摘要:
Solid state light emitter devices and methods are provided. A solid state light emitter device can include a submount having an upper surface and a bottom surface. At least first pair and a second pair of electrically conductive contacts can be disposed on the bottom surface of the submount. The first pair of contacts can be electrically independent from the second pair of contacts. The device can further include multiple light emitters provided on the upper surface of the submount. The multiple light emitters can be configured into at least a first light emitter zone that is electrically independent from a second light emitter zone upon electrical communication to a respective pair of contacts.
摘要:
Embodiments of the present invention are generally related to LED chips having improved overall emission by reducing the light-absorbing effects of barrier layers adjacent mirror contacts. In one embodiment, a LED chip comprises one or more LEDs, with each LED having an active region, a first contact under the active region having a highly reflective mirror, and a barrier layer adjacent the mirror. The barrier layer is smaller than the mirror, such that it does not extend beyond the periphery of the mirror. In another possible embodiment, an insulator is further provided, with the insulator adjacent the barrier layer and adjacent portions of the mirror not contacted by the active region or by the barrier layer. In yet another embodiment, a second contact is provided on the active region. In a further embodiment, the barrier layer is smaller than the mirror such that the periphery of the mirror is at least 40% free of the barrier layer, and the second contact is below the first contact and accessible from the bottom of the chip.
摘要:
A light emitting device includes an epitaxial region, an insulating layer on the epitaxial region, a bond pad on the insulating layer, and a crack reducing feature in the insulating layer. The crack reducing feature is configured to reduce the propagation of cracks in the insulating layer to an outside surface of the insulating layer. Related methods are also disclosed.
摘要:
Solid state light emitting apparatuses include blue LEDs (including but not limited to a combination of short wavelength and long wavelength blue LEDs) to stimulate green lumiphors, with supplemental emissions by either red lumiphors and/or red solid state light emitters, to provide aggregate emissions with high S/P ratio (e.g., at least 1.95) and favorably high color rendering values (e.g., 85 or greater), preferably in combination with high brightness and high luminous efficacy. In certain embodiments, a solid state light emitting apparatus may be devoid of a LED having a peak wavelength of from 470-599 nm and/or devoid of lumiphors peak wavelengths in the yellow range. Multiple LEDs may be arranged in an emitter package.
摘要:
Solid state light emitter devices and methods are provided. A solid state light emitter device can include a submount having an upper surface and a bottom surface. At least first pair and a second pair of electrically conductive contacts can be disposed on the bottom surface of the submount. The first pair of contacts can be electrically independent from the second pair of contacts. The device can further include multiple light emitters provided on the upper surface of the submount. The multiple light emitters can be configured into at least a first light emitter zone that is electrically independent from a second light emitter zone upon electrical communication to a respective pair of contacts.
摘要:
Light emitter packages, systems, and methods having improved performance are disclosed. In one aspect, a light emitter package can include a submount that can include an anode and a cathode. A first light emitter chip can mounted over at least a portion of the cathode, and a second light emitter chip can be wirebonded to at least a portion of the anode. Multiple light emitter chips can be disposed between the first and second light emitter chips.
摘要:
A light emitting device includes an epitaxial region, an insulating layer on the epitaxial region, a bond pad on the insulating layer, and a crack reducing feature in the insulating layer. The crack reducing feature is configured to reduce the propagation of cracks in the insulating layer to an outside surface of the insulating layer. Related methods are also disclosed.
摘要:
Solid state light emitting apparatuses include blue LEDs (e.g., including short wavelength and long wavelength blue LEDs in combination) to stimulate green lumiphors, with supplemental emissions by red lumiphors and/or red solid state light emitters, to provide aggregate emissions with high S/P ratio (e.g., ≧1.95) and high color rendering values (e.g., ≧85), preferably in combination with high brightness and high luminous efficacy. In certain embodiments, a light emitting apparatus may be devoid of a LED having a peak wavelength of from 470-599 nm and/or devoid of lumiphors with peak wavelengths in the yellow range. Multiple LEDs may be arranged in an emitter package. A fabrication method includes mounting multiple solid state emitters (e.g., with a first blue and a second red emitter) to a common substrate, applying a stencil or mask over the second emitter, applying a lumiphoric material over the first emitter, and removing the stencil or mask.