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    Capacitive micromachined ultrasonic transducer (CMUT) devices and methods of manufacturing
    2.
    发明授权
    Capacitive micromachined ultrasonic transducer (CMUT) devices and methods of manufacturing 有权

    公开(公告)号：US11440051B2

    公开(公告)日：2022-09-13

    申请号：US16802345

    申请日：2020-02-26

    Applicant: General Electric Company

    Inventor： Yizhen Lin ,  Marco Francesco Aimi ,  Alessandro Stuart Savoia

    IPC: H01L21/00 ,  B06B1/02 ,  B81B3/00 ,  B81C1/00

    Abstract: A method of forming a capacitive micromachined ultrasonic transducer (CMUT) device includes bonding a CMUT substrate to a silicon on insulator (SOI) substrate. The CMUT substrate has a first thickness and the SOI substrate includes a handle, a buried oxide layer, and a device layer. At least one of the CMUT substrate or the SOI substrate includes a patterned dielectric layer. The device layer is bonded to the patterned dielectric layer to form a plurality of sealed cavities and the device layer forms a diaphragm of the plurality of cavities. The method further includes reducing the first thickness of the CMUT substrate to a second thickness and forming a plurality of through-silicon vias from a second surface of the CMUT substrate opposite the first surface.

    CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCER (CMUT) DEVICES AND METHODS OF MANUFACTURING
    3.
    发明申请
    CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCER (CMUT) DEVICES AND METHODS OF MANUFACTURING 有权

    公开(公告)号：US20210260622A1

    公开(公告)日：2021-08-26

    申请号：US16802345

    申请日：2020-02-26

    Applicant: General Electric Company

    Inventor： Yizhen Lin ,  Marco Francesco Aimi ,  Alessandro Stuart Savoia

    IPC: B06B1/02 ,  B81B3/00 ,  B81C1/00

    Abstract: A method of forming a capacitive micromachined ultrasonic transducer (CMUT) device includes bonding a CMUT substrate to a silicon on insulator (SOI) substrate. The CMUT substrate has a first thickness and the SOI substrate includes a handle, a buried oxide layer, and a device layer. At least one of the CMUT substrate or the SOI substrate includes a patterned dielectric layer. The device layer is bonded to the patterned dielectric layer to form a plurality of sealed cavities and the device layer forms a diaphragm of the plurality of cavities. The method further includes reducing the first thickness of the CMUT substrate to a second thickness and forming a plurality of through-silicon vias from a second surface of the CMUT substrate opposite the first surface.

    Electromechanical system substrate attachment for reduced thermal deformation
    4.
    发明授权
    Electromechanical system substrate attachment for reduced thermal deformation 有权

    公开(公告)号：US09663347B2

    公开(公告)日：2017-05-30

    申请号：US14634981

    申请日：2015-03-02

    Applicant: General Electric Company

    Inventor： Marco Francesco Aimi ,  Yizhen Lin

    IPC: H01H57/00 ,  B81B3/00 ,  H01H59/00 ,  H01H1/00

    CPC classification number: B81B3/0059 ,  B81B3/0072 ,  B81B2203/053 ,  H01H59/0009 ,  H01H2001/0084

    Abstract: A MEMS switch includes a substrate and a switch structure formed on the substrate, with the switch structure further including a conductive contact formed on the substrate, a self-compensating anchor structure coupled to the substrate, and a beam comprising a first end and a second end, the beam integrated with the self-compensating anchor structure at the first end and extending out orthogonally from the self-compensating anchor structure and suspended over the substrate such that the second end comprises a cantilevered portion positioned above the conductive contact. The cantilevered portion of the beam undergoes deformation during periods of strain mismatch between the substrate and the switch structure so as to have a takeoff angle relative to the substrate, and the self-compensating anchor structure directs a portion of the strain mismatch orthogonally to the cantilevered portion so as to warp the anchor and compensate for the takeoff angle of the cantilevered portion.

    ELECTROMECHANICAL SYSTEM SUBSTRATE ATTACHMENT FOR REDUCED THERMAL DEFORMATION
    5.
    发明申请
    ELECTROMECHANICAL SYSTEM SUBSTRATE ATTACHMENT FOR REDUCED THERMAL DEFORMATION 有权
    电子系统底板附着减少热变形

    公开(公告)号：US20160257558A1

    公开(公告)日：2016-09-08

    申请号：US14634981

    申请日：2015-03-02

    Applicant: GENERAL ELECTRIC COMPANY

    Inventor： Marco Francesco Aimi ,  Yizhen Lin

    IPC: B81B3/00 ,  H01H59/00

    CPC classification number: B81B3/0059 ,  B81B3/0072 ,  B81B2203/053 ,  H01H59/0009 ,  H01H2001/0084

    Abstract: A MEMS switch includes a substrate and a switch structure formed on the substrate, with the switch structure further including a conductive contact formed on the substrate, a self-compensating anchor structure coupled to the substrate, and a beam comprising a first end and a second end, the beam integrated with the self-compensating anchor structure at the first end and extending out orthogonally from the self-compensating anchor structure and suspended over the substrate such that the second end comprises a cantilevered portion positioned above the conductive contact. The cantilevered portion of the beam undergoes deformation during periods of strain mismatch between the substrate and the switch structure so as to have a takeoff angle relative to the substrate, and the self-compensating anchor structure directs a portion of the strain mismatch orthogonally to the cantilevered portion so as to warp the anchor and compensate for the takeoff angle of the cantilevered portion.

    Abstract translation: MEMS开关包括衬底和形成在衬底上的开关结构，开关结构还包括形成在衬底上的导电接触，耦合到衬底的自补偿锚结构，以及包括第一端和第二端的梁 所述梁与第一端处的自补偿锚结构一体化并且从自补偿锚结构垂直延伸并悬挂在基板上，使得第二端包括位于导电触头上方的悬臂部分。 梁的悬臂部分在基片和开关结构之间的应变不匹配期间经历变形，以便相对于基片具有起飞角，并且自补偿锚固结构将应变失配的一部分正交地与悬臂 以便使锚固件弯曲并补偿悬臂部分的起飞角度。

    SENSING ELEMENT AND RELATED METHODS
    6.
    发明申请
    SENSING ELEMENT AND RELATED METHODS 有权

    公开(公告)号：US20250076135A1

    公开(公告)日：2025-03-06

    申请号：US18953254

    申请日：2024-11-20

    Applicant: General Electric Company

    Inventor： Robert James MacDonald ,  Yizhen Lin ,  Nicholas G. Yost ,  David Richard Esler

    IPC: G01L5/173 ,  B81B7/00 ,  B81C1/00

    Abstract: An apparatus includes a first acoustic sensing resonator formed from a silicon substrate and has a first microelectromechanical system. The apparatus also includes a second acoustic sensing resonator formed from the silicon substrate and has a second microelectromechanical system. The second acoustic sensing resonator is arranged on the silicon substrate at a ninety degree (90°) angle with respect to the first acoustic sensing resonator and together the first acoustic sensing resonator and second acoustic sensing resonator form a torque sensor. A high temperature bonding surface is connected to the torque sensor for directly connecting the torque sensor to a metal object.

    INERTIAL SENSING SYSTEMS AND METHODS OF MANUFACTURING THE SAME
    8.
    发明申请
    INERTIAL SENSING SYSTEMS AND METHODS OF MANUFACTURING THE SAME 审中-公开
    惯性感测系统及其制造方法

    公开(公告)号：US20170067742A1

    公开(公告)日：2017-03-09

    申请号：US14931939

    申请日：2015-11-04

    Applicant: General Electric Company

    Inventor： Sergey Alexandrovich Zotov ,  Christopher Fred Keimel ,  Todd Frederick Miller ,  Yizhen Lin

    IPC: G01C19/5684

    CPC classification number: G01C19/5684 ,  G01P15/02 ,  G01P2015/0805

    Abstract: A gyroscope includes at least one anchor and a plurality of gyroscope spring elements coupled to the at least one anchor. The gyroscope also includes a plurality of concentric rings coupled to the plurality of gyroscope spring elements and configured to encircle the plurality of gyroscope spring elements. The gyroscope further includes an excitation/detection/tuning unit electrostatically coupled to the plurality of concentric rings.

    Abstract translation: 陀螺仪包括耦合到至少一个锚的至少一个锚和多个陀螺仪弹簧元件。 陀螺仪还包括耦合到多个陀螺仪弹簧元件的多个同心环，并被配置为环绕多个陀螺弹簧元件。 陀螺仪还包括静电耦合到多个同心环的激励/检测/调谐单元。

    Insertion apparatus including rigidizable body
    9.
    发明授权
    Insertion apparatus including rigidizable body 有权

    公开(公告)号：US10884232B1

    公开(公告)日：2021-01-05

    申请号：US16730002

    申请日：2019-12-30

    Applicant: General Electric Company

    Inventor： Deepak Trivedi ,  Charles Burton Theurer ,  Anil Raj Duggal ,  Hongyi Zhou ,  Radislav Alexandrovich Potyrailo ,  Yizhen Lin

    IPC: G02B23/24

    Abstract: An insertion apparatus includes an insertion end positionable within a cavity and configured to travel through the cavity, a steering end opposite the insertion end, and a body extending from the insertion end to the steering end and sized to fit within the cavity. The body includes a plurality of members flexibly coupled together and individually actuated. Each member of the plurality of members includes at least one actuator strand. At least one member of the plurality of members has a first configuration in which the at least one member of the plurality of members has a first stiffness and a second configuration in which the at least one member of the plurality of members has a second stiffness greater than the first stiffness. At least a portion of the body is flexible to facilitate travel of the body through the cavity when the at least one member of the plurality of members is in the first configuration. The at least a portion of the body is configured to maintain a selected shape when the at least one member of the plurality of members is in the second configuration.

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