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公开(公告)号：US20200219982A1
公开(公告)日：2020-07-09
申请号：US16821559
申请日：2020-03-17
Applicant: RAYTHEON COMPANY
Inventor： Hooman Kazemi , Mark Rosker , Thomas E. Kazior , Shane A. O'Connor , Emily Elswick
IPC: H01L29/20 , H01L23/482 , H01L23/29 , H01L23/552 , H01L23/538
Abstract: A reconstituted wafer includes a plurality of apertures defined in a first substrate. A module is positioned in each aperture and coupled to circuit traces on the first substrate by operation of beam leads extending from the module. A second substrate is positioned over the first substrate and each module is enclosed in a space defined by the respective aperture and the second substrate. The module includes a lid and at least one mode suppression circuit disposed in the lid. The modules may include an invariant die where different technologies are stacked together.
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公开(公告)号：US11870148B2
公开(公告)日：2024-01-09
申请号：US17524644
申请日：2021-11-11
Applicant: RAYTHEON COMPANY
Inventor： David D. Crouch , Hooman Kazemi , Alexander Borisovich Brailovsky
CPC classification number: H01Q19/065 , H01Q1/38
Abstract: A planar conductive millimeter-wave lens includes: a planar conductive plate with a first surface and a second surface, wherein the first surface is parallel to the second surface; a plurality of openings from the first surface through the planar conductive plate to the second surface, where an axis of each opening is perpendicular to the first surface and the second surface. A size of each opening is a function of a position of said each opening on the planar conductive plate such that an insertion phase collectively imposed by the openings on an incident wave causes the incident wave to pass through the first surface and the planar conductive plate, exit from the second surface and to focus at a predetermined distance from the second surface.
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公开(公告)号：US20230198158A1
公开(公告)日：2023-06-22
申请号：US18106817
申请日：2023-02-07
Applicant: RAYTHEON COMPANY
Inventor： David D. Crouch , Hooman Kazemi
IPC: H01Q15/10
CPC classification number: H01Q15/10
Abstract: A dielectric encapsulated metal lens includes a planar conductive plate with a first surface and a second surface, wherein the first surface is parallel to the second surface; a plurality of openings from the first surface through the planar conductive plate to the second surface, wherein a longitudinal axis of each opening is perpendicular to the first surface and the second surface, wherein a size of each opening is a function of a position of said each opening on the planar conductive plate; and a dielectric material encapsulating the planar conductive plate and filing the plurality of openings, where the dielectric material forms a top surface and a bottom surface for the metal lens to reduce reflected energy.
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4.发明申请公开(公告)号：US20190128646A1
公开(公告)日：2019-05-02
申请号：US16021669
申请日：2018-06-28
Applicant: Raytheon Company
Inventor： Hooman Kazemi
IPC: F41H3/00
Abstract: An apparatus includes at least one transmitter configured to transmit wireless signals that heat objects in a scene and cause the objects to radiate thermal energy and create a pattern of thermal radiation in the scene. The apparatus also includes at least one controller configured to control the at least one transmitter in order to control the creation of the pattern of thermal radiation in the scene. The pattern of thermal radiation in the scene could include a camouflage pattern that increases clutter in an infrared image of the scene, at least one temporary infrared marker, or at least one false shape in an infrared image of the scene. The pattern of thermal radiation in the scene could reduce a contrast between a cold infrared background in the scene and one or more targets in the scene.
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公开(公告)号：US20210088629A1
公开(公告)日：2021-03-25
申请号：US17025424
申请日：2020-09-18
Applicant: Raytheon Company
Inventor： Edward M. Jackson , Phuoc T. Ho , Hooman Kazemi
Abstract: In one aspect, a method includes receiving signals directly or indirectly from a transmitter. The received signals include a target signal, a clutter signal and a reference signal. The method also includes filtering the clutter signal from the received signals, processing the filtered radar data to obtain range and Doppler data, detecting and tracking a target from the range and Doppler data and classifying the target.
