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    Electronic device including structure compensating for height difference between sensor and elastic member disposed on back surface of display
    5.
    发明授权
    Electronic device including structure compensating for height difference between sensor and elastic member disposed on back surface of display 有权

    公开(公告)号：US11348358B2

    公开(公告)日：2022-05-31

    申请号：US17266156

    申请日：2019-06-24

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Joohan Kim ,  Bongjae Rhee ,  Yongwon Lee ,  Seungho Hwang ,  Hyunsuk Choi

    IPC: G06V40/13 ,  G06F1/18

    Abstract: An electronic device having a step compensated fingerprint sensor is disclosed. The electronic device includes a display panel including a front surface and a rear surface; an elastic member, disposed on the rear surface of the display panel, including an opening and having a first designated height; a sensor having a second designated height lower than the first designated height and disposed in an inner space formed by a side surface, having the first designated height, of the opening and the rear surface of the display panel; a connection member electrically connected to the sensor and disposed on the sensor with a third designated height compensating for a difference between the first designated height and the second designated height; and a flexible substrate electrically connected to the connection member in the opening and extended to an area of the elastic member.

    Electronic device including display module including sensor and method for manufacturing the display module
    6.
    发明授权
    Electronic device including display module including sensor and method for manufacturing the display module 有权

    公开(公告)号：US11468700B2

    公开(公告)日：2022-10-11

    申请号：US16791404

    申请日：2020-02-14

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Yongwon Lee ,  Il Kim ,  Dareum Kang ,  Chohee Park ,  Dohyun Bae ,  Hyeoncheol Jeong ,  Jeonggyu Jo ,  Seongwoo Choi ,  Bongjae Rhee

    IPC: G06K9/28 ,  G06V40/13 ,  H04M1/02

    Abstract: Disclosed is an electronic device that includes a housing, a display module that includes a first panel including a first surface, a second surface opposite to the first surface, and a plurality of pixels disposed between the first surface and the second surface, a cover layer that is disposed on the first surface of the first panel and that forms one surface of the housing, and a second panel disposed on the second surface of the first panel, and a sensor that is coupled to the display module and that forms a sensing area on the one surface of the housing. The display module includes an opening that is formed through the second panel and in which the sensor is disposed, and the sensor includes an active area and an inactive area formed around the active area. A first adhesive material is formed between the active area and the first panel. The first adhesive material includes a mechanical or thermal characteristic that a glass transition temperature Tg ranges from 0° C. to 25° C. in a frequency condition of 0.01 Hz to 0.1 Hz, a modulus of elasticity at 35° C. or more is 0.2 GPa or less, and a modulus of elasticity at −10° C. or less is 1 GPa or more.

    Electronic device including display module including sensor and method of manufacturing said display module
    7.
    发明授权
    Electronic device including display module including sensor and method of manufacturing said display module 有权

    公开(公告)号：US11134577B2

    公开(公告)日：2021-09-28

    申请号：US16865879

    申请日：2020-05-04

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Yongwon Lee ,  Youjin Kim ,  Min Park ,  Bongjae Rhee

    IPC: H05K5/00 ,  H05K1/18 ,  G06K9/00 ,  H05K5/03

    Abstract: An electronic device including a display module is provided. The electronic device includes a housing, a display module including a cover layer forming one surface of the housing, a first panel disposed below the cover layer and including pixels, and a second panel disposed below the first panel and including a layers, and a sensor coupled to the display module and forming a sensing region on the one surface of the housing. The display module includes an opening which penetrates the second panel, and the sensor is disposed in the second panel. A thermal shrinkage film is disposed in the opening to be in contact with the first panel. The thermal shrinkage film includes a first film being in contact with the first panel and having adhesion at a temperature above a specific first temperature, and a second film including a shrinking member which contracts at a temperature above the first temperature, and a light shielding member.

    Electronic device including touch sensor-bonding structure
    8.
    发明授权
    Electronic device including touch sensor-bonding structure 有权

    公开(公告)号：US10809861B2

    公开(公告)日：2020-10-20

    申请号：US16381248

    申请日：2019-04-11

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Jinman Kim ,  Yongwon Lee ,  Seyoung Jang ,  Kwangho Shin ,  Bongjae Rhee ,  Juhee Han ,  Hyunsuk Choi

    IPC: G06F3/045 ,  G06F3/041 ,  G06F3/046 ,  G06K9/00

    Abstract: Disclosed is an electronic device that includes: a housing including a first plate facing a first direction and a second plate facing a direction opposite the first direction; a display layer disposed between the first and second plates; and a touch detection layer disposed between the display layer and the second plate, wherein the touch detection layer may include: a first layer including a first face facing the display layer, a second face facing a direction away from the first face, and an opening; a second layer disposed between the opening and the second plate, electrically connected to the first layer, and being coupled to the first layer; and a fingerprint sensor disposed in the opening and disposed between the first layer and the second layer.

    RIGID FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE SAME
    9.
    发明申请
    RIGID FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE SAME 有权

    公开(公告)号：US20230007766A1

    公开(公告)日：2023-01-05

    申请号：US17825191

    申请日：2022-05-26

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Hyunmo YANG ,  Junwhon Uhm ,  Yonghyun Park ,  Yongwon Lee ,  Sangwon Ha

    IPC: H05K1/02 ,  H05K1/11

    Abstract: An electronic device is provided, which includes a PCB including a first alignment mark formed on a first surface of the PCB, and an RFPCB including a plurality of layers, a rigid portion disposed on the first surface of the PCB, a flexible portion extending from the rigid portion, and a first protrusion formed as one of the plurality of layers protruding and extending from the rigid portion. A second alignment mark corresponding to the first alignment mark of the PCB is defined in the first protrusion. The first protrusion overlaps at least partially with the first alignment mark of the PCB.

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