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公开(公告)号:US20200220572A1
公开(公告)日:2020-07-09
申请号:US16733975
申请日:2020-01-03
Applicant: Samsung Electronics Co., Ltd.
Inventor: Ohhyuck KWON , Jaeyoung HUH , Daesuk KANG , Boram KIM , Jonghoon LIM , Sungchul PARK
Abstract: Methods and devices for antenna switching are provided. A wireless signal is transmitted and received through a specific antenna module among a plurality of antenna modules. Status information about each of one or more other antenna modules among the plurality of antenna modules is acquired, when a temperature of the specific antenna module exceeds a predetermined value. The temperature of the specific antenna module is measured through a respective sensor module of a plurality of sensor modules. Each sensor module of the plurality of sensor modules is contained in or disposed adjacent to a respective antenna module of the plurality of antenna modules. The specific antenna module is switched to an antenna module selected from among the one or more other antenna modules, based on the acquired status information.
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公开(公告)号:US20230378993A1
公开(公告)日:2023-11-23
申请号:US18363908
申请日:2023-08-02
Applicant: Samsung Electronics Co., Ltd.
Inventor: Ohhyuck KWON , Jaeyoung HUH , Daesuk KANG , Boram KIM , Jonghoon LIM , Sungchul PARK
CPC classification number: H04B1/44 , H01Q3/24 , H01Q21/0025 , H04B1/0064 , H04M1/026 , H04M2250/12
Abstract: An electronic device and method thereof are provided. A method includes, while a wireless communication of a first frequency band is performed via a first 5G antenna, obtaining first status information related to the first 5G antenna and second status information related to a second 5G antenna; if the first status information does not satisfy a first predetermined condition and the second status information satisfies a second predetermined condition, switching from the first 5G antenna to the second 5G antenna, and performing the wireless communication in the first frequency band via the second 5G antenna; and if the first status information does not satisfy the first predetermined condition and the second status information does not satisfy the second predetermined condition, switching from the first 5G antenna to a legacy communication antenna, and performing the wireless communication in a second frequency band via the legacy communication antenna.
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公开(公告)号:US20230350472A1
公开(公告)日:2023-11-02
申请号:US18346394
申请日:2023-07-03
Applicant: Samsung Electronics Co., Ltd.
Inventor: Ohhyuck KWON , Jaeyoung HUH , Daesuk KANG , Seunghoon KANG , Boram KIM , Hongki MOON , Yoonsun PARK , Kyungwoo LEE , Seungjoo LEE , Jonghoon LIM
IPC: G06F1/20 , H01L23/427 , G06F1/16
CPC classification number: G06F1/203 , H01L23/427 , G06F1/206 , G06F1/1637
Abstract: Disclosed is an electronic device including a housing including a first surface, a second surface facing away the first surface, and a third surface surrounding a space between the first surface and the second surface; a display exposed through the first surface; a battery disposed in the space; a heating source disposed between the battery and the third surface; and a thermal diffusion member disposed between the heating source and the battery. The thermal diffusion member includes a fluid; a first portion disposed adjacent to the heating source for receiving heat from the heating source; and at least one second portion extending from the first portion. The heat transferred from the heating source to the first portion is transferred from the first portion to the at least one second portion.
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公开(公告)号:US20210059076A1
公开(公告)日:2021-02-25
申请号:US16988980
申请日:2020-08-10
Applicant: Samsung Electronics Co., Ltd.
Inventor: Ohhyuck KWON , Min PARK , Jaeyoung HUH , Daesuk KANG , Ji EOM , Ewidon JEONG , Sungchul PARK
Abstract: A composite heat dissipation member and an electronic device comprising the composite heat dissipation member. The composite head dissipation member may include a first heat dissipation sheet disposed to be overlapped with an antenna module, and a second heat dissipation sheet disposed adjacent to the first heat dissipation sheet without an overlap with the first heat dissipation sheet, thermally connected to the first heat dissipation sheet, and having a higher thermal conductivity than the first heat dissipation sheet.
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