2224/81204 ,  H01L2224/81801 ,  H01L2224/83127 ,  H01L2224/83204 ,  H01L2224/8385 ,  H01L2224/92125 ,  H05K13/046 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A semiconductor manufacturing apparatus may include: a pickup unit configured to pick up a chip in a first region of the semiconductor manufacturing apparatus; a bonding head configured to receive the picked-up chip and configured to move from the first region to a top of a circuit board in a second region of the semiconductor manufacturing apparatus; and/or an optical unit configured to detect a bonding position on the circuit board while moving from the first region to the second region. A semiconductor manufacturing apparatus may include: a bonding head including a heater for heating a chip and bonding the chip onto a circuit board; and/or a cooling block, adjacent to the heater, through which cooling liquid flows. The cooling liquid may be removed from the cooling block while the heater generates heat. The cooling liquid may be supplied to the cooling block while the heater is cooled.

Abstract translation: 半导体制造装置可以包括：拾取单元，被配置为拾取半导体制造装置的第一区域中的芯片; 接合头，被配置为接收所拾取的芯片并且被配置为在所述半导体制造装置的第二区域中从所述第一区域移动到电路板的顶部; 和/或配置成在从第一区域移动到第二区域时检测电路板上的接合位置的光学单元。 半导体制造装置可以包括：接合头，包括用于加热芯片并将芯片接合到电路板上的加热器; 和/或与加热器相邻的冷却块，冷却液通过该冷却块流动。 当加热器产生热量时，冷却液体可从冷却块移除。 冷却液可以在加热器被冷却时供应到冷却块。