公开(公告)号：US20250169326A1

公开(公告)日：2025-05-22

申请号：US18949389

申请日：2024-11-15

Applicant: Applied Materials, Inc.

Inventor： Chung-chia CHEN ,  Jungmin LEE ,  Yu-Hsin LIN ,  Ji Young CHOUNG ,  Wen-Hao WU

IPC: H10K59/60 ,  H10K59/12 ,  H10K59/70 ,  H10K65/00 ,  H10K102/10

Abstract: Embodiments described herein relate to sub-pixel circuits, displays including sub-pixel circuits, and a method of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. Some configurations of the displays described herein include a backplane and a plurality of sub-pixel circuits separated by adjacent overhang structures disposed over the backplane. The at least one sub-pixel circuit has sub-pixels surrounded by adjacent overhang structures. The sub-pixel circuit includes one or more organic light-emitting diode (OLED) sub-pixels and an organic photodiode (OPD) sub-pixel. The OLED sub-pixels include a transistor disposed in the backplane, an electrode disposed over the transistor, an OLED material disposed over the electrode. The electrode is connected to the transistor of the backplane. The OPD sub-pixel includes an electrode and an organic photodiode (OPD) material disposed over the electrode.

公开(公告)号：US20230172033A1

公开(公告)日：2023-06-01

申请号：US17801818

申请日：2021-02-02

Applicant: Applied Materials, Inc.

Inventor： Wen-Hao WU ,  Jrjyan Jerry CHEN

IPC: H10K59/80 ,  H10K59/65

CPC classification number: H10K59/873 ,  H10K59/65

Abstract: A method and apparatus for forming an encapsulation layer on an organic light emitting diode (OLED) patterned substrate are described. A sidewall planarization layer fills voids in a scalloped sidewall of a wall feature on the OLED patterned substrate. The sidewall planarization layer is cured in the same chamber as the deposition of the sidewall planarization layer. A barrier layer is formed on the sidewall planarization layer. The sidewall planarization layer provides a planarized surface for good adhesion of the barrier layer over the sidewall planarization layer which minimizes the possibility of defects to the OLED patterned substrate from moisture of oxygen penetrating the OLED patterned substrate.

公开(公告)号：US20250113718A1

公开(公告)日：2025-04-03

申请号：US18907141

申请日：2024-10-04

Applicant: Applied Materials, Inc.

Inventor： Wenhui LI ,  Kevin CHEN ,  Wen-Hao WU ,  Yu-Min WANG ,  Zongkai WU ,  Kwang Soo HUH ,  Lai ZHAO

IPC: H10K59/80 ,  C23C16/34 ,  C23C16/455 ,  C23C16/50

Abstract: Embodiments described herein relate to an optical device and methods of forming an optical device. The optical device includes a substrate, an illumination source, a capping layer, an encapsulation layer, and a passivation layer. The encapsulation layer includes a first atomic layer deposition (ALD) layer, a chemical vapor deposition (CVD) layer, and a second ALD layer. The method includes disposing a capping layer over an illumination layer, the illumination layer disposed over a substrate in a processing chamber; disposing a first atomic layer deposition (ALD) layer over the capping layer; disposing a chemical vapor deposition (CVD) layer over the first ALD layer; disposing a second ALD layer over the CVD layer; and disposing a passivation layer over the second ALD layer.

公开(公告)号：US20230263014A1

公开(公告)日：2023-08-17

申请号：US18183822

申请日：2023-03-14

Applicant: Applied Materials, Inc.

