公开(公告)号：US20250153303A1

公开(公告)日：2025-05-15

申请号：US18510157

申请日：2023-11-15

Applicant: Applied Materials, Inc.

Inventor： Priscilla LAROSA ,  Shih-Haur SHEN ,  Jimin ZHANG ,  Haosheng WU ,  Jianshe TANG ,  Jonathan RAMOS

IPC: B24B37/015 ,  B24B37/013

Abstract: A method of processing a substrate, includes placing a front surface of a substrate disposed in a carrier head on a polishing surface of a pad. The method further includes delivering a first fluid onto the polishing surface using a first fluid delivery arm. The method further includes determining a location of a hot spot on the front surface. The method further includes determining a rotational orientation of the substrate relative to the carrier head. The method further includes treating the hot spot while polishing the front surface on the polishing surface using a second fluid delivery arm to deliver a second fluid to the polishing surface at a location that will intersect with the hot spot during polishing of the front surface of the substrate.