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Patent Agency Ranking
公开(公告)号：US10563958B2
公开(公告)日：2020-02-18
申请号：US16021669
申请日：2018-06-28
Applicant: Raytheon Company
Inventor： Hooman Kazemi
IPC: F41H3/00
Abstract: An apparatus includes at least one transmitter configured to transmit wireless signals that heat objects in a scene and cause the objects to radiate thermal energy and create a pattern of thermal radiation in the scene. The apparatus also includes at least one controller configured to control the at least one transmitter in order to control the creation of the pattern of thermal radiation in the scene. The pattern of thermal radiation in the scene could include a camouflage pattern that increases clutter in an infrared image of the scene, at least one temporary infrared marker, or at least one false shape in an infrared image of the scene. The pattern of thermal radiation in the scene could reduce a contrast between a cold infrared background in the scene and one or more targets in the scene.
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公开(公告)号：US20190165108A1
公开(公告)日：2019-05-30
申请号：US15827349
申请日：2017-11-30
Applicant: RAYTHEON COMPANY
Inventor： Hooman Kazemi , Mark Rosker , Thomas E. Kazior , Shane A. O'Connor , Emily Elswick
IPC: H01L29/20 , H01L23/482 , H01L23/538 , H01L23/552 , H01L23/29
Abstract: A reconstituted wafer includes a plurality of apertures defined in a first substrate. A module is positioned in each aperture and coupled to circuit traces on the first substrate by operation of beam leads extending from the module. A second substrate is positioned over the first substrate and each module is hermetically sealed in a space defined by the respective aperture and the second substrate. One or more vias are provided to access I/O signals at a surface of the first or second substrates. The modules may include an invariant die where different technologies are stacked together.
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公开(公告)号：US20250062543A1
公开(公告)日：2025-02-20
申请号：US18451893
申请日：2023-08-18
Applicant: Raytheon Company
Inventor： David D. Crouch , Hooman Kazemi , Alexander B. Brailovsky
Abstract: A wavefront transformer for reflecting and transforming an incident electromagnetic wavefront includes an electrically-conductive substrate with spaced perforations (cavities), which may have uniform spacing and varying depth. The perforations may have a radius that is close to and greater than a cutoff radius for one or more intended incident frequencies of the incident wavefront. The spaced perforations may be filled with air or may be filled with a dielectric solid material. The substrate may be covered with a cover made of a dielectric solid material. The transformer may be made by drilling holes in the substrate. Alternatively a plate having protrusions on it corresponding to the desired perforations may be used to form the perforations on the substrate. The plate may be removed or left in place after the formation of the perforations.
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公开(公告)号：US20230148063A1
公开(公告)日：2023-05-11
申请号：US17524644
申请日：2021-11-11
Applicant: RAYTHEON COMPANY
Inventor： David D. Crouch , Hooman Kazemi , Alexander Borisovich Brailovsky
CPC classification number: H01Q19/065 , H01Q1/38
Abstract: A planar conductive millimeter-wave lens includes: a planar conductive plate with a first surface and a second surface, wherein the first surface is parallel to the second surface; a plurality of openings from the first surface through the planar conductive plate to the second surface, where an axis of each opening is perpendicular to the first surface and the second surface. A size of each opening is a function of a position of said each opening on the planar conductive plate such that an insertion phase collectively imposed by the openings on an incident wave causes the incident wave to pass through the first surface and the planar conductive plate, exit from the second surface and to focus at a predetermined distance from the second surface.
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公开(公告)号：US10930742B2
公开(公告)日：2021-02-23
申请号：US16821559
申请日：2020-03-17
Applicant: RAYTHEON COMPANY
Inventor： Hooman Kazemi , Mark Rosker , Thomas E. Kazior , Shane A. O'Connor , Emily Elswick
IPC: H01L23/482 , H01L23/552 , H01L23/538 , H01L29/20 , H01L23/29
Abstract: A reconstituted wafer includes a plurality of apertures defined in a first substrate. A module is positioned in each aperture and coupled to circuit traces on the first substrate by operation of beam leads extending from the module. A second substrate is positioned over the first substrate and each module is enclosed in a space defined by the respective aperture and the second substrate. The module includes a lid and at least one mode suppression circuit disposed in the lid. The modules may include an invariant die where different technologies are stacked together.
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