Inventor： Yu-hsin LIN ,  Ji Young CHOUNG ,  Chung-chia CHEN ,  Jungmin LEE ,  Wen-Hao WU ,  Takashi ANJIKI ,  Takuji KATO ,  Dieter HAAS ,  Si Kyoung KIM ,  Stefan KELLER

IPC: H10K59/122 ,  H10K59/173

CPC classification number: H10K59/122 ,  H10K59/173 ,  H10K71/16

Abstract: Embodiments described herein relate to a device including a substrate, a plurality of adjacent pixel-defining layer (PDL) structures disposed over the substrate, and a plurality of sub-pixels. Each sub-pixel includes adjacent first overhangs, adjacent second overhangs, an anode, a hole injection layer (HIL) material, an additional organic light emitting diode (OLED) material, and a cathode. Each first overhang is defined by a body structure disposed on and extending laterally past a base structure disposed on the PDL structure. Each second overhang is defined by a top structure disposed on and extending laterally past the body structure. The HIL material is disposed over and in contact with the anode and disposed under the adjacent first overhangs. The additional OLED material is disposed on the HIL material and extends under the first overhang.

公开(公告)号：US20200227689A1

公开(公告)日：2020-07-16

申请号：US16248526

申请日：2019-01-15

Applicant: Applied Materials, Inc.

Inventor： Wen-Hao WU ,  Jrjyan Jerry CHEN

IPC: H01L51/56 ,  H01L51/52 ,  H01L51/00

Abstract: Embodiments of the present disclosure generally relate to methods for forming an organic light emitting diode (OLED) device. Forming the OLED device comprises depositing a first barrier layer on a substrate having an OLED structure disposed thereon. A first sublayer of a buffer layer is then deposited on the first barrier layer. The first sublayer of the buffer layer is cured with a mixed gas plasma. Curing the first sublayer comprises generating water from the mixed gas plasma in a process chamber in which the curing occurs. The deposition of the first sublayer and the curing of the first sublayer is repeated one or more times to form a completed buffer layer. A second barrier layer is then deposited on the completed buffer layer.

公开(公告)号：US20250107353A1

公开(公告)日：2025-03-27

申请号：US18977548

申请日：2024-12-11

Applicant: Applied Materials, Inc.

Inventor： Chung-Chia CHEN ,  Ji Young CHOUNG ,  Dieter HAAS ,  Yu-Hsin LIN ,  Jungmin LEE ,  Wen-Hao WU ,  Si Kyoung KIM

IPC: H10K59/122 ,  H10K59/173 ,  H10K59/80

Abstract: Sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. In one example, a device includes a substrate, pixel-defining layer (PDL) structures disposed over the substrate and defining sub-pixels of the device, and a plurality of overhang structures. The first sub-pixel includes a first anode, OLED material, a first cathode, and a first encapsulation layer having a gap defined by a first portion of the first encapsulation layer disposed over the first cathode, a second portion of the first encapsulation layer disposed over a sidewall of the body structure, and a third portion of the first encapsulation layer under an underside surface of the top extension of the top structure, the first portion of the first encapsulation layer contacting the third portion of the first encapsulation layer.

公开(公告)号：US20240147825A1

公开(公告)日：2024-05-02

申请号：US17974385

申请日：2022-10-26

Applicant: Applied Materials, Inc.

Inventor： Chung-chia CHEN ,  Yu-Hsin LIN ,  Ji Young CHOUNG ,  Jungmin LEE ,  Wen-Hao WU ,  Dieter HAAS

IPC: H01L51/56 ,  H01L27/32 ,  H01L51/52

CPC classification number: H01L51/56 ,  H01L27/3246 ,  H01L51/5253 ,  H01L2227/323 ,  H01L2251/5315

Abstract: Examples disclosed herein relate to device. The device includes a substrate, a plurality of adjacent pixel-defining layer (PDL structures disposed over the substrate, and a plurality of sub-pixels. The PDL structure have a top surface coupled to adjacent sidewalls of the PDL structure. The plurality of sub-pixels are defined by the PDL structures. Each sub-pixel includes an anode, an organic light emitting diode (OLED), a cathode, and an encapsulation layer. The organic light emitting diode (OLED) material disposed over the anode. The OLED material extends over the top surface of the PDL structure past the adjacent sidewalls. The cathode is disposed over the OLED material. The cathode extends over the top surface of the PDL structure past the adjacent sidewalls. The encapsulation layer is disposed over the cathode. The encapsulation layer has a first sidewall and a second sidewall.

