公开(公告)号：US20240391056A1

公开(公告)日：2024-11-28

申请号：US18322928

申请日：2023-05-24

Applicant: Applied Materials, Inc.

Inventor： Nai-Chieh HUANG ,  Jianshe TANG ,  Shih-Haur SHEN ,  Akshay ARAVINDAN ,  Chih-Han YANG ,  Jay GURUSAMY ,  Jeonghoon OH ,  Steven M. ZUNIGA

IPC: B24B53/017

Abstract: Embodiments of the disclosure provided for a pad conditioner with multiple disks for chemical mechanical polishing. The pad conditioner includes a bearing ring connected to a lower portion of a shaft, an outer disk assembly connected to the lower portion of the shaft, the outer disk assembly, an outer disk flexure, a plurality of outer disks disposed on a bottom surface of the outer disk, and an inner disk assembly. Alternatively, the outer disk assembly includes a plurality of outer disk holders, an outer disk connector connecting the plurality of outer disk holders, and a plurality of outer disks disposed on a bottom surface of the outer disk holders. The inner disk assembly includes a flexure connected to the outer disk assembly, the inner disk assembly, and the shaft. The pad conditioner may include a spherical bearing assembly coupled to a lower portion of the shaft.

公开(公告)号：US20250153303A1

公开(公告)日：2025-05-15

申请号：US18510157

申请日：2023-11-15

Applicant: Applied Materials, Inc.

Inventor： Priscilla LAROSA ,  Shih-Haur SHEN ,  Jimin ZHANG ,  Haosheng WU ,  Jianshe TANG ,  Jonathan RAMOS

IPC: B24B37/015 ,  B24B37/013

Abstract: A method of processing a substrate, includes placing a front surface of a substrate disposed in a carrier head on a polishing surface of a pad. The method further includes delivering a first fluid onto the polishing surface using a first fluid delivery arm. The method further includes determining a location of a hot spot on the front surface. The method further includes determining a rotational orientation of the substrate relative to the carrier head. The method further includes treating the hot spot while polishing the front surface on the polishing surface using a second fluid delivery arm to deliver a second fluid to the polishing surface at a location that will intersect with the hot spot during polishing of the front surface of the substrate.

公开(公告)号：US20240359291A1

公开(公告)日：2024-10-31

申请号：US18139091

申请日：2023-04-25

Applicant: Applied Materials, Inc.

Inventor： Wei LU ,  Shih-Haur SHEN ,  David Maxwell GAGE ,  Jimin ZHANG ,  Taketo SEKINE ,  Haosheng WU ,  Kun XU ,  Jianshe TANG ,  Brian J. BROWN

IPC: B24B49/10 ,  B24B37/34

CPC classification number: B24B49/10 ,  B24B37/345 ,  H01L21/68

Abstract: A method of processing a substrate includes polishing a front surface of a substrate on a first pad coupled to a first platen. The method further includes transferring the substrate from the first pad to a second pad coupled to a second platen with a carrier head. The method further includes moving the carrier head to a scan position to place an edge of the substrate above an orientation sensor disposed at a rotational center of the second pad. The method further includes scanning the edge of the substrate with the orientation sensor to produce a signal. The method further includes analyzing the signal to locate a reference mark of the substrate to determine a rotational orientation of the substrate relative to the carrier head.