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公开(公告)号：US20220407289A1
公开(公告)日：2022-12-22
申请号：US17447780
申请日：2021-09-15
Applicant: Lumentum Operations LLC
Inventor： Wei SHI , Hao HUANG , Lijun ZHU , Siu Kwan CHEUNG , Kevin WANG , John Michael MILLER
IPC: H01S5/026 , H01S5/0225 , H01S5/0233
Abstract: An optical assembly includes a substrate; an optical subassembly that is disposed on a region of a surface of the substrate; a housing that is disposed on another region of the surface of the substrate; a first optical element that is disposed on a first support component of the housing; and a second optical element that is disposed on a second support component of the housing. The optical subassembly includes an integrated circuit (IC) driver chip; a redistribution layer (RDL) structure that is disposed on a surface of the IC driver chip, wherein the RDL structure includes a cavity; and a vertical cavity surface emitting laser (VCSEL) device disposed on a region of the surface of the RDL structure that is within the cavity of the RDL structure.
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公开(公告)号：US20250149852A1
公开(公告)日：2025-05-08
申请号：US18398522
申请日：2023-12-28
Applicant: Lumentum Operations LLC
Inventor： Wei SHI , Yuefa LI , Kevin WANG , Siu Kwan CHEUNG , Lijun ZHU , Yeyu ZHU
IPC: H01S5/0239 , H01S5/02253 , H01S5/02257 , H01S5/042 , H01S5/183 , H01S5/42
Abstract: A package assembly includes a circuit substrate, a top-emitting (TE) vertical cavity surface emitting laser (VCSEL) die having a two-dimensional (2D) matrix addressable emitter array, and a driver integrated circuit (IC) having a flip-chip interconnect configuration. The TE-VCSEL die and the driver IC are coupled together to form a die stack that is mounted to the circuit substrate, with the TE-VCSEL die arranged between the driver IC and the circuit substrate. TE-VCSEL die comprises an optical output arranged at a main surface coupled to the driver IC. The optical output is configured to output light generated by one or more emitters of the emitter array. Thus, the TE-VCSEL die is configured to emit light away from the circuit substrate.
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3.发明申请公开(公告)号：US20250030224A1
公开(公告)日：2025-01-23
申请号：US18905312
申请日：2024-10-03
Applicant: Lumentum Operations LLC
Inventor： Eric R. HEGBLOM , Kevin WANG
IPC: H01S5/42 , H01S5/02253 , H01S5/0234 , H01S5/042 , H01S5/183
Abstract: A bottom-emitting vertical-cavity surface-emitting laser (VCSEL) chip may include a VCSEL array including plurality of VCSELs and an integrated optical element including a plurality of lens segments. The integrated optical element may direct beams provided by the plurality of VCSELs to a particular range of angles to create a diffusion pattern using the beams provided by the plurality of VCSELs. A surface of a first lens segment may be sloped to cause a beam from a first VCSEL to be steered at a first angle and a surface of a second (adjacent) lens segment may be sloped to cause a beam from a second VCSEL to be steered at a second angle. A direction of the second angle with respect to a surface of the VCSEL array may be opposite to a direction of the first angle with respect to the surface of the VCSEL array.
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Patent Agency Ranking
4.发明申请公开(公告)号：US20210336424A1
公开(公告)日：2021-10-28
申请号：US17247737
申请日：2020-12-21
Applicant: Lumentum Operations LLC
Inventor： Eric R. HEGBLOM , Kevin WANG
Abstract: A bottom-emitting vertical-cavity surface-emitting laser (VCSEL) chip may include a VCSEL array including plurality of VCSELs and an integrated optical element including a plurality of lens segments. The integrated optical element may direct beams provided by the plurality of VCSELs to a particular range of angles to create a diffusion pattern using the beams provided by the plurality of VCSELs. A surface of a first lens segment may be sloped to cause a beam from a first VCSEL to be steered at a first angle and a surface of a second (adjacent) lens segment may be sloped to cause a beam from a second VCSEL to be steered at a second angle. A direction of the second angle with respect to a surface of the VCSEL array may be opposite to a direction of the first angle with respect to the surface of the VCSEL array.
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公开(公告)号：US20230238779A1
公开(公告)日：2023-07-27
申请号：US17657517
申请日：2022-03-31
Applicant: Lumentum Operations LLC
Inventor： John Michael MILLER , Lijun ZHU , Kevin WANG , Matthew Glenn PETERS
CPC classification number: H01S5/423 , G02B5/1819 , G02B27/30 , G02B27/4233 , H01S5/18311
Abstract: In some implementations, an optical device includes a two-zone vertical cavity surface emitting laser (VCSEL) with a set of emission zones configured to emit structured light forming a set of dots; a single-element collimating lens aligned to the two-zone VCSEL; and a tiling diffractive optical element (DOE) aligned to the single-element collimating lens, wherein the tiling DOE comprises a set of tile segments aligned to the set of emission zones, and wherein a tile segment, of the set of tile segments, is configured to project, from the set of emission zones toward portions of a target, the structured light forming the set of dots.
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公开(公告)号：US20230361096A1
公开(公告)日：2023-11-09
申请号：US18068252
申请日：2022-12-19
Applicant: Lumentum Operations LLC
Inventor： Wei SHI , Kevin WANG , Michael MILLER , Steve CHUENG , Mikhail DOLGANOV , Lijun ZHU
IPC: H01L25/16 , H01S5/183 , H01S5/02208 , H01S5/02253 , H01S5/02315 , H01S5/0239 , H01S5/026
CPC classification number: H01L25/167 , H01L25/165 , H01S5/18388 , H01S5/02208 , H01S5/02253 , H01S5/02315 , H01S5/0239 , H01S5/0261 , H01S5/02257
Abstract: An optical package may include a fan-out-wafer-level-packaging (FOWLP) sub-package including a redistribution layer (RDL) on a molded component including an electrical chip. The optical package may include an optical chip over the FOWLP sub-package. The optical chip may be electrically connected to the RDL. An area of a surface of the RDL may be larger than an area of a surface of the optical chip. The optical package may include a package housing over the optical chip such that light to be received or transmitted by the optical chip may is to pass through the package housing.
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公开(公告)号：US20230115690A1
公开(公告)日：2023-04-13
申请号：US17644679
申请日：2021-12-16
Applicant: Lumentum Operations LLC
Inventor： Wei SHI , Kevin WANG , Hao HUANG , John Michael MILLER , Siu Kwan CHEUNG , Lijun ZHU
Abstract: An optical assembly includes an integrated circuit (IC) driver chip; an optical subassembly disposed on the IC driver chip that includes: a vertical cavity surface emitting laser (VCSEL) device, an optical element disposed above a top surface of the VCSEL device, and two or more attachment structures disposed between the VCSEL device and the optical element; and two or more additional attachment structures disposed between the IC driver chip and the optical subassembly. The VCSEL device includes: a cathode contact disposed on the top surface of the VCSEL device, and an anode contact disposed on the top surface of the VCSEL device. The optical element includes two or more conductive traces on a bottom surface of the optical element. The two or more attachment structures are disposed between the two or more conductive traces of the optical element, and the cathode contact and the anode contact of the VCSEL device.
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公开(公告)号：US20230027279A1
公开(公告)日：2023-01-26
申请号：US17449386
申请日：2021-09-29
Applicant: Lumentum Operations LLC
Inventor： Wei SHI , Kevin WANG , Hao HUANG , John Michael MILLER , Siu Kwan CHEUNG , Lijun ZHU
Abstract: In some implementations, an optical assembly includes a substrate that includes a thermally conductive core, an IC driver chip that is disposed on a first surface of the substrate, and a VCSEL device that includes an electrically insulated surface that is disposed on the thermally conductive core of the substrate within a cavity formed in the second surface of the substrate. The VCSEL device includes a cathode contact disposed on a surface of the VCSEL device and an anode contact disposed on the surface of the VCSEL device. The VCSEL device includes a plurality of emitters and a microlens component that is disposed over the plurality of emitters on the surface of the VCSEL device.
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