公开(公告)号：US20240040831A1

公开(公告)日：2024-02-01

申请号：US18363574

申请日：2023-08-01

Applicant: Applied Materials, Inc.

Inventor： Chung-chia CHEN ,  Jungmin LEE ,  Yu-hsin LIN ,  Ji Young CHOUNG ,  Wen-Hao WU ,  Dieter HAAS ,  Si Kyoung KIM

IPC: H10K59/121 ,  H10K59/65 ,  H10K59/12

CPC classification number: H10K59/121 ,  H10K59/65 ,  H10K59/1201

Abstract: Embodiments described herein relate to sub-pixel circuits, displays including sub-pixel circuits, and a method of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. Some configurations of the displays described herein, include the sub-pixel circuits and at least one sensor opening adjacent to the overhang structure and an adjacent sub-pixel circuit. The at least one sensor opening includes a sensor disposed thereunder. Other configurations displays described herein, include sub-pixel circuits including OLED sub-pixels and a transparent sub-pixel such that a sensor is disposed thereunder. The configurations described herein utilize sensors that are integrated to increase the transmittance of the display while eliminating the need for bezels and reducing dead zones in the display.

公开(公告)号：US20230255064A1

公开(公告)日：2023-08-10

申请号：US18301805

申请日：2023-04-17

Applicant: Applied Materials, Inc.

Inventor： Chung-chia CHEN ,  Ji Young CHOUNG ,  Dieter HAAS ,  Yu-hsin LIN ,  Jungmin LEE ,  Wen-Hao WU ,  Si Kyoung KIM

IPC: H10K59/122 ,  H10K50/844 ,  H10K71/00

CPC classification number: H10K59/122 ,  H10K50/844 ,  H10K71/00 ,  H10K2102/00

Abstract: Embodiments described herein relate to a device comprising a substrate, a pixel-defining layer (PDL) structures disposed over the substrate and defining sub-pixels of the device, and a plurality overhang structures. Each overhang structure is defined by a top structure extending laterally past a body structure. Each body structure is disposed over an upper surface of each PDL structure. Overhang structures define a plurality of sub-pixels including a first sub-pixel and a second sub-pixel. Each sub-pixel includes an anode, an organic light-emitting diode (OLED) material, a cathode, and an encapsulation layer. The OLED materials are disposed over the first anode and extends under the overhang structures. The cathodes are disposed over the OLED materials and under the overhang structures. The encapsulation layers are disposed over the first cathode. The first encapsulation layer has a first thickness and the second encapsulation layer has a second thickness different from the first thickness.

公开(公告)号：US20230041252A1

公开(公告)日：2023-02-09

申请号：US17881358

申请日：2022-08-04

Applicant: Applied Materials, Inc.

Inventor： Chung-Chia CHEN ,  Ji Young CHOUNG ,  Dieter HAAS ,  Yu-hsin LIN ,  Jungmin LEE ,  Wen-Hao WU ,  Si Kyoung KIM

IPC: H01L27/32 ,  H01L51/52 ,  H01L51/56

Abstract: Embodiments described herein relate to a device comprising a substrate, a pixel-defining layer (PDL) structures disposed over the substrate and defining sub-pixels of the device, and a plurality overhang structures. Each overhang structure is defined by a top structure extending laterally past a body structure. Each body structure is disposed over an upper surface of each PDL structure. Overhang structures define a plurality of sub-pixels including a first sub-pixel and a second sub-pixel. Each sub-pixel includes an anode, an organic light-emitting diode (OLED) material, a cathode, and an encapsulation layer. The OLED materials are disposed over the first anode and extends under the overhang structures. The cathodes are disposed over the OLED materials and under the overhang structures. The encapsulation layers are disposed over the first cathode. The first encapsulation layer has a first thickness and the second encapsulation layer has a second thickness different from the first thickness.