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    APPARATUS FOR MANUFACTURING DISPLAY APPARATUS AND METHOD OF MANUFACTURING DISPLAY APPARATUS
    2.
    发明申请
    APPARATUS FOR MANUFACTURING DISPLAY APPARATUS AND METHOD OF MANUFACTURING DISPLAY APPARATUS 审中-公开
    制造显示装置的装置和制造显示装置的方法

    公开(公告)号：US20160226031A1

    公开(公告)日：2016-08-04

    申请号：US14929159

    申请日：2015-10-30

    Applicant: Samsung Display Co., Ltd.

    Inventor： Choelmin Jang ,  Dongkyun Ko ,  Inkyo Kim ,  Sukwon Jung ,  Nam Ha ,  Myungsoo Huh

    IPC: H01L51/56 ,  H01L51/00 ,  H01L51/52

    CPC classification number: H01L51/56 ,  C23C16/4412 ,  C23C16/45551 ,  C23C16/45563 ,  C23C16/54 ,  H01L51/0097 ,  H01L51/5253 ,  H01L51/5256

    Abstract: An apparatus and method for manufacturing a display apparatus includes: a chamber; a first nozzle unit at the chamber, the first nozzle unit configured to deposit an organic layer or an inorganic layer on a substrate; a second nozzle unit at the chamber, the second nozzle unit configured to deposit the organic layer or the inorganic layer on a substrate and the second nozzle unit being linearly aligned with the first nozzle unit in a first direction; and an injection nozzle unit between the first nozzle unit and the second nozzle unit, the injection nozzle unit configured to inject a first gas in the chamber toward the substrate.

    Abstract translation: 一种显示装置的制造装置和方法，包括：室; 在所述腔室处的第一喷嘴单元，所述第一喷嘴单元被配置为在基板上沉积有机层或无机层; 所述第二喷嘴单元被配置为将所述有机层或所述无机层沉积在基板上，并且所述第二喷嘴单元在所述第一方向上与所述第一喷嘴单元线性对准; 以及在所述第一喷嘴单元和所述第二喷嘴单元之间的喷嘴单元，所述喷射喷嘴单元被配置为将所述室中的第一气体朝向所述基板喷射。

    Apparatus and method for etching organic layer
    5.
    发明授权
    Apparatus and method for etching organic layer 有权
    蚀刻有机层的装置和方法

    公开(公告)号：US09054342B2

    公开(公告)日：2015-06-09

    申请号：US14029296

    申请日：2013-09-17

    Applicant: Samsung Display Co., Ltd.

    Inventor： Yoshiaki Sakamoto ,  Nam Ha

    IPC: H01L21/4763 ,  H01L51/56

    CPC classification number: H01L51/56 ,  H01J37/32779 ,  H01J2237/334 ,  H01L21/67173 ,  H01L21/6776 ,  H01L51/0017

    Abstract: Provided are an apparatus and method for etching an organic layer, in which an organic material deposited in a non-layer forming area of a substrate is etched. The apparatus includes an etching chamber; a plasma generator configured to supply plasma into the etching chamber; a stage disposed in the etching chamber and configured to support the substrate; and a mask configured to guide the plasma toward the non-pixel area.

    Abstract translation: 提供了蚀刻有机层的装置和方法，其中沉积在衬底的非层形成区域中的有机材料被蚀刻。 该设备包括蚀刻室; 等离子体发生器，其被配置为将等离子体供应到所述蚀刻室中; 设置在所述蚀刻室中并被配置为支撑所述基板的台; 以及被配置为将等离子体引向非像素区域的掩模。

    APPARATUS AND METHOD FOR ETCHING ORGANIC LAYER
    6.
    发明申请
    APPARATUS AND METHOD FOR ETCHING ORGANIC LAYER 有权
    用于蚀刻有机层的装置和方法

    公开(公告)号：US20140357087A1

    公开(公告)日：2014-12-04

    申请号：US14029296

    申请日：2013-09-17

    Applicant: Samsung Display Co., Ltd.

    Inventor： Yoshiaki SAKAMOTO ,  Nam Ha

    IPC: H01L51/56

    CPC classification number: H01L51/56 ,  H01J37/32779 ,  H01J2237/334 ,  H01L21/67173 ,  H01L21/6776 ,  H01L51/0017

    Abstract: Provided are an apparatus and method for etching an organic layer, in which an organic material deposited in a non-layer forming area of a substrate is etched. The apparatus includes an etching chamber; a plasma generator configured to supply plasma into the etching chamber; a stage disposed in the etching chamber and configured to support the substrate; and a mask configured to guide the plasma toward the non-pixel area.

    Abstract translation: 提供了蚀刻有机层的装置和方法，其中沉积在衬底的非层形成区域中的有机材料被蚀刻。 该设备包括蚀刻室; 等离子体发生器，其被配置为将等离子体供应到所述蚀刻室中; 设置在所述蚀刻室中并被配置为支撑所述基板的台; 以及被配置为将等离子体引向非像素区域的掩模。

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