Semiconductor devices
    1.
    发明授权

    公开(公告)号:US11380711B2

    公开(公告)日:2022-07-05

    申请号:US17154583

    申请日:2021-01-21

    Abstract: A semiconductor device includes a substrate having an active region defined by a device isolation film and providing a first channel region; a first source/drain region in the active region on first and second sides of the first channel region; a gate structure having a first gate insulating film, a shared gate electrode, and a second gate insulating film, sequentially arranged on the active region; a cover semiconductor layer on the second gate insulating film and electrically separated from the active region to provide a second channel region; a second source/drain region in the cover semiconductor layer on first and second sides of the second channel region first and second source/drain contacts respectively connected to the first and second source/drain regions; and a shared gate contact connected to the shared gate electrode.

    Semiconductor devices with enhanced substrate isolation

    公开(公告)号:US12080799B2

    公开(公告)日:2024-09-03

    申请号:US17715887

    申请日:2022-04-07

    CPC classification number: H01L29/78603 H01L29/0607

    Abstract: A semiconductor device includes a substrate having a recess therein that is partially filled with at least two semiconductor active regions. The recess has sidewalls and a bottom that are sufficiently lined with corresponding substrate insulating layers that the at least two semiconductor active regions are electrically isolated from the substrate, which surrounds the sidewalls and bottom of the recess. A sidewall insulating layer is provided, which extends as a partition between first and second ones of the at least two semiconductor active regions, such that the first and second ones of the at least two semiconductor active regions are electrically isolated from each other. First and second gate electrodes are provided in the first and second active regions, respectively.

    SEMICONDUCTOR DEVICES WITH ENHANCED SUBSTRATE ISOLATION

    公开(公告)号:US20220376116A1

    公开(公告)日:2022-11-24

    申请号:US17715887

    申请日:2022-04-07

    Abstract: A semiconductor device includes a substrate having a recess therein that is partially filled with at least two semiconductor active regions. The recess has sidewalls and a bottom that are sufficiently lined with corresponding substrate insulating layers that the at least two semiconductor active regions are electrically isolated from the substrate, which surrounds the sidewalls and bottom of the recess. A sidewall insulating layer is provided, which extends as a partition between first and second ones of the at least two semiconductor active regions, such that the first and second ones of the at least two semiconductor active regions are electrically isolated from each other. First and second gate electrodes are provided in the first and second active regions, respectively.

    SEMICONDUCTOR DEVICES
    5.
    发明申请

    公开(公告)号:US20220336501A1

    公开(公告)日:2022-10-20

    申请号:US17854128

    申请日:2022-06-30

    Abstract: A semiconductor device includes a substrate having an active region defined by a device isolation film and providing a first channel region; a first source/drain region in the active region on first and second sides of the first channel region; a gate structure having a first gate insulating film, a shared gate electrode, and a second gate insulating film, sequentially arranged on the active region; a cover semiconductor layer on the second gate insulating film and electrically separated from the active region to provide a second channel region; a second source/drain region in the cover semiconductor layer on first and second sides of the second channel region; first and second source/drain contacts respectively connected to the first and second source/drain regions; and a shared gate contact connected to the shared gate electrode.

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