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公开(公告)号：US10714932B2
公开(公告)日：2020-07-14
申请号：US15375392
申请日：2016-12-12
发明人： Takahiro Sumi , Jun Adachi , Takayuki Tsukizawa , Katsumi Yasunaka , Sumiyo Nakamura , Mayu Suzuki
摘要： An ESD protection device includes an insulating substrate, first and second discharge electrodes in contact with the insulating substrate, the first and second discharge electrodes separated from each other and opposing each other, first and second outer electrodes on an outside surface of the insulating substrate, the first outer electrode being electrically connected to the first discharge electrode and the second outer electrode being electrically connected to the second discharge electrode, and a discharge auxiliary electrode spanning the first discharge electrode and the second discharge electrode in a region where the discharge electrodes oppose each other. The discharge auxiliary electrode includes semiconductor particles and metal particles. An average particle diameter of the metal particles is about 0.3 μm to about 1.5 μm. A density of the metal particles is greater than or equal to about 20 particles/50 μm2 and the semiconductor particles include an oxygen-containing layer on surfaces of the semiconductor particles.
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2.发明授权公开(公告)号：US10292264B2
公开(公告)日：2019-05-14
申请号：US15951808
申请日：2018-04-12
发明人： Sumiyo Nakamura , Takahiro Sumi , Takahiro Oka
IPC分类号： H05K1/03 , C04B35/195 , H01L23/12 , H01L23/15 , H01L21/48 , H05K1/11 , H05K3/46 , C04B35/20 , H05K1/02 , H05K3/12 , C04B35/622 , C04B35/626 , H01L23/498
摘要： Provided are an insulating ceramic paste, a ceramic electronic component, and a method for producing the ceramic electronic component that allow prevention of solder shorts between narrow-pitch terminal electrodes and suppression of generation of cracks in an insulator covering a portion of terminal electrodes during a firing step. The ceramic electronic component includes a ceramic multilayer substrate, terminal electrodes formed on a surface of the ceramic multilayer substrate, and an insulating ceramic film formed on the surface of the ceramic multilayer substrate so as to cover a portion of the terminal electrodes. An exposed surface portion (celsian-crystal-rich layer) of the insulating ceramic film has a thermal expansion coefficient that is lower than the thermal expansion coefficient of the ceramic multilayer substrate.
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3.发明授权公开(公告)号：US09974168B2
公开(公告)日：2018-05-15
申请号：US14861272
申请日：2015-09-22
发明人： Sumiyo Nakamura , Takahiro Sumi , Takahiro Oka
IPC分类号： H05K1/00 , H05K1/03 , C04B35/195 , H01L23/12 , H01L23/15 , H01L21/48 , H05K1/11 , H05K3/46 , C04B35/20 , H05K1/02 , H05K3/12 , H01L23/498
CPC分类号： H05K1/0306 , C04B35/195 , C04B35/20 , C04B35/62218 , C04B35/62625 , C04B2235/3215 , C04B2235/3217 , C04B2235/3481 , C04B2235/36 , C04B2235/80 , H01L21/4867 , H01L23/12 , H01L23/15 , H01L23/49822 , H01L23/49838 , H01L2924/0002 , H05K1/0298 , H05K1/111 , H05K1/115 , H05K3/1291 , H05K3/4629 , H05K2201/017 , H05K2201/0209 , H05K2201/068 , H05K2201/09563 , H05K2201/099 , H05K2201/09909 , Y02P70/611 , H01L2924/00
摘要： Provided are an insulating ceramic paste, a ceramic electronic component, and a method for producing the ceramic electronic component that allow prevention of solder shorts between narrow-pitch terminal electrodes and suppression of generation of cracks in an insulator covering a portion of terminal electrodes during a firing step. The ceramic electronic component includes a ceramic multilayer substrate, terminal electrodes formed on a surface of the ceramic multilayer substrate, and an insulating ceramic film formed on the surface of the ceramic multilayer substrate so as to cover a portion of the terminal electrodes. An exposed surface portion (celsian-crystal-rich layer) of the insulating ceramic film has a thermal expansion coefficient that is lower than the thermal expansion coefficient of the ceramic multilayer substrate.
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4.发明申请公开(公告)号：US20160014892A1
公开(公告)日：2016-01-14
申请号：US14861272
申请日：2015-09-22
发明人： Sumiyo Nakamura , Takahiro Sumi , Takahiro Oka
CPC分类号： H05K1/0306 , C04B35/195 , C04B35/20 , C04B35/62218 , C04B35/62625 , C04B2235/3215 , C04B2235/3217 , C04B2235/3481 , C04B2235/36 , C04B2235/80 , H01L21/4867 , H01L23/12 , H01L23/15 , H01L23/49822 , H01L23/49838 , H01L2924/0002 , H05K1/0298 , H05K1/111 , H05K1/115 , H05K3/1291 , H05K3/4629 , H05K2201/017 , H05K2201/0209 , H05K2201/068 , H05K2201/09563 , H05K2201/099 , H05K2201/09909 , Y02P70/611 , H01L2924/00
摘要： Provided are an insulating ceramic paste, a ceramic electronic component, and a method for producing the ceramic electronic component that allow prevention of solder shorts between narrow-pitch terminal electrodes and suppression of generation of cracks in an insulator covering a portion of terminal electrodes during a firing step. The ceramic electronic component includes a ceramic multilayer substrate, terminal electrodes formed on a surface of the ceramic multilayer substrate, and an insulating ceramic film formed on the surface of the ceramic multilayer substrate so as to cover a portion of the terminal electrodes. An exposed surface portion (celsian-crystal-rich layer) of the insulating ceramic film has a thermal expansion coefficient that is lower than the thermal expansion coefficient of the ceramic multilayer substrate.
摘要翻译： 提供一种绝缘陶瓷膏，陶瓷电子元件，以及陶瓷电子元件的制造方法，能够防止窄间距端子电极之间的焊料短路，并抑制覆盖一部分端子电极的绝缘体的裂纹产生 点火步骤 陶瓷电子部件包括陶瓷多层基板，形成在陶瓷多层基板的表面上的端子电极和形成在陶瓷多层基板的表面上以覆盖一部分端子电极的绝缘陶瓷膜。 绝缘陶瓷膜的暴露表面部分（富含凝胶层的层）的热膨胀系数低于陶瓷多层基板的热膨胀系数。
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公开(公告)号：US11328854B2
公开(公告)日：2022-05-10
申请号：US16255900
申请日：2019-01-24
发明人： Sumiyo Nakamura , Jun Adachi
IPC分类号： H01F5/00 , H01F27/28 , H01F27/29 , H01F27/34 , H01F41/12 , H01F27/32 , H01F41/04 , H01C7/12 , H01C1/148 , H01C17/28 , H01F17/00
摘要： An electronic component includes a ceramic element body including glass, and outer electrodes provided on the ceramic element body. Each of the outer electrodes includes a base electrode layer on the ceramic element body and a buffer portion to buffer an impact. The base electrode layer includes a first region that is disposed on the ceramic element body and includes the buffer portion of equal to or more than about 15 vol % and equal to or less than about 50 vol %, and a second region that covers the first region and includes the buffer portion of equal to or more than about 1 vol % and equal to or less than about 10 vol %.
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6.发明申请公开(公告)号：US20180302982A1
公开(公告)日：2018-10-18
申请号：US15951808
申请日：2018-04-12
发明人： Sumiyo Nakamura , Takahiro Sumi , Takahiro Oka
IPC分类号： H05K1/03 , C04B35/626 , C04B35/622 , C04B35/20 , C04B35/195 , H05K1/02 , H05K3/12 , H05K1/11
CPC分类号： H05K1/0306 , C04B35/195 , C04B35/20 , C04B35/62218 , C04B35/62625 , C04B2235/3215 , C04B2235/3217 , C04B2235/3481 , C04B2235/36 , C04B2235/80 , H01L21/4867 , H01L23/12 , H01L23/15 , H01L23/49822 , H01L23/49838 , H01L2924/0002 , H05K1/0298 , H05K1/111 , H05K1/115 , H05K3/1291 , H05K3/4629 , H05K2201/017 , H05K2201/0209 , H05K2201/068 , H05K2201/09563 , H05K2201/099 , H05K2201/09909 , Y02P70/611 , H01L2924/00
摘要： Provided are an insulating ceramic paste, a ceramic electronic component, and a method for producing the ceramic electronic component that allow prevention of solder shorts between narrow-pitch terminal electrodes and suppression of generation of cracks in an insulator covering a portion of terminal electrodes during a firing step. The ceramic electronic component includes a ceramic multilayer substrate, terminal electrodes formed on a surface of the ceramic multilayer substrate, and an insulating ceramic film formed on the surface of the ceramic multilayer substrate so as to cover a portion of the terminal electrodes. An exposed surface portion (celsian-crystal-rich layer) of the insulating ceramic film has a thermal expansion coefficient that is lower than the thermal expansion coefficient of the ceramic multilayer substrate.
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