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公开(公告)号：US10199152B2
公开(公告)日：2019-02-05
申请号：US14743623
申请日：2015-06-18
Applicant: QUALCOMM Incorporated
Inventor： Mete Erturk , Ravindra Vaman Shenoy , Kwan-yu Lai , Jitae Kim , Donald William Kidwell, Jr. , Jon Bradley Lasiter , James Thomas Doyle , Omar James Bchir
IPC: H01F5/00 , H01F27/28 , H01F1/147 , H01F27/24 , H01F41/02 , H01F41/14 , H05K1/11 , H05K1/18 , H01F17/00 , H01F41/04 , H05K1/16 , H01L23/64 , H01L23/00
Abstract: An inductor can include a first substrate, a magnetic piece, and a conductor. The first substrate can be formed within a second substrate. The magnetic piece can be connected to a first side of the first substrate. The conductor can be formed within the second substrate, on the second substrate, or both. The conductor can have an input and an output. The conductor can be configured to surround the first substrate without being in contact with the first substrate and without being in contact with the magnetic piece.
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公开(公告)号：US20150333831A1
公开(公告)日：2015-11-19
申请号：US14280270
申请日：2014-05-16
Applicant: QUALCOMM Incorporated
Inventor： Kwan-yu Lai , Ravindra Vaman Shenoy , Jitae Kim , Jon Bradley Lasiter , Donald William Kidwell, JR. , Evgeni Petrovich Gousev
CPC classification number: H04B10/50 , G01J1/0407 , G02B6/00 , G02B6/4212 , G02B6/428 , G02B6/43 , H03F3/08 , H04B10/501
Abstract: An apparatus includes a substrate and a waveguide coupled to a surface of the substrate. The surface forms a cladding layer of the waveguide. The apparatus includes a photodetector optically coupled to an end of the waveguide. The photodetector is configured to output an electrical signal responsive to receiving a light signal from a core of the waveguide. The apparatus also includes an amplifier device coupled to the substrate. The amplifier device is electrically coupled to the photodetector to amplify the electrical signal to produce an amplified electrical signal.
Abstract translation: 一种装置包括衬底和耦合到衬底的表面的波导。 表面形成波导的包覆层。 该装置包括光耦合到波导的端部的光电检测器。 光电检测器被配置为响应于从波导的核心接收光信号而输出电信号。 该装置还包括耦合到基板的放大器装置。 放大器装置电耦合到光电检测器以放大电信号以产生放大的电信号。
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公开(公告)号：US09263370B2
公开(公告)日：2016-02-16
申请号：US14040223
申请日：2013-09-27
Applicant: QUALCOMM Incorporated
Inventor： Ravindra Vaman Shenoy , Kwan-yu Lai , Jon Bradley Lasiter , Philip Jason Stephanou , Donald William Kidwell, Jr. , Evgeni Gousev
IPC: H01L23/48 , H01L23/52 , H01L29/40 , H01L25/065 , H01L27/108 , H01L23/15 , H01L23/498 , H01L25/10 , H01L25/18 , H01L23/50 , H01L21/48 , H01L23/538
CPC classification number: H01L23/481 , H01L21/486 , H01L23/15 , H01L23/49827 , H01L23/50 , H01L23/5381 , H01L25/0657 , H01L25/105 , H01L25/18 , H01L27/108 , H01L2224/16225 , H01L2224/48091 , H01L2224/48465 , H01L2224/48471 , H01L2225/06517 , H01L2225/06527 , H01L2225/06548 , H01L2225/06562 , H01L2225/06572 , H01L2924/15311 , H01L2924/19105 , H01L2924/00014 , H01L2924/00
Abstract: A semiconductor device comprising a second surface of a logic die and a second surface of a via bar coupled to a first surface of a substrate, a second surface of a memory die coupled to a first surface of the via bar, a portion of the second surface of the memory die extending over the first surface of the logic die, such that the logic die and the memory die are vertically staggered, and the memory die electrically coupled to the logic die through the via bar. The via bar can be formed from glass, and include through-glass vias (TGVs) and embedded passives such as resistors, capacitors, and inductors. The semiconductor device can be formed as a single package or a package-on-package structure with the via bar and the memory die encapsulated in a package and the substrate and logic die in another package.
Abstract translation: 一种半导体器件，包括逻辑管芯的第二表面和耦合到衬底的第一表面的通孔条的第二表面，耦合到通孔条的第一表面的存储器管芯的第二表面，第二部分的一部分 存储芯片的表面在逻辑管芯的第一表面上延伸，使得逻辑管芯和存储器管芯垂直交错，并且存储器管芯通过通孔电连接到逻辑管芯。 通孔棒可以由玻璃形成，并且包括透玻璃通孔（TGV）和嵌入式无源器件，例如电阻器，电容器和电感器。 半导体器件可以形成为单个封装或封装封装结构，其中通孔棒和存储管芯封装在封装中，并且衬底和逻辑裸片在另一封装中。
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4.发明授权公开(公告)号：US09325420B2
公开(公告)日：2016-04-26
申请号：US14280270
申请日：2014-05-16
Applicant: QUALCOMM Incorporated
Inventor： Kwan-yu Lai , Ravindra Vaman Shenoy , Jitae Kim , Jon Bradley Lasiter , Donald William Kidwell, Jr. , Evgeni Petrovich Gousev
CPC classification number: H04B10/50 , G01J1/0407 , G02B6/00 , G02B6/4212 , G02B6/428 , G02B6/43 , H03F3/08 , H04B10/501
Abstract: An apparatus includes a substrate and a waveguide coupled to a surface of the substrate. The surface forms a cladding layer of the waveguide. The apparatus includes a photodetector optically coupled to an end of the waveguide. The photodetector is configured to output an electrical signal responsive to receiving a light signal from a core of the waveguide. The apparatus also includes an amplifier device coupled to the substrate. The amplifier device is electrically coupled to the photodetector to amplify the electrical signal to produce an amplified electrical signal.
Abstract translation: 一种装置包括衬底和耦合到衬底的表面的波导。 表面形成波导的包覆层。 该装置包括光耦合到波导的端部的光电检测器。 光电检测器被配置为响应于从波导的核心接收光信号而输出电信号。 该装置还包括耦合到基板的放大器装置。 放大器装置电耦合到光电检测器以放大电信号以产生放大的电信号。
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