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公开(公告)号:US20230078095A1
公开(公告)日:2023-03-16
申请号:US17695062
申请日:2022-03-15
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Dougyong SUNG , Youngdo Kim , Byeongsang Kim , Yunhwan Kim , Jungmo Yang , Sejin Oh , Sungho Jang
IPC: H01J37/32
Abstract: A plasma etching apparatus includes a housing having a processing space; a support inside the housing, the support configured to support a substrate and including at least one lower electrode; at least one upper electrode facing the at least one lower electrode; a sidewall electrode disposed on a sidewall of the housing; a lower radiofrequency (RF) power source connected to the at least one lower electrode and configured to apply RF power; an upper RF power source connected to the at least one upper electrode and configured to apply RF power; a lower insulator adjacent to the at least one lower electrode; an upper insulator adjacent to the at least one upper electrode; at least one lower detector embedded in the lower insulator; and at least one upper detector embedded in the upper insulator.
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公开(公告)号:US20250085445A1
公开(公告)日:2025-03-13
申请号:US18633031
申请日:2024-04-11
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Chansoo Kang , Daewon Kang , Minju Kim , Tae-Hyun Kim , Sang Ki Nam , Dougyong Sung , Jungmo Yang , Sejin Oh , Keonhee Lim , Junho Im
Abstract: A substrate processing apparatus includes a process chamber providing a process space, a stage located in the process chamber and configured to support a substrate, a window coupled to a side of the process chamber, and a scintillator layer coupled to one side surface of the window. The scintillator layer covers a portion of the one side surface of the window which is less than the full window surface. A second surface corresponding to another portion of the one side surface of the window is exposed. Light emitted by a plasma in the process space passes through the window and is collected by an optical system and analyzed. Ultraviolet light passing through the scintillator is converted to longer wavelength, generally visible, light. Comparing the light passing through the bare window with the light passing through the scintillator layer enables analysis of the plasma.
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公开(公告)号:US20240071737A1
公开(公告)日:2024-02-29
申请号:US18188540
申请日:2023-03-23
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sungwon Cho , Dohoon Kwon , Kyunghyun Kim , Dougyong Sung , Jungmo Yang , Younseon Wang , Younsok Choi
CPC classification number: H01J37/32917 , G01N9/00 , H01J2237/24585
Abstract: A plasma sensor module may include an upper substrate, a lower substrate, at least one probe and a printed circuit board (PCB). The upper substrate may be configured to be exposed to plasma. The lower substrate may contact a lower surface of the upper substrate. The lower substrate may have a thickness that is thicker than a thickness of the upper substrate. The probe may be in the lower substrate. The PCB may be in the lower substrate. The PCB may be configured to apply an alternating current to the probe to detect a density of the plasma. Thus, the structural strength of the plasma sensor module may have improved structural strength.
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公开(公告)号:US20250046587A1
公开(公告)日:2025-02-06
申请号:US18636099
申请日:2024-04-15
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Taehyun Kim , Chansoo Kang , Minju Kim , Daewon Kang , Dougyong Sung , Jungmo Yang , Sejin Oh
Abstract: The present disclosure relates to plasma diagnostic devices. An example plasma diagnostic device includes a pinhole through which a first optical signal passes, an optical device in which the first optical signal is incident and the first optical signal is converted into a second optical signal, a filter configured to filter the second optical signal and to output a third optical signal of a specific wavelength band, and a sensor configured to monitor a distribution of the first optical signal, the second optical signal, and the third optical signal.
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