公开(公告)号：US20180049324A1

公开(公告)日：2018-02-15

申请号：US15446255

申请日：2017-03-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jung-eun Koo ,  Ye-chung Chung ,  Yong-hoon Kim

IPC: H05K1/18 ,  H01L23/00 ,  G09G5/18 ,  H01L25/065 ,  H01L21/48 ,  H01L23/538 ,  H01L25/18

CPC classification number: H05K1/185 ,  G09G3/20 ,  G09G5/18 ,  G09G2300/0426 ,  G09G2310/08 ,  H01L21/486 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L24/17 ,  H01L25/0655 ,  H01L25/16 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/16227 ,  H01L2924/141 ,  H01L2924/1426 ,  H01L2924/15153 ,  H01L2924/15192 ,  H01L2924/15724 ,  H01L2924/15747 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19102 ,  H01L2924/19105 ,  H05K1/181 ,  H05K1/186 ,  H05K1/189 ,  H05K2201/0154 ,  H05K2201/10128 ,  H05K2201/10515 ,  H05K2201/10545 ,  H05K2201/10681

Abstract: Provided are a semiconductor package and a display device including the same. In some aspects, the semiconductor package may include a film substrate including a base film including cavities and a wiring layer on the base film, a semiconductor chip connected to the wiring layer and mounted on a surface of the base film, and passive devices accommodated in the cavities of the base film and electrically connected to the semiconductor chip through the wiring layer. According to other aspects a base film having at least one recess may be provided. A wiring layer may be on the base film, and a semiconductor chip may be connected to the wiring layer and mounted on a surface of the base film. At least one passive device may be in the at least one recess of the base film and electrically connected to the semiconductor chip via the wiring layer.