公开(公告)号：US20230260894A1

公开(公告)日：2023-08-17

申请号：US18097296

申请日：2023-01-16

Applicant: MEDIATEK INC.

Inventor： Chu-Wei Hu ,  Chien-Kai Huang ,  Tien-Yu Lu

IPC: H01L23/522 ,  H01L23/00 ,  H10B80/00 ,  H01L23/498 ,  H01L23/528

CPC classification number: H01L23/5223 ,  H01L24/08 ,  H10B80/00 ,  H01L24/09 ,  H01L24/05 ,  H01L24/16 ,  H01L24/24 ,  H01L24/73 ,  H01L23/49833 ,  H01L23/49816 ,  H01L23/5286 ,  H01L2224/08145 ,  H01L2924/1443 ,  H01L2924/1433 ,  H01L2224/09515 ,  H01L2224/05647 ,  H01L2224/16225 ,  H01L2224/24225 ,  H01L2224/73209 ,  H01L2924/1438 ,  H01L2924/1441

Abstract: A semiconductor device includes an application processor (AP) die and a memory die directly bonded to the AP die. The memory die includes a substrate, a non-volatile memory structure on the substrate, and at least one trench capacitor in the substrate.

公开(公告)号：US11728320B2

公开(公告)日：2023-08-15

申请号：US17726595

申请日：2022-04-22

Applicant: MEDIATEK Inc.

Inventor： Tien-Yu Lu ,  Chu-Wei Hu ,  Hsin-Hsin Hsiao

IPC: H01L25/16 ,  H01L23/538

CPC classification number: H01L25/162 ,  H01L23/5385 ,  H01L23/5386

Abstract: A semiconductor package includes a first substrate, a second substrate, a conductive component, an electronic component and a passive component. The conductive component is disposed between the first substrate and the second substrate, wherein the first substrate and the second substrate are separated from each other by an interval. The electronic component and the passive component are disposed within the interval.

公开(公告)号：US11342316B2

公开(公告)日：2022-05-24

申请号：US17005528

申请日：2020-08-28

Applicant: MEDIATEK Inc.

Inventor： Tien-Yu Lu ,  Chu-Wei Hu ,  Hsin-Hsin Hsiao

IPC: H05K7/00 ,  H01L25/16 ,  H01L23/538

Abstract: A semiconductor package includes a first substrate, a second substrate, a conductive component, an electronic component and a passive component. The conductive component is disposed between the first substrate and the second substrate, wherein the first substrate and the second substrate are separated from each other by an interval. The electronic component and the passive component are disposed within the interval.