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公开(公告)号:US20240349511A1
公开(公告)日:2024-10-17
申请号:US18521629
申请日:2023-11-28
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jungmin PARK , Ji-Sung KIM , Han Jin LIM , Hyungsuk JUNG
Abstract: A capacitor according to at least one embodiment may include a first electrode and a second electrode spaced apart from each other, and a dielectric layer disposed between the first electrode and the second electrode and including a ferroelectric layer and an auxiliary portion disposed in the ferroelectric layer, wherein an energy band gap Eg of the auxiliary portion may be lower than about 4.0 eV.
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公开(公告)号:US20240164094A1
公开(公告)日:2024-05-16
申请号:US18479591
申请日:2023-10-02
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Ji-Sung KIM , Jung Min PARK , Bong Jin KUH , Yong Ho HA
IPC: H10B41/27 , H01L21/28 , H01L25/065 , H01L29/51 , H10B41/10 , H10B41/35 , H10B43/10 , H10B43/27 , H10B43/35 , H10B80/00
CPC classification number: H10B41/27 , H01L25/0652 , H01L29/40111 , H01L29/516 , H10B41/10 , H10B41/35 , H10B43/10 , H10B43/27 , H10B43/35 , H10B80/00 , H01L2225/06506
Abstract: A semiconductor memory device comprises, a substrate, a mold structure including gate electrodes and mold insulating films alternately stacked on the substrate, and a channel structure penetrating the mold structure, wherein the channel structure comprises a semiconductor pattern and a dielectric film on the semiconductor pattern, wherein the dielectric film comprises a first crystalline film in contact with the gate electrodes and a second crystalline film between the first crystalline film and the semiconductor pattern, wherein the first crystalline film includes a first matrix and a first impurity and the second crystalline film includes a second matrix and a second impurity, wherein each of the first matrix and the second matrix comprises at least one of HfO2, HfxZr1-xO2 (0.5
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公开(公告)号:US20250016978A1
公开(公告)日:2025-01-09
申请号:US18613471
申请日:2024-03-22
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jung Min PARK , Ji-Sung KIM , Hae Ryong KIM , Bo-Eun PARK , Han Jin LIM , Hyung Suk JUNG
IPC: H10B12/00
Abstract: A capacitor structure is provided. The capacitor structure comprises an upper electrode, a lower electrode including a lower electrode film and a lower interface electrode film, a capacitor dielectric film between the lower electrode and the upper electrode, and an interface blocking film between the lower electrode and the capacitor dielectric film, the interface blocking film being in contact with the capacitor dielectric film and the lower interface electrode film, wherein the interface blocking film includes a first metal oxide containing a first metal element, the lower interface electrode film includes a second conductive metal oxide containing a second metal element different from the first metal element, the capacitor dielectric film does not include the first metal oxide, and a thickness of the lower interface electrode film is greater than that of the interface blocking film.
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公开(公告)号:US20240315045A1
公开(公告)日:2024-09-19
申请号:US18495038
申请日:2023-10-26
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jungmin PARK , Ji-Sung KIM , Hanjin LIM , Hyungsuk JUNG
IPC: H10B53/30
CPC classification number: H10B53/30
Abstract: A semiconductor device may include a substrate including a first impurity region and a second impurity region; a first word line in a region of the substrate with the first impurity region on one side of the first word line and the second impurity region on an other side of the first word line; a bit line connected to the first impurity region; a first conductive pattern connected to the second impurity region; a first partial electrode and a second partial electrode on the first conductive pattern; a first dielectric layer in contact with an upper surface of the first partial electrode and an upper surface of the second partial electrode; and a common electrode on the first dielectric layer. An area of the upper surface of the first partial electrode may be different from an area of the upper surface of the second partial electrode.
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公开(公告)号:US20130322177A1
公开(公告)日:2013-12-05
申请号:US13835780
申请日:2013-03-15
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Eui-Seung KIM , Ji-Sung KIM
CPC classification number: G11C7/12 , G11C11/5642 , G11C16/24 , G11C16/28
Abstract: An integrated includes a memory cell, a bit line connected to the memory cell, a boosting circuit to boost the bit line up to a boosting voltage during a pre-charge operation pre-charging the bit line, and a regulation circuit connected between the bit line and an output terminal and determines a logic level of the output terminal according to the voltage of the bit line.
Abstract translation: 集成包括存储器单元,连接到存储单元的位线,在预充电位线的预充电操作期间将位线升高到升压电压的升压电路,以及连接在位之间的调节电路 线路和输出端子,并根据位线的电压确定输出端子的逻辑电平。
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