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公开(公告)号：US20240140852A1
公开(公告)日：2024-05-02
申请号：US18403845
申请日：2024-01-04
申请人： CORNING INCORPORATED
IPC分类号： C03B27/012 , B32B17/10 , B60J1/00 , C03B27/016 , C03B27/04 , C03B27/044 , C03B27/048 , C03B27/052 , C03B29/12 , C03B29/16 , C03B35/24 , C03C3/11 , C03C21/00
CPC分类号： C03B27/012 , B32B17/10036 , B60J1/001 , C03B27/016 , C03B27/04 , C03B27/0404 , C03B27/0413 , C03B27/044 , C03B27/048 , C03B27/052 , C03B27/0526 , C03B29/12 , C03B29/16 , C03B35/24 , C03C3/11 , C03C21/002 , Y10T428/315
摘要： A strengthened cover glass or glass-ceramic sheet or article as well as processes and systems for making the strengthened glass or glass-ceramic sheet or article is provided for use in consumer electronic devices. The process comprises cooling the cover glass sheet by non-contact thermal conduction for sufficiently long to fix a surface compression and central tension of the sheet. The process results in thermally strengthened cover glass sheets for use in or on consumer electronic products.
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公开(公告)号：US20220371935A1
公开(公告)日：2022-11-24
申请号：US17770869
申请日：2020-10-08
申请人： Corning Incorporated
IPC分类号： C03B23/03 , C03B23/035
摘要： Various embodiments disclosed include a method of bending a glass laminate structure, the method can optionally include any one or any combination of: heating the glass laminate structure comprising at least a first ply substrate and a second ply substrate, wherein the first ply substrate has a first composition and a first thickness that differ from a second composition and a second thickness of the second ply substrate; engaging an edge portion of one or both of a first major surface and a second major surface of the glass laminate structure; and sequent to engaging the edge portion, pressing the glass laminate structure to bend the glass laminate structure and obtain a desired curvature of the glass laminate structure along one or both of the first major surface and the second major surface.
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公开(公告)号：US20220073408A1
公开(公告)日：2022-03-10
申请号：US17411148
申请日：2021-08-25
申请人： CORNING INCORPORATED
发明人： Steven Joseph Gregorski , Kenneth Spencer Morgan , Richard Alan Quinn , Bradley Kent Shepard , John Christopher Thomas , David Andrew Tucker
IPC分类号： C03B37/03 , C03B37/027 , B29D11/00 , C03B37/025
摘要： A method of manufacturing an optical fiber, the method including drawing a bare optical fiber from an optical fiber preform along a draw pathway. The method further includes during the drawing step, moving a first fluid bearing from a first position to a second position, the first position being removed from the draw pathway and the second position being disposed in the draw pathway such that the movement of the first fluid bearing to the second position causes at least a first portion of the draw pathway to change direction.
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公开(公告)号：US20210347672A1
公开(公告)日：2021-11-11
申请号：US17380461
申请日：2021-07-20
申请人： CORNING INCORPORATED
IPC分类号： C03B27/012 , C03B27/04 , C03B27/016 , C03B27/052 , C03B35/24 , C03B29/12 , C03B29/16 , B32B17/10 , B60J1/00 , C03B27/048 , C03B27/044 , C03C21/00 , C03C3/11
摘要： A strengthened cover glass or glass-ceramic sheet or article as well as processes and systems for making the strengthened glass or glass-ceramic sheet or article is provided for use in consumer electronic devices. The process comprises cooling the cover glass sheet by non-contact thermal conduction for sufficiently long to fix a surface compression and central tension of the sheet. The process results in thermally strengthened cover glass sheets for use in or on consumer electronic products.
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公开(公告)号：US10086584B2
公开(公告)日：2018-10-02
申请号：US14047506
申请日：2013-10-07
申请人： Corning Incorporated
发明人： Robert Alan Bellman , Dana Craig Bookbinder , Robert George Manley , Prantik Mazumder , Theresa Chang , Jeffrey John Domey , Darwin Gene Enicks , Vasudha Ravichandran , Alan Thomas Stephens, II , John Christopher Thomas
摘要： Surface modification layers and associated heat treatments, that may be provided on a sheet, a carrier, or both, to control both room-temperature van der Waals (and/or hydrogen) bonding and high temperature covalent bonding between the thin sheet and carrier. The room-temperature bonding is controlled so as to be sufficient to hold the thin sheet and carrier together during vacuum processing, wet processing, and/or ultrasonic cleaning processing, for example. And at the same time, the high temperature covalent bonding is controlled so as to prevent a permanent bond between the thin sheet and carrier during high temperature processing, as well as maintain a sufficient bond to prevent delamination during high temperature processing.
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公开(公告)号：US09975801B2
公开(公告)日：2018-05-22
申请号：US14814319
申请日：2015-07-30
申请人： Corning Incorporated
IPC分类号： C03B27/012 , C03B27/04 , C03B27/016 , C03B27/052 , C03B27/048 , C03B27/044 , C03C21/00 , C03B35/24 , C03C3/11 , C03B29/12 , C03B29/16
CPC分类号： C03B27/012 , C03B27/016 , C03B27/04 , C03B27/0404 , C03B27/0413 , C03B27/044 , C03B27/048 , C03B27/052 , C03B27/0526 , C03B29/12 , C03B29/16 , C03B35/24 , C03C3/11 , C03C21/002 , Y10T428/315
摘要： A strengthened glass sheet product along with a process and an apparatus for strengthening a glass sheet are provided. The process comprises cooling the glass sheet by non-contact thermal conduction for sufficiently long to fix a surface compression and central tension of the sheet. The process results in thermally strengthened glass sheets having improved breakage properties.
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公开(公告)号：US09776905B2
公开(公告)日：2017-10-03
申请号：US14814274
申请日：2015-07-30
申请人： Corning Incorporated
IPC分类号： C03B27/012 , C03B27/04 , C03B27/016 , C03B27/052 , C03B27/048 , C03B27/044 , C03C21/00 , C03B35/24 , C03C3/11 , C03B29/12 , C03B29/16
CPC分类号： C03B27/012 , C03B27/016 , C03B27/04 , C03B27/0404 , C03B27/0413 , C03B27/044 , C03B27/048 , C03B27/052 , C03B27/0526 , C03B29/12 , C03B29/16 , C03B35/24 , C03C3/11 , C03C21/002 , Y10T428/315
摘要： A strengthened glass sheet product as well as process and an apparatus for producing the product. The process comprises cooling the glass sheet by non-contact thermal conduction for sufficiently long to fix a surface compression and central tension of the sheet. The process results in thermally strengthened glass sheets having improved breakage properties.
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公开(公告)号：US09758876B2
公开(公告)日：2017-09-12
申请号：US14092536
申请日：2013-11-27
申请人： Corning Incorporated
发明人： Aric Bruce Shorey , Garrett Andrew Piech , Xinghua Li , John Christopher Thomas , John Tyler Keech , Jeffrey John Domey , Paul John Shustack
IPC分类号： H01L21/302 , H01L21/461 , B23P15/00 , C03C25/00 , C23F1/00 , B44C1/22 , C03C15/00 , C23F4/04 , C03B33/10 , H05K3/00 , C03B33/02 , B23K26/18 , B23K26/0622 , B23K26/386 , B23K26/40 , B23K26/382 , B23K103/00
CPC分类号： C23F4/04 , B23K26/0622 , B23K26/18 , B23K26/386 , B23K26/389 , B23K26/40 , B23K2103/50 , B23K2103/54 , C03B33/0222 , C03B33/102 , H05K3/0026 , Y10T428/24322
摘要： A method for forming a plurality of precision holes in a substrate by drilling, including affixing a sacrificial cover layer to a surface of the substrate, positioning a laser beam in a predetermined location relative to the substrate and corresponding to a desired location of one of the plurality of precision holes, forming a through hole in the sacrificial cover layer by repeatedly pulsing a laser beam at the predetermined location, and pulsing the laser beam into the through hole formed in the sacrificial cover layer. A work piece having precision holes including a substrate having the precision holes formed therein, wherein a longitudinal axis of each precision hole extends in a thickness direction of the substrate, and a sacrificial cover layer detachably affixed to a surface of the substrate, such that the sacrificial cover layer reduces irregularities of the precision holes.
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公开(公告)号：US20170240453A1
公开(公告)日：2017-08-24
申请号：US15521795
申请日：2015-11-06
申请人： CORNING INCORPORATED
IPC分类号： C03B23/00 , C03B23/023 , C03B23/025
CPC分类号： C03B23/0086 , C03B23/0235 , C03B23/0258 , C03B29/025 , C03B29/08
摘要： Disclosed herein are systems for shaping glass structures, comprising a shaping mold; a magnetic field generator; and a susceptor plate positioned substantially between the shaping mold and the magnetic field generator. Also disclosed herein are systems for shaping a glass structures, comprising a magnetic field generator comprising at least one induction coil and a one power supply connected to the at least one induction coil; and a susceptor plate having a first surface proximate the at least one induction coil and an opposing second surface proximate the glass structure. Further disclosed herein are methods for heating glass structures, comprising positioning the glass structure on a shaping mold; introducing the shaping mold and glass structure into a furnace; and indirectly heating at least a portion of the glass structure using at least one induction heating source.
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公开(公告)号：US11891324B2
公开(公告)日：2024-02-06
申请号：US17380461
申请日：2021-07-20
申请人： CORNING INCORPORATED
IPC分类号： C03B27/012 , B32B17/10 , B60J1/00 , C03B27/016 , C03B27/04 , C03B27/044 , C03B27/048 , C03B27/052 , C03B29/12 , C03B29/06 , C03B35/24 , C03C21/00 , C03C3/11 , C03B29/16
CPC分类号： C03B27/012 , B32B17/10036 , B60J1/001 , C03B27/016 , C03B27/04 , C03B27/0404 , C03B27/044 , C03B27/048 , C03B27/0413 , C03B27/052 , C03B27/0526 , C03B29/12 , C03B29/16 , C03B35/24 , C03C3/11 , C03C21/002 , Y10T428/315
摘要： A strengthened cover glass or glass-ceramic sheet or article as well as processes and systems for making the strengthened glass or glass-ceramic sheet or article is provided for use in consumer electronic devices. The process comprises cooling the cover glass sheet by non-contact thermal conduction for sufficiently long to fix a surface compression and central tension of the sheet. The process results in thermally strengthened cover glass sheets for use in or on consumer electronic products.
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