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公开(公告)号:US20250159979A1
公开(公告)日:2025-05-15
申请号:US18606001
申请日:2024-03-15
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Panjae PARK , Jintae KIM , Hyojong SHIN
IPC: H01L27/092 , H01L21/822 , H01L21/8238 , H01L29/06 , H01L29/417 , H01L29/423 , H01L29/66 , H01L29/775
Abstract: Provided is a semiconductor device which includes: a 1st channel structure; a 1st source/drain region and a 2nd source/drain region connected through the 1st channel structure in a 1st direction; a 1st gate structure on the 1st channel structure; a 1st contact structure on the 1st source/drain region and connecting the 1st source/drain region to a voltage source; and a 2nd contact structure on the 2nd source/drain region and connecting the 2nd source/drain region to another circuit element other than a voltage source, wherein a 1st contact area between the 1st contact structure and the 1st source/drain region is greater than a 2nd contact area between the 2nd contact structure and the 2nd source/drain region.
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公开(公告)号:US20250167110A1
公开(公告)日:2025-05-22
申请号:US18617033
申请日:2024-03-26
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jintae KIM , Hyo Jong SHIN , Panjae PARK , Kang-ill SEO
IPC: H01L23/528 , H01L27/06 , H01L27/092 , H01L29/06 , H01L29/423 , H01L29/775 , H01L29/786
Abstract: Provided is a semiconductor device based on a cell block which may include: a 1st cell comprising a 1st lower active region and a 1st upper active region above the 1st lower active region in a 3rd direction, both being extended in a 1st direction; a 2nd cell comprising a 2nd lower active region and a 2nd upper active region above the 2nd lower active region in the 3rd direction, both being extended in the 1st direction; and a cell spacer between the 1st cell and the 2nd cell in a 2nd direction, wherein no active region is formed in the cell spacer.
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公开(公告)号:US20240413160A1
公开(公告)日:2024-12-12
申请号:US18382301
申请日:2023-10-20
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jintae KIM , Kang-ill Seo
IPC: H01L27/118
Abstract: A semiconductor device includes: a plurality of cells including 1st cells arranged in a 1st row of a layout of the semiconductor device; and a 1st backside power rail and a 2nd backside power rail disposed below the 1st cells, extended in a 1st direction, and arranged in a 2nd direction intersecting the 1st direction, wherein the 1st backside power has a 1st width, and the 2nd backside power rail has a 2nd width which is different from the 1st width.
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公开(公告)号:US20230021819A1
公开(公告)日:2023-01-26
申请号:US17871538
申请日:2022-07-22
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Kyoungwon LEE , Jintae KIM , Sungwon ROH
IPC: H03M1/36
Abstract: An analog-to-digital converter (ADC) for converting an analog signal into a digital signal includes an amplifier circuit configured to receive the analog signal, and to generate a plurality of amplifier signals by amplifying the analog signal; a comparison circuit configured to compare a plurality of voltage levels corresponding to the plurality of amplifier signals with a positive reference voltage level and a negative reference voltage level, and to output conversion target signals based on a result of the comparison; and a converter circuit configured to convert the conversion target signals into a plurality of digital signals.
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公开(公告)号:US20250142871A1
公开(公告)日:2025-05-01
申请号:US18617125
申请日:2024-03-26
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jaehong LEE , Jintae KIM , Myung YANG , Kang-ill SEO
IPC: H01L29/417 , H01L27/088 , H01L29/423 , H01L29/775 , H01L29/786
Abstract: Provided is a semiconductor device which includes a 1st source/drain region; and a 1st contact structure on a 1st portion of the 1st source/drain region; and a 2nd contact structure on a 2nd portion of the 1st source/drain region, wherein at least one of the 1st contact structure and the 2nd contact structure is configured to connect the 1st source/drain region to a voltage source or another circuit element for signal routing.
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公开(公告)号:US20240304520A1
公开(公告)日:2024-09-12
申请号:US18226338
申请日:2023-07-26
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jintae KIM , Panjae PARK
IPC: H01L23/48
CPC classification number: H01L23/481
Abstract: Provided is a semiconductor cell architecture which includes a plurality of cells, a plurality of backside power rails, and a plurality of metal lines, wherein the backside power rails are extended in a cell-length direction, and at least one backside power rail vertically overlaps an inside area of at least one cell without vertically overlapping a lower boundary or an upper boundary of the at least one cell in a plan view.
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公开(公告)号:US20240145343A1
公开(公告)日:2024-05-02
申请号:US18133872
申请日:2023-04-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Panjae PARK , Jintae KIM , Hyoeun PARK , Kang-Ill SEO
IPC: H01L23/48 , H01L27/092 , H01L29/06 , H01L29/423 , H01L29/775
CPC classification number: H01L23/481 , H01L27/0924 , H01L29/0673 , H01L29/42392 , H01L29/775
Abstract: A cell architecture including at least one semiconductor device cell is provided. The cell includes: a 1st active pattern and a 2nd active pattern extended in a 1st direction, the 1st active pattern at least partially overlapping the 2nd active pattern in a 3rd direction intersecting the direction; a plurality of gate structures extended in a 2nd direction across the 1st and 2nd active patterns, the 2nd direction intersecting the 1st direction and the 3rd direction; a plurality of metal lines in at least one metal layer of the cell, the metal lines being extended in the 1st direction, and at least one of the metal lines being connected to at least one of the 1st and 2nd active patterns and the gate structures; and at least one power rail connecting the at least one of the 1st and 2nd active patterns to at least one voltage source, wherein the at least one power rail is disposed to be closer to a virtual horizontal center line of the cell extended in the 1st direction than an upper boundary or a lower boundary of the cell.
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公开(公告)号:US20250031456A1
公开(公告)日:2025-01-23
申请号:US18537211
申请日:2023-12-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jintae KIM , Panjae PARK , Kang-ill SEO
IPC: H01L27/02 , H01L23/528 , H01L27/092
Abstract: Provided is a semiconductor device based on a cell architecture which includes: a 1st semiconductor cell; and a 2nd semiconductor cell which is connected to the 1st semiconductor cell in a 1st direction such that an output pin of the 1st semiconductor cell is connected to an input pin of the 2nd semiconductor cell, wherein the 2nd semiconductor cell is in a form in which the 1st semiconductor cell is turned upside down.
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公开(公告)号:US20240313000A1
公开(公告)日:2024-09-19
申请号:US18226328
申请日:2023-07-26
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jintae KIM , Panjae PARK , Kang-ill SEO
IPC: H01L27/12
CPC classification number: H01L27/124
Abstract: Provided is a semiconductor device including a 1st frontside metal line at a front side of the semiconductor device; and a 1st backside metal line at a back side of the semiconductor device, wherein the 1st backside metal line is connected to the 1st frontside metal line.
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