公开(公告)号：US20180348147A1

公开(公告)日：2018-12-06

申请号：US15828632

申请日：2017-12-01

Applicant: KLA-Tencor Corporation

Inventor： Eugene Shifrin ,  Bjorn Brauer ,  Sumit Sen ,  Ashok Mathew ,  Sreeram Chandrasekaran ,  Lisheng Gao

IPC: G01N21/95 ,  G01N21/956

Abstract: Defects from a hot scan can be saved, such as on persistent storage, random access memory, or a split database. The persistent storage can be patch-based virtual inspector virtual analyzer (VIVA) or local storage. Repeater defect detection jobs can determined and the wafer can be inspected based on the repeater defect detection jobs. Repeater defects can be analyzed and corresponding defect records to the repeater defects can be read from the persistent storage. These results may be returned to the high level defect detection controller.

公开(公告)号：US10648925B2

公开(公告)日：2020-05-12

申请号：US15828632

申请日：2017-12-01

Applicant: KLA-Tencor Corporation

Inventor： Eugene Shifrin ,  Bjorn Brauer ,  Sumit Sen ,  Ashok Mathew ,  Sreeram Chandrasekaran ,  Lisheng Gao

IPC: G06K9/00 ,  G01N21/95 ,  G01N21/956 ,  H01L21/66

Abstract: Defects from a hot scan can be saved, such as on persistent storage, random access memory, or a split database. The persistent storage can be patch-based virtual inspector virtual analyzer (VIVA) or local storage. Repeater defect detection jobs can determined and the wafer can be inspected based on the repeater defect detection jobs. Repeater defects can be analyzed and corresponding defect records to the repeater defects can be read from the persistent storage. These results may be returned to the high level defect detection controller.

公开(公告)号：US11204332B2

公开(公告)日：2021-12-21

申请号：US16845681

申请日：2020-04-10

Applicant: KLA-Tencor Corporation

Inventor： Eugene Shifrin ,  Bjorn Brauer ,  Sumit Sen ,  Ashok Mathew ,  Sreeram Chandrasekaran ,  Lisheng Gao

IPC: G06K9/00 ,  G01N21/95 ,  G01N21/956 ,  H01L21/66 ,  G06T7/00

Abstract: Defects from a hot scan can be saved, such as on persistent storage, random access memory, or a split database. The persistent storage can be patch-based virtual inspector virtual analyzer (VIVA) or local storage. Repeater defect detection jobs can determined and the wafer can be inspected based on the repeater defect detection jobs. Repeater defects can be analyzed and corresponding defect records to the repeater defects can be read from the persistent storage. These results may be returned to the high level defect detection controller.

公开(公告)号：US20200240928A1

公开(公告)日：2020-07-30

申请号：US16845681

申请日：2020-04-10

Applicant: KLA-Tencor Corporation

Inventor： Eugene Shifrin ,  Bjorn Brauer ,  Sumit Sen ,  Ashok Mathew ,  Sreeram Chandrasekaran ,  Lisheng Gao

IPC: G01N21/95 ,  H01L21/66 ,  G01N21/956

Abstract: Defects from a hot scan can be saved, such as on persistent storage, random access memory, or a split database. The persistent storage can be patch-based virtual inspector virtual analyzer (VIVA) or local storage. Repeater defect detection jobs can determined and the wafer can be inspected based on the repeater defect detection jobs. Repeater defects can be analyzed and corresponding defect records to the repeater defects can be read from the persistent storage. These results may be returned to the high level defect detection controller.

公开(公告)号：US10395358B2

公开(公告)日：2019-08-27

申请号：US15804980

申请日：2017-11-06

Applicant: KLA-Tencor Corporation

Inventor： Bjorn Brauer ,  Eugene Shifrin ,  Ashok Mathew ,  Chetana Bhaskar ,  Lisheng Gao ,  Santosh Bhattacharyya ,  Hucheng Lee ,  Benjamin Murray

IPC: G06T7/00 ,  G01N21/95

Abstract: Systems and methods for detecting defects on a reticle are provided. One system includes computer subsystem(s) that include one or more image processing components that acquire images generated by an inspection subsystem for a wafer, a main user interface component that provides information generated for the wafer and the reticle to a user and receives instructions from the user, and an interface component that provides an interface between the one or more image processing components and the main user interface. Unlike currently used systems, the one or more image processing components are configured for performing repeater defect detection by applying a repeater defect detection algorithm to the images acquired by the one or more image processing components, and the repeater defect detection algorithm is configured to detect defects on the wafer using a hot threshold and to identify the defects that are repeater defects.

公开(公告)号：US20180130199A1

公开(公告)日：2018-05-10

申请号：US15804980

申请日：2017-11-06

Applicant: KLA-Tencor Corporation

Inventor： Bjorn Brauer ,  Eugene Shifrin ,  Ashok Mathew ,  Chetana Bhaskar ,  Lisheng Gao ,  Santosh Bhattacharyya ,  Hucheng Lee ,  Benjamin Murray

IPC: G06T7/00 ,  G01N21/95

CPC classification number: G06T7/0006 ,  G01N21/9501 ,  G01N2021/95676 ,  G05B19/41875 ,  G06T7/0004 ,  G06T7/001 ,  G06T2207/10061 ,  G06T2207/10152 ,  G06T2207/20076 ,  G06T2207/20224 ,  G06T2207/30148

Abstract: Systems and methods for detecting defects on a reticle are provided. One system includes computer subsystem(s) that include one or more image processing components that acquire images generated by an inspection subsystem for a wafer, a main user interface component that provides information generated for the wafer and the reticle to a user and receives instructions from the user, and an interface component that provides an interface between the one or more image processing components and the main user interface. Unlike currently used systems, the one or more image processing components are configured for performing repeater defect detection by applying a repeater defect detection algorithm to the images acquired by the one or more image processing components, and the repeater defect detection algorithm is configured to detect defects on the wafer using a hot threshold and to identify the defects that are repeater